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NXP Semiconductors MF3DH8301DUD/00Z
- Part No.:
- MF3DH8301DUD/00Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3DH8301DUD/00Z.pdf
- Description:
- MF3DH8301DUD
- Quantity:
- Payment:
- Shipping:
Inventory:1,473
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Product details
Overview
MF3DH8301DUD/00Z from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 kB non-volatile memory, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and multi-service smart city cards.
For engineers reviewing the MF3DH8301DUD/00Z datasheet, MF3DH8301DUD/00Z pinout, MF3DH8301DUD/00Z application, or MF3DH8301DUD/00Z equivalent, key selection considerations include its 70 pF high-input-capacitance variant for compact antenna designs, EV3-specific features (Transaction Timer, Proximity Check, Virtual Card Architecture), and backward compatibility with DESFire EV2/EV1 infrastructure.
Technical Context
The MF3DH8301DUD/00Z implements a dedicated contactless interface compliant with ISO/IEC 14443-2/3A and ISO/IEC 14443-4, supporting data rates up to 848 kbit/s and configurable frame size (FSCI) up to 256 bytes. Its analog front-end includes rectifier, modulator, demodulator, and voltage regulation circuitry optimized for 13.56 MHz RF field coupling.
Security architecture integrates hardware-accelerated AES-128 and 3DES engines, mutual three-pass authentication, Transaction MAC per application, and tamper-resistant sensors (glitch, light, temperature, voltage). It supports MIsmartApp for delegated application management and Secure Dynamic Messaging (SDM) mirrored into NDEF messages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 8 kB NV memory - sufficient for ≥20 applications with full file structures including Value, Linear Record, and Transaction MAC files. |
| Input capacitance | 70 pF - enables reliable operation with small-form-factor antennas and low-inductance coil designs in thin cards or wearables. |
| Security certification | Common Criteria EAL5+ (HW & SW) - meets banking-grade assurance requirements for e-passports and financial credentials. |
| Data transfer rate | Up to 848 kbit/s - reduces transaction time to <150 ms for full-value top-up or multi-application selection in transit systems. |
| Cryptographic engines | AES-128 and 3DES hardware acceleration - enables real-time encryption/CMAC generation without CPU overhead during RF communication. |
| File system | Up to 32 files per application across 6 types (including Transaction MAC) - supports complex service bundling (e.g., transport + loyalty + access) on one card. |
| Anti-tear mechanism | Transaction-oriented automatic backup with Transaction Timer - prevents Man-in-the-Middle attacks by enforcing session timeout after physical removal from reader. |
Pinout & Package
MF3DH8301DUD/00Z is supplied in FFC (Film Frame Carrier) wafer format - unsawn die on film frame, 120 μm thickness, intended for embedding into smart card laminates or inlays. No discrete pins or terminals; electrical interface is exclusively via integrated antenna coil coupling (ISO/IEC 14443A contactless interface).
Key Features
| Feature | Design Value |
|---|---|
| Proximity Check | Detects relay attacks by measuring RF field strength decay - blocks unauthorized remote access attempts before authentication begins. |
| Virtual Card Architecture (VCA) | Enables privacy-preserving card selection across multiple logical applications - prevents tracking of user behavior across services like transit and parking. |
| MIsmartApp support | Factory-loaded DAM keys allow third-party application providers to deploy and manage apps via NXP AppXplorer cloud - eliminates PICC owner dependency for service rollout. |
| Transaction Timer | Hardware-enforced session timeout prevents malicious extension of powered state post-removal - mitigates MitM attacks targeting incomplete transactions. |
| Shared application management | Allows two applications to be accessed simultaneously in one transaction - enables atomic operations such as deducting fare while updating loyalty points. |
Applications
| Secure Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless tap-in/tap-out for metro, bus, and tram networks with real-time balance updates and fare capping. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction engine handling AES-encrypted value files and linear record files for journey history. Use Value: Enables offline validation at gates using CMAC-verified transactions, reducing backend dependency and enabling sub-200 ms throughput per passenger. |
Use Scenario: Single-card access to integrated urban services including bike sharing, parking payments, museum entry, and citizen ID verification. IC Role / Device Role / Timing Role: Multi-application container with isolated AID-based file systems and shared application management for cross-service atomic transactions. Use Value: Eliminates need for separate cards or tokens per service - VCA and Originality Check ensure privacy and authenticity across heterogeneous readers. |
| Micro-Payment & Loyalty | Secure Access Management |
Use Scenario: Closed-loop e-wallet for cafés, vending machines, and retail kiosks with instant top-up and loyalty point accrual/redemption. IC Role / Device Role / Timing Role: Value file handler with automatic anti-tear backup and Transaction MAC generation for backend reconciliation. Use Value: Guarantees monetary integrity during power loss or reader disconnection - Transaction Timer ensures no open sessions persist beyond physical interaction. |
Use Scenario: Physical access control for office buildings, campuses, or data centers requiring role-based permissions and audit logging. IC Role / Device Role / Timing Role: Secure credential with mutual authentication, diversified keys per door group, and encrypted access logs stored in cyclic record files. Use Value: Prevents cloning via Originality Check and UID diversification - Proximity Check thwarts relay attacks at door readers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8301DUD/00 | Same 8 kB memory but 17 pF input capacitance - requires larger antenna area or higher Q-factor coil design. | Better suited for standard ISO/IEC 14443A cards with conventional antenna layouts; not optimized for ultra-thin or wearable form factors. | Select when antenna geometry permits lower capacitance and legacy reader compatibility is prioritized over miniaturization. |
| MF3DH9301DUD/01 | 16 kB NV memory and 70 pF input capacitance - doubles memory capacity while retaining same compact antenna compatibility. | Supports more complex multi-service deployments (e.g., national ID + health + payment) requiring >100 MB equivalent logical storage. | Choose when future-proofing for additional applications or extended file histories is required without changing antenna design. |
Compared with MF3DH8301DUD/00Z, MF3D8301DUD/00 trades antenna flexibility for broader reader interoperability, while MF3DH9301DUD/01 extends memory headroom within identical mechanical constraints - all three share identical EV3 firmware, security stack, and command set.
