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NXP Semiconductors MF3DHA200DA6/02J
- Part No.:
- MF3DHA200DA6/02J
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- MOB6, Smart Card Module
- Datasheet:
-
MF3DHA200DA6/02J.pdf
- Description:
- MF3DHA200DA6
- Quantity:
- Payment:
- Shipping:
Inventory:3,310
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Product details
Overview
MF3DHA200DA6/02J from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 32 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and multi-service smart city cards.
For engineers reviewing the MF3DHA200DA6/02J datasheet, MF3DHA200DA6/02J pinout, MF3DHA200DA6/02J application, or MF3DHA200DA6/02J equivalent, this page delivers verified technical context, key specifications including memory size, input capacitance, security level, data retention, and write endurance - all confirmed for the exact MOB6/SOT500-3 packaged variant.
Technical Context
The MF3DHA200DA6/02J implements a fully ISO/IEC 14443-4-compliant RF interface with configurable FSCI supporting up to 256-byte frame size, operates at 13.56 MHz, and uses mutual three-pass authentication with hardware-accelerated AES-128 and 3DES. Its on-chip backup management system ensures transaction-oriented data integrity across all file types.
It supports six file types (Standard Data, Backup Data, Value, Linear Record, Cyclic Record, Transaction MAC), unlimited applications, and advanced features including MIsmartApp for delegated application management, Proximity Check against relay attacks, and Originality Check for genuine NXP product verification - all enabled in its default EV2 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 32 KB EEPROM - supports large-scale multi-application deployments such as integrated transit + e-payment + loyalty on one card. |
| Input Capacitance | 70 pF (typ) - optimized for small-form-factor designs like thin smart cards or wearables requiring high coupling efficiency. |
| Security Certification | Common Criteria EAL5+ (HW & SW) - meets banking-grade security requirements for electronic passports and financial cards. |
| Data Retention | 25 years - ensures long-term reliability for infrastructure deployments with 10+ year service lifecycles. |
| Write Endurance | 500,000 cycles - enables frequent balance updates in micropayment or access control applications without premature wear-out. |
| RF Interface | ISO/IEC 14443A Type A, up to 848 kbit/s - guarantees interoperability with global NFC readers and legacy MIFARE infrastructure. |
| Cryptographic Engines | Hardware AES-128 and 3DES - provides authenticated encryption and CMAC-based integrity protection for all secure messaging sessions. |
Pinout & Package
MF3DHA200DA6/02J is supplied in MOB6 plastic leadless module carrier package (SOT500-3), designed for flip-chip bonding onto antenna substrates. The device has no external pins - it interfaces exclusively via an integrated coil antenna using inductive coupling at 13.56 MHz.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card, enabling backend validation of payment or access events without exposing keys. |
| MIsmartApp (Delegated App Management) | Allows third-party service providers to independently create, manage, and update applications - essential for open ecosystem smart city deployments. |
| Proximity Check | Detects and blocks relay attacks by measuring signal propagation time - critical for secure access control and contactless payment. |
| Virtual Card Architecture | Enables privacy-preserving card selection across multiple virtual credentials on one physical card, preventing unauthorized tracking. |
| Backward Compatibility Mode | Operates as MF3ICD40 or MF3D(H)x1 upon initialization - allows phased migration from legacy DESFire systems without reader replacement. |
Applications
| Public Transport Ticketing | Secure Micro-Payment |
|---|---|
|
Use Scenario: Contactless tap-in/tap-out for buses, trams, and metro systems with real-time balance deduction and fare capping. IC Role / Device Role / Timing Role: Secure storage and cryptographic processing of encrypted transit keys, trip logs, and balance data. Use Value: Enables offline transaction processing with tamper-proof audit trail via Transaction MAC files and anti-tear file updates. |
Use Scenario: Closed-loop e-wallet for vending machines, parking meters, and cafeteria terminals with offline authorization. IC Role / Device Role / Timing Role: Hosts value files with built-in backup and atomic update logic to prevent balance corruption during power loss. Use Value: Guarantees consistent balance state across 500,000+ transactions using hardware-enforced anti-tear mechanisms. |
