NXP Semiconductors MF3DH9200DA4/02J
- Part No.:
- MF3DH9200DA4/02J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOA4, Smart Card Module
- Datasheet:
-
MF3DH9200DA4/02J.pdf
- Description:
- MF3DH9200DA4
- Quantity:
- Payment:

- Shipping:

Inventory:1,169
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MF3DH9200DA4/02J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 16 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3DH9200DA4/02J datasheet, MF3DH9200DA4/02J pinout, MF3DH9200DA4/02J application, or MF3DH9200DA4/02J equivalent, this page delivers verified technical context, exact memory and RF interface specs, real-world use-case mapping, and validated alternative options for secure NFC system design.
Technical Context
The MF3DH9200DA4/02J implements a fully ISO/IEC 14443-4–compliant RF interface with configurable FSCI supporting up to 256-byte frame size (for 16 KB variant), operates at 13.56 MHz, and delivers data rates up to 848 kbit/s. Its analog front-end includes integrated rectifier, modulator, and demodulator circuits optimized for high-efficiency energy harvesting from reader fields.
It embeds a dedicated 32-bit CPU with MMU, hardware accelerators for DES/AES/CMAC, TRNG, voltage/light/glitch/rail sensors, and active shielding - all coordinated by a secure operating system supporting mutual three-pass authentication, Transaction MAC files, and Virtual Card Architecture for privacy-preserving card selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 16 KB EEPROM - supports ≥100 applications with up to 32 files each; sufficient for full transit + loyalty + ID + parking profiles on one card. |
| Input capacitance | 70 pF (typ) - enables reliable operation in compact form factors (e.g., thin smart cards, wearables) where antenna coupling is constrained. |
| Cryptographic engine | AES-128 + 3DES (56/112/168-bit keys) - hardware-accelerated, CC EAL5+ certified for banking-grade transaction integrity and confidentiality. |
| Data retention | 25 years - ensures long-term validity of stored credentials without degradation in ambient conditions. |
| Write endurance | 500,000 cycles - supports daily top-ups, balance updates, and audit logging over multi-year service life. |
| RF interface standard | ISO/IEC 14443A Parts 1–4 - guarantees interoperability with global NFC infrastructure including Android HCE, ISO-compliant readers, and legacy MIFARE systems. |
| Security certification | Common Criteria EAL5+ (HW & SW) - validated assurance level matching electronic passports and EMV payment cards. |
Pinout & Package
MF3DH9200DA4/02J is supplied in MOB4 plastic leadless module carrier package (SOT500-2), designed for direct embedding into laminated smart cards or embedded modules. It has no external pins - RF coupling occurs via internal antenna connection pads (typically bonded to printed antenna traces).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ANT1 / ANT2 | RF antenna interface | Differential connection points for external loop antenna; matched to 70 pF input impedance for optimal power transfer at 13.56 MHz. |
| VSS | Ground reference | Common return path for analog/digital circuitry; requires low-inductance connection to antenna ground plane. |
| VDD (internal) | Power supply | No external VDD pin - powered entirely by RF field; internal voltage regulator delivers stable core voltage from harvested RF energy. |
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction logs on-card - provides tamper-evident proof for backend reconciliation without exposing raw data. |
| MIsmartApp (Delegated Application Management) | Enables third-party app providers to create, manage, and update applications independently - eliminates PICC owner dependency for service rollout. |
| Proximity Check | Detects relay attacks in real time using signal propagation timing - prevents unauthorized remote card emulation in access or payment scenarios. |
| Originality Check | Verifies genuine NXP silicon via on-chip challenge-response protocol - blocks counterfeit ICs in high-security deployments like national ID or transit authority systems. |
| Virtual Card Architecture | Supports multiple logical card instances with independent AIDs and privacy-preserving selection - essential for citizen services consolidating health, transport, and tax credentials. |
Applications
| Public Transport Ticketing | Multi-Service Smart City Card |
|---|---|
Use Scenario: Contactless fare validation across buses, trams, and metro lines with offline balance deduction and session-based audit trails. IC Role / Device Role / Timing Role: Secure transaction processor storing encrypted value files, executing mutual authentication, and generating Transaction MAC per ride. Use Value: Enables seamless cross-operator travel with zero network dependency during gate passage - validated by EAL5+ crypto and anti-tear backup. |
Use Scenario: Single credential used for bike sharing, municipal building access, library checkouts, and local merchant e-payments. IC Role / Device Role / Timing Role: Multi-application host managing isolated AID-based environments, enforcing distinct key sets and access policies per service domain. Use Value: Eliminates credential fragmentation while preserving data segregation - enabled by MIsmartApp delegation and Virtual Card Architecture. |
| Secure Access Control | Loyalty & Micro-Payment |
Use Scenario: Physical access to corporate campuses or government facilities requiring dynamic credential revocation and proximity-verified entry. IC Role / Device Role / Timing Role: Authentication endpoint performing Proximity Check and Originality Check before granting physical access permissions. Use Value: Prevents relay and cloning attacks - critical for high-assurance sites where credential theft poses operational risk. |
Use Scenario: Tap-to-pay at vending machines, cafés, and event venues with offline transaction logging and backend reconciliation. IC Role / Device Role / Timing Role: Offline value storage and cryptographic signing engine using Standard Data and Value files with Transaction MAC generation. Use Value: Supports high-throughput, low-latency payments without cloud connectivity - backed by 500k write cycles and 25-year data retention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D9200DA4/02 | Same MOB4/SOT500-2 package and 16 KB memory, but 17 pF input capacitance - optimized for larger antenna designs with higher coupling efficiency. | Limited to medium-to-large form factor cards; less suitable for ultra-thin or wearable implementations requiring 70 pF impedance matching. | Select MF3D9200DA4/02 when antenna geometry permits lower capacitance and cost sensitivity outweighs compactness requirements. |
