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NXP Semiconductors MF3DH8300DA8/00J
- Part No.:
- MF3DH8300DA8/00J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA8, Smart Card Module
- Datasheet:
-
MF3DH8300DA8/00J.pdf
- Description:
- MF3DH8300DA8
- Quantity:
- Payment:
- Shipping:
Inventory:3,987
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Product details
Overview
MF3DH8300DA8/00J from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 kB non-volatile memory, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of transit cards, e-ID documents, and micro-payment systems requiring high integrity and privacy protection.
For engineers reviewing the MF3DH8300DA8/00J datasheet, MF3DH8300DA8/00J pinout, MF3DH8300DA8/00J application, or MF3DH8300DA8/00J equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for small-form-factor antennas, EV3-specific features like Transaction Timer and Proximity Check, and backward compatibility with MIFARE DESFire EV2/EV1 infrastructure.
Technical Context
The MF3DH8300DA8/00J implements a dual-layer security architecture: hardware-accelerated AES-128 and 3DES crypto engines plus on-chip sensors (voltage, temperature, light, glitch) for tamper detection. Its file system supports up to 32 files per application across unlimited applications, with six file types including Transaction MAC and automatic anti-tear protection.
It operates at 13.56 MHz with configurable frame size (up to 256 bytes), supports ISO/IEC 7816-4 APDU commands, and enables secure messaging via EV2/EV3 protocols - including Secure Dynamic Messaging (SDM) mirrored into NDEF for NFC Forum Type 4 Tag compliance (Cert. ID 58652).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 8 kB NV memory - sufficient for multiple complex applications such as transport + loyalty + access control on one card |
| Input capacitance | 70 pF - enables reliable coupling with compact, low-inductance antennas in thin cards or wearables |
| Security certification | Common Criteria EAL5+ (HW & SW) - meets banking-grade and e-passport security requirements |
| Data transfer rate | Up to 848 kbit/s - reduces transaction time in high-throughput environments like metro gates |
| File types supported | 6 types (Standard Data, Backup Data, Value, Linear/Cyclic Record, Transaction MAC) - enables atomic transaction logging and balance management |
| Authentication protocol | Mutual three-pass authentication with AES-128 or 3DES - prevents cloning and man-in-the-middle attacks during session setup |
| Anti-tamper features | Hardware exception sensors (voltage, temperature, light, glitch) + active shielding - detects physical probing attempts |
Pinout & Package
MF3DH8300DA8/00J is supplied in MOA8 plastic leadless module carrier package (SOT500-4), designed for embedding into smart cards or inlays. It has no external pins - RF coupling occurs via integrated antenna interface terminals (LA/LB) compatible with standard ISO/IEC 14443A coil layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LA / LB | RF antenna interface | Differential input for 13.56 MHz carrier; supports 70 pF tuning for miniaturized antenna designs |
Key Features
| Feature | Design Value |
|---|---|
| Transaction Timer | Prevents Man-in-the-Middle delay attacks by enforcing timeout on powered card after legitimate reader disengagement |
| Proximity Check | Defends against relay attacks by measuring signal propagation delay between PCD and PICC |
| Originality Check | Verifies genuine NXP silicon using embedded hardware signature - blocks counterfeit ICs |
| MIsmartApp support | Enables delegated application management for third-party service providers without exposing master keys |
| Virtual Card Architecture | Allows multiple logical cards on one physical device with privacy-preserving selection and isolation |
| Secure Dynamic Messaging (SDM) | Generates dynamic NDEF text mirroring secure transaction data - interoperable with NFC readers and mobile wallets |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless fare payment at metro turnstiles and bus validators with offline balance updates. IC Role / Device Role / Timing Role: Secure storage and cryptographic processing of encrypted trip records, balance values, and session keys. Use Value: Enables fast (<150 ms) tap-and-go transactions with guaranteed data consistency via Transaction MAC and anti-tear mechanism. | Use Scenario: Single credential for public transport, bike sharing, parking payments, and municipal services. IC Role / Device Role / Timing Role: Multi-application container with isolated AID-based access control and shared file support across services. Use Value: Eliminates need for multiple cards while maintaining strict separation of service domains and backend reconciliation. |
| Secure Access Management | Micro-Payment & Loyalty |
Use Scenario: Physical access to office buildings, data centers, or restricted zones using encrypted credentials. IC Role / Device Role / Timing Role: Host for biometric template references, time-based access rules, and mutual authentication with readers. Use Value: Prevents credential cloning via Originality Check and enforces proximity validation to block relay attacks. | Use Scenario: Closed-loop e-wallet for campus cafeterias, retail loyalty points, and vending machines. IC Role / Device Role / Timing Role: Tamper-resistant value file with backup and cryptographic integrity checks for offline balance updates. Use Value: Supports offline transactions with guaranteed atomicity - no partial updates or balance corruption during power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3DH8300DA4/00 | Same 8 kB memory and 70 pF capacitance, but MOA4 (SOT500-2) package - smaller footprint, lower profile | Better suited for ultra-thin cards or embedded modules where height is constrained | Select when mechanical envelope limits thickness more than lateral space |
| MF3D8300DA8/00 | Same MOA8 (SOT500-4) package and 8 kB memory, but 17 pF input capacitance instead of 70 pF | Requires larger antenna geometry; less tolerant of miniaturized or flexible inlay designs | Select only when legacy antenna design is fixed and high-capacitance tuning is unnecessary |
Compared with MF3DH8300DA4/00 and MF3D8300DA8/00, the MF3DH8300DA8/00J uniquely balances high-input-capacitance RF performance with the MOA8 package's robust mounting and thermal characteristics - making it optimal for durable, field-deployed smart cards where both miniaturization and reliability are critical.
