NXP Semiconductors MF3DHA200DA4/02J

Overview

MF3DHA200DA4/02J from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 32 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and access management in Smart City deployments.

For engineers reviewing the MF3DHA200DA4/02J datasheet, MF3DHA200DA4/02J pinout, MF3DHA200DA4/02J application, or MF3DHA200DA4/02J equivalent, key selection considerations include its 32 KB NV memory capacity, high-input-capacitance (70 pF) MOB4 package optimized for thin card designs, Transaction MAC file support, MIsmartApp delegated management, and Proximity Check protection against relay attacks.

Technical Context

The MF3DHA200DA4/02J implements a dual-layer security architecture: mutual three-pass authentication at PICC and application levels using hardware-accelerated AES-128 or 3DES, with CMAC-based data integrity and optional Random ID for privacy. Its on-chip backup management ensures transaction-oriented atomicity across up to 32 files per application.

It supports ISO/IEC 14443-4 protocol with configurable FSCI up to 256 bytes (for 16/32 KB variants), operates at 13.56 MHz RF frequency, and integrates Proximity Check and Originality Check sensors to detect relay attacks and verify genuine NXP silicon - both enabled via dedicated secure messaging commands.

Key Specifications

Pinout & Package

MF3DHA200DA4/02J is packaged in MOB4 - a plastic leadless module carrier (SOT500-2) designed for embedding into contactless smart cards. The device has no external pins; it interfaces exclusively via an integrated antenna coil connected to two RF terminals (RFI and RFO) on the die. These terminals are bonded to the antenna during card lamination and are not user-accessible as discrete pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3DH8200DA4/02 and MF3DHA200DA6/02, MF3DHA200DA4/02J provides optimal balance of high memory density (32 KB), compact MOB4 form factor, and full MIFARE DESFire EV2 security - making it the preferred choice for next-generation Smart City credential platforms requiring scalability and future-proofing.

Availability

MF3DHA200DA4/02J is available at Aetrix Electronics and suitable for secure public transport ticketing, micro-payment systems, and Smart City mobility credentialing requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF3DHA200DA4/02J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 30 years of expertise in contactless IC design.

The MIFARE DESFire product line was developed specifically for high-assurance, multi-application contactless smart cards used in transit, identity, and payment systems - emphasizing Common Criteria-certified security, ISO/IEC 14443 interoperability, and field-upgradable application architectures.

FAQ

What security certifications does MF3DHA200DA4/02J hold?

MF3DHA200DA4/02J holds Common Criteria EAL5+ certification for both hardware and software, matching the security assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel attacks, fault injection, and logical exploitation - confirmed through independent laboratory evaluation per CC v3.1. The MF3DHA200DA4/02J implements mutual three-pass authentication, hardware AES-128, and Proximity Check as part of this certified security stack.

How does MF3DHA200DA4/02J differ from earlier MIFARE DESFire generations?

MF3DHA200DA4/02J is a MIFARE DESFire EV2 device offering unlimited applications (vs. 28 in EV1), Transaction MAC file support, MIsmartApp delegation, Multiple Key Sets with rolling, Virtual Card Architecture, Proximity Check, and Originality Check - none of which exist in D40 or EV1. It maintains backward compatibility with EV1 and D40 commands but requires explicit activation of EV2 features via dedicated secure messaging instructions.

What is the significance of the 'H' and 'A' in MF3DHA200DA4/02J?

In MF3DHA200DA4/02J, 'H' denotes high-input-capacitance (70 pF) design for small-form-factor cards, and 'A' indicates 32 KB EEPROM capacity. The '200' suffix confirms EV2 generation, 'DA4' specifies MOB4 (SOT500-2) packaging, and '/02J' is the revision code. This exact configuration enables robust RF performance in ultra-thin cards while supporting large-scale multi-application deployments.

Can MF3DHA200DA4/02J operate in Random ID mode, and how is it configured?

Yes, MF3DHA200DA4/02J supports Random ID mode to enhance user privacy by replacing the fixed 7-byte UID with a dynamically generated 3-byte identifier during each RF reset. It is configured via the SetConfiguration command after mutual authentication, and requires enabling in the ATS string. Random ID mode reduces tracking risk in open environments but disables UID-based key diversification unless combined with other authentication methods.

What file types does MF3DHA200DA4/02J support, and how are they used in practice?

MF3DHA200DA4/02J supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. In practice, Value files store reloadable balances for transit or vending; Cyclic Record files log recent entries for access control; and Transaction MAC files cryptographically sign each transaction for backend verification - ensuring data integrity even during power loss or card removal mid-operation.