NXP Semiconductors MF3DH9200DA6/02J

Overview

MF3DH9200DA6/02J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 16 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in smart city mobility cards, enabling concurrent public transport, e-payment, and access control on a single credential.

For engineers reviewing the MF3DH9200DA6/02J datasheet, MF3DH9200DA6/02J pinout, MF3DH9200DA6/02J application, or MF3DH9200DA6/02J equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for compact antenna designs, Transaction MAC file support for backend-verified transactions, MIsmartApp delegated management capability, and backward compatibility with MIFARE DESFire EV1 and D40 systems.

Technical Context

The MF3DH9200DA6/02J implements a dual-layer security architecture: hardware-accelerated AES-128 and 3DES crypto engines coexist with mutual three-pass authentication and on-chip exception sensors (glitch, voltage, temperature). Its flexible file system supports unlimited applications, each with up to 32 files-including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC types-with file size defined at creation time.

It operates at 13.56 MHz RF frequency with data rates up to 848 kbit/s, uses ISO/IEC 14443-4 protocol, and features configurable ATS supporting up to 256-byte frame size (for 16/32 KB variants). The 70 pF input capacitance enables reliable coupling in space-constrained form factors such as thin smart cards or wearables without antenna redesign.

Key Specifications

Pinout & Package

MF3DH9200DA6/02J is supplied in MOB6 plastic leadless module carrier package (SOT500-3), designed for wafer-level integration into contactless card laminates or embedded modules. It has no external pins - RF coupling occurs via integrated coil interface terminals bonded to antenna traces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D9200DA6/02 and MF3DH8200DA6/01, the MF3DH9200DA6/02J uniquely delivers 16 KB memory *together with* 70 pF input capacitance-enabling both high-service-density deployments and compact form factor compatibility without antenna redesign or memory trade-offs.

Availability

MF3DH9200DA6/02J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility credentialing, and multi-service access control requiring stable component supply across 10+ year deployment lifecycles.

Supply support for MF3DH9200DA6/02J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 30 years of RFID/NFC innovation.

The MIFARE DESFire EV2 product line-of which MF3DH9200DA6/02J is a member-is engineered for high-assurance, multi-application contactless systems in smart cities, transportation, and secure identification, emphasizing CC EAL5+ certification, cryptographic agility, and field-upgradable architecture.

FAQ

What security certifications does the MF3DH9200DA6/02J hold?

The MF3DH9200DA6/02J holds Common Criteria EAL5+ certification for both hardware and software, matching the assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel attacks, fault injection, and logical exploits-making it suitable for high-trust applications like fare collection and government ID without requiring additional evaluation.

How does the 70 pF input capacitance of MF3DH9200DA6/02J affect antenna design?

The 70 pF input capacitance of MF3DH9200DA6/02J allows reliable RF coupling in physically constrained antennas-such as those in thin smart cards, wearable tokens, or embedded modules-without external capacitors or tuning. It reduces required antenna inductance, enabling smaller loop sizes and improved performance in miniaturized form factors where 17 pF variants would suffer coupling loss.

Can MF3DH9200DA6/02J support multiple independent applications simultaneously?

Yes, MF3DH9200DA6/02J supports unlimited applications limited only by its 16 KB EEPROM capacity. Each application can contain up to 32 files-including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC types-with strict access isolation enforced by dedicated key sets and file-level permissions. Applications operate independently, even when sharing underlying hardware resources.

Is MF3DH9200DA6/02J backward compatible with existing MIFARE DESFire infrastructure?

Yes, MF3DH9200DA6/02J operates in default delivery configuration as a MIFARE DESFire EV1 device, ensuring seamless integration with legacy readers and backends. All EV1 and D40 commands-including AuthenticateISO and Authenticate-remain fully functional. New EV2 features (e.g., Transaction MAC, MIsmartApp) require explicit activation via dedicated commands and do not disrupt existing system behavior.

What distinguishes the Transaction MAC file type in MF3DH9200DA6/02J from standard data files?

The Transaction MAC file in MF3DH9200DA6/02J generates a cryptographically signed digest of transaction data using an on-card secret key-providing verifiable proof that a specific operation occurred on a genuine MF3DH9200DA6/02J device. Unlike standard data files, it cannot be written directly; instead, it auto-updates during authenticated transactions, enabling backend systems to validate event authenticity without exposing keys or requiring online verification.