Availability
MF3DH8301DUD/00Z is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle support, and certified security compliance.
Supply support for MF3DH8301DUD/00Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in NFC, RFID, and secure element technologies.
The MF3DH8301DUD/00Z belongs to the MIFARE DESFire EV3 product line, engineered specifically for high-assurance, multi-application contactless smart cards deployed in transit, government ID, and secure commerce ecosystems.
FAQ
What security certifications does MF3DH8301DUD/00Z hold?
MF3DH8301DUD/00Z is certified to Common Criteria EAL5+ for both hardware and software, meeting the same assurance level required for banking cards and electronic passports. It implements mutual three-pass authentication, hardware AES-128 and 3DES engines, Transaction MAC, Proximity Check, and Originality Check - all validated under this certification scope.
How does the 70 pF input capacitance of MF3DH8301DUD/00Z affect antenna design?
The 70 pF input capacitance of MF3DH8301DUD/00Z allows integration into compact or low-inductance antenna geometries - such as thin smart cards, wearables, or metal-embedded tags - where standard 17 pF variants would require impractical coil sizes or tuning complexity. This enables robust operation at ≤100 mm read distance even with miniaturized antennas.
Is MF3DH8301DUD/00Z compatible with existing MIFARE DESFire EV2 infrastructure?
Yes, MF3DH8301DUD/00Z operates in default delivery configuration as a MIFARE DESFire EV2 device, supporting all EV2 commands and security modes. New EV3 features (e.g., Transaction Timer, Virtual Card Architecture) require explicit activation via dedicated commands - ensuring zero disruption to legacy readers and middleware.
What file types does MF3DH8301DUD/00Z support, and how are they used?
MF3DH8301DUD/00Z supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Value files store balances with atomic increment/decrement; Linear Record files log journeys; Transaction MAC files generate cryptographically signed proofs for backend reconciliation - all with built-in anti-tear protection.
Does MF3DH8301DUD/00Z support NFC Forum Type 4 Tag functionality?
Yes, MF3DH8301DUD/00Z is NFC Forum Type 4 Tag certified (Certificate ID 58652). It supports NDEF message mirroring via Secure Dynamic Messaging (SDM), enabling compatibility with standard NFC smartphones for service discovery, configuration, and dynamic content updates without proprietary reader infrastructure.
MF3DH8301DUD/00Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Reader
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443A
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
MF3DH8301DUD/00Z FAQ
1.How can I place an order for MF3DH8301DUD/00Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH8301DUD/00Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH8301DUD/00Z reliable?
The price and inventory of MF3DH8301DUD/00Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH8301DUD/00Z is usually 5 days.
3.What payment methods are accepted for MF3DH8301DUD/00Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH8301DUD/00Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH8301DUD/00Z?
MF3DH8301DUD/00Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH8301DUD/00Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH8301DUD/00Z?
For technical support, including MF3DH8301DUD/00Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH8301DUD/00Z requirements.
6.How does Aetrix verify that MF3DH8301DUD/00Z is sourced from the original manufacturer or authorized distributors?
All MF3DH8301DUD/00Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH8301DUD/00Z meets industry standards.
7.What is the process for return or replacement of MF3DH8301DUD/00Z?
All MF3DH8301DUD/00Z units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH8301DUD/00Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH8301DUD/00Z part is unused and in its original packaging.
Return procedure for MF3DH8301DUD/00Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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