| MF3DH4200DA4/02 | Identical 70 pF input capacitance and MOB4 package, but only 4 KB EEPROM - reduces memory headroom for complex multi-service deployments. | Suitable for single-purpose credentials (e.g., campus ID only) but insufficient for concurrent transit + payment + access workflows. | Choose MF3DH4200DA4/02 only for cost-constrained, low-complexity applications where memory expansion is not anticipated. |
Compared with MF3DH9200DA4/02J, MF3D9200DA4/02 trades compact antenna compatibility for broader reader interoperability, while MF3DH4200DA4/02 sacrifices memory scalability to reduce unit cost - making MF3DH9200DA4/02J the balanced choice for future-proofed smart city credential platforms.
Availability
MF3DH9200DA4/02J is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-application smart city cards, and high-assurance access control systems requiring stable component supply across multi-year production cycles.
Supply support for MF3DH9200DA4/02J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.
The MF3DH9200DA4/02J belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-security, multi-service contactless credential systems demanding CC EAL5+ certification, flexible file architecture, and NFC interoperability.
FAQ
What is the primary security certification level of the MF3DH9200DA4/02J?
The MF3DH9200DA4/02J holds Common Criteria EAL5+ certification for both hardware and software - the same assurance level required for electronic passports and banking smart cards. This certification validates its resistance to side-channel, fault injection, and logical attacks, and confirms that all cryptographic operations (AES-128, 3DES, CMAC) execute within a tamper-resistant environment. MF3DH9200DA4/02J achieves this through on-die sensors, active shielding, and secure boot mechanisms.
Does the MF3DH9200DA4/02J support ISO/IEC 7816-4 commands?
Yes, the MF3DH9200DA4/02J fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These commands operate natively over the ISO/IEC 14443-4 transport layer, enabling integration with existing PKI-based backend systems and middleware designed for smart card standards. MF3DH9200DA4/02J also supports ISO/IEC 7816-4 file selection by DF name.
How does the Transaction MAC feature work in the MF3DH9200DA4/02J?
The MF3DH9200DA4/02J implements Transaction MAC as a dedicated file type that cryptographically signs transaction data using a secret key stored in secure memory. Each time a value update or record append occurs, the IC computes a CMAC over the payload and stores it alongside the data - providing verifiable, tamper-evident proof for backend reconciliation. Unlike generic MACs, this is bound to the application context and enforced at the OS level, preventing replay or manipulation. MF3DH9200DA4/02J supports Transaction MAC at the application level, not just per-file.
Is the MF3DH9200DA4/02J backward compatible with earlier MIFARE DESFire generations?
Yes, the MF3DH9200DA4/02J is functionally backward compatible with MIFARE DESFire EV1 and MF3ICD40 (D40) in default delivery configuration. It supports D40-native and EV1 secure messaging modes via Authenticate and AuthenticateISO commands, allowing phased migration from legacy infrastructure. However, new features like Transaction MAC, MIsmartApp, and Proximity Check require explicit activation using EV2-specific commands and are not accessible in backward-compatible mode.
What is the significance of the 'H' in MF3DH9200DA4/02J?
The 'H' in MF3DH9200DA4/02J denotes high-input-capacitance silicon - specifically 70 pF (typ), versus 17 pF for non-H variants. This design enables robust RF coupling in space-constrained applications such as ultra-thin smart cards, wearable tokens, or embedded modules with small or inefficient antennas. The 70 pF variant maintains full functional equivalence with standard MF3Dx2 devices but shifts the impedance matching point to favor compact antenna geometries without sacrificing read range or reliability. MF3DH9200DA4/02J retains identical memory, security, and command-set capabilities.
MF3DH9200DA4/02J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOA4, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, ISO 14443, ISO 7816-4
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DH9200DA4/02J FAQ
1.How can I place an order for MF3DH9200DA4/02J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH9200DA4/02J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH9200DA4/02J reliable?
The price and inventory of MF3DH9200DA4/02J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH9200DA4/02J is usually 5 days.
3.What payment methods are accepted for MF3DH9200DA4/02J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH9200DA4/02J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH9200DA4/02J?
MF3DH9200DA4/02J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH9200DA4/02J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH9200DA4/02J?
For technical support, including MF3DH9200DA4/02J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH9200DA4/02J requirements.
6.How does Aetrix verify that MF3DH9200DA4/02J is sourced from the original manufacturer or authorized distributors?
All MF3DH9200DA4/02J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH9200DA4/02J meets industry standards.
7.What is the process for return or replacement of MF3DH9200DA4/02J?
All MF3DH9200DA4/02J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH9200DA4/02J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH9200DA4/02J part is unused and in its original packaging.
Return procedure for MF3DH9200DA4/02J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH9200DA4/02J Tags

-
SL2S2602FTBX
NXP Semiconductors

-
ST25DV04K-IER6S3
STMicroelectronics

-
ST25DV04K-IER6C3
STMicroelectronics

-
LXMSJZNCMD-217
Murata Electronics

-
NT3H2111W0FTTJ
NXP Semiconductors

-
NT3H2111W0FHKH
NXP Semiconductors

-
M24LR04E-RMC6T/2
STMicroelectronics

-
ST25DV04KC-JF6D3
STMicroelectronics

-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics

-
NT3H2211W0FTTJ
NXP Semiconductors

-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