Availability
MF3DH8300DA8/00J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility credentials, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.
Supply support for MF3DH8300DA8/00J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets.
The MF3DH8300DA8/00J belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance contactless applications demanding EAL5+ certification, multi-service flexibility, and future-proof NFC interoperability.
FAQ
What security certifications does the MF3DH8300DA8/00J hold?
The MF3DH8300DA8/00J holds Common Criteria EAL5+ certification for both hardware and software, meeting the same security assurance level required for banking cards and electronic passports. This certification covers its cryptographic engines (AES-128, 3DES), secure messaging protocols, anti-tamper sensors, and file system integrity mechanisms - all validated under CC evaluation scope for MIFARE DESFire EV3.
How does the 70 pF input capacitance of MF3DH8300DA8/00J affect antenna design?
The 70 pF input capacitance of MF3DH8300DA8/00J allows direct matching with smaller, lower-inductance antennas - reducing required coil area by up to 40% compared to 17 pF variants. This enables thinner smart cards, wearable form factors, and flexible inlays without sacrificing read range or reliability, especially in metal-adjacent or space-constrained deployments.
Is MF3DH8300DA8/00J backward compatible with existing MIFARE DESFire EV2 infrastructure?
Yes, MF3DH8300DA8/00J operates in default delivery configuration as a MIFARE DESFire EV2 device, supporting all EV2 commands, file structures, and secure messaging modes. New EV3 features like Transaction Timer or Proximity Check require explicit activation via dedicated commands - ensuring seamless integration into legacy systems without reader firmware changes.
What file types does MF3DH8300DA8/00J support, and how are they used in practice?
MF3DH8300DA8/00J supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. In practice, Value files store reloadable balances with built-in overflow protection; Linear Record files log trip history; Transaction MAC files cryptographically sign each transaction for backend verification - all protected by atomic anti-tear logic to prevent data corruption during power loss.
Does MF3DH8300DA8/00J support NFC Forum Type 4 Tag functionality?
Yes, MF3DH8300DA8/00J is NFC Forum Type 4 Tag certified (Certificate ID 58652). It supports NDEF message mirroring via Secure Dynamic Messaging (SDM), enabling dynamic NDEF text generation that reflects real-time transaction data - allowing mobile phones and NFC readers to interpret card state without proprietary drivers or cloud dependencies.
MF3DH8300DA8/00J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA8, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Reader/Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, NFC
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH8300DA8/00J FAQ
1.How can I place an order for MF3DH8300DA8/00J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH8300DA8/00J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH8300DA8/00J reliable?
The price and inventory of MF3DH8300DA8/00J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH8300DA8/00J is usually 5 days.
3.What payment methods are accepted for MF3DH8300DA8/00J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH8300DA8/00J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH8300DA8/00J?
MF3DH8300DA8/00J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH8300DA8/00J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH8300DA8/00J?
For technical support, including MF3DH8300DA8/00J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH8300DA8/00J requirements.
6.How does Aetrix verify that MF3DH8300DA8/00J is sourced from the original manufacturer or authorized distributors?
All MF3DH8300DA8/00J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH8300DA8/00J meets industry standards.
7.What is the process for return or replacement of MF3DH8300DA8/00J?
All MF3DH8300DA8/00J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH8300DA8/00J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH8300DA8/00J part is unused and in its original packaging.
Return procedure for MF3DH8300DA8/00J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH8300DA8/00J Tags
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SL2S2602FTBX
NXP Semiconductors
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ST25DV04K-IER6S3
STMicroelectronics
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ST25DV04K-IER6C3
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NT3H2111W0FHKH
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M24LR04E-RMC6T/2
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ST25DV04KC-JF6D3
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ST25DV64KC-IE6S3
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ST25DV64K-IER6T3
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