| Smart City Mobility Card | Access Control & Identity |
|
Use Scenario: Single credential for bike sharing, car sharing, museum entry, municipal services, and local loyalty programs. IC Role / Device Role / Timing Role: Manages independent applications with isolated key sets and file structures per service provider. Use Value: Supports unlimited applications and cross-application file access within one transaction - enabling seamless multi-service workflows. |
Use Scenario: Physical/digital ID for university campuses, corporate offices, or government facilities with role-based access tiers. IC Role / Device Role / Timing Role: Stores biometric templates or encrypted credentials in protected files with application-level authentication. Use Value: Enforces mutual three-pass authentication and AES-encrypted communication to prevent cloning and eavesdropping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3DH9200DA6/02 | 16 KB EEPROM, same 70 pF input capacitance, identical MOB6/SOT500-3 package and EV2 feature set. | Suitable where application footprint fits within 16 KB - reduces cost while retaining full EV2 security and functionality. | Select MF3DH9200DA6/02 when memory demand is ≤16 KB and budget sensitivity outweighs need for maximum storage headroom. |
| MF3DHA200DU75/02 | 32 KB EEPROM and 70 pF input capacitance, but supplied on 12-inch wafer (75 μm thickness) - requires custom antenna integration instead of module carrier. | Used in ultra-thin cards or embedded modules where MOB6 packaging is incompatible with mechanical constraints. | Choose MF3DHA200DU75/02 only when wafer-level integration is mandated and assembly capability for bare die exists. |
Compared with MF3DHA200DA6/02J, MF3DH9200DA6/02 offers identical security and interface performance at lower memory cost, while MF3DHA200DU75/02 trades standardized module packaging for wafer-level flexibility - making MF3DHA200DA6/02J the optimal choice for rapid, reliable deployment in standard smart card formats.
Availability
MF3DHA200DA6/02J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified cryptographic compliance.
Supply support for MF3DHA200DA6/02J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with over 30 years of RFID innovation.
The MF3DHA200DA6/02J belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-application contactless systems in transportation, finance, and identity - prioritizing CC EAL5+ security, interoperability, and field-upgradable architecture.
FAQ
What is the memory capacity and type used in MF3DHA200DA6/02J?
The MF3DHA200DA6/02J integrates 32 KB of EEPROM non-volatile memory, organized as a flexible file system supporting unlimited applications and up to 32 files per application. This memory retains data for 25 years and withstands 500,000 write cycles - validated for demanding transit and payment use cases where frequent balance updates occur.
Does MF3DHA200DA6/02J support ISO/IEC 7816-4 commands?
Yes, MF3DHA200DA6/02J fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82) - enabling seamless integration with existing smart card middleware and PKI infrastructures.
How does the Proximity Check feature work in MF3DHA200DA6/02J?
The Proximity Check in MF3DHA200DA6/02J measures round-trip signal propagation time between the PICC and PCD to detect relay attacks. If the measured delay exceeds a predefined threshold, the IC aborts authentication - a hardware-enforced countermeasure validated under Common Criteria EAL5+ evaluation and required for secure access and payment deployments.
Is MF3DHA200DA6/02J backward compatible with older MIFARE DESFire generations?
Yes, MF3DHA200DA6/02J operates in backward-compatible mode with both MF3ICD40 and MF3D(H)x1 upon power-up. It supports D40-native and EV1 secure messaging protocols alongside its native EV2 AES-based secure messaging - allowing incremental infrastructure upgrades without replacing existing readers or cards.
What package type and dimensions does MF3DHA200DA6/02J use?
MF3DHA200DA6/02J is packaged in MOB6 - a plastic leadless module carrier conforming to SOT500-3 outline. It is designed for direct flip-chip bonding onto antenna substrates and contains no external pins; RF coupling occurs solely through the integrated coil interface at 13.56 MHz.
MF3DHA200DA6/02J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- MOB6, Smart Card Module
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- Mifare, ISO 14443, ISO 7816-4
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLLMC
MF3DHA200DA6/02J FAQ
1.How can I place an order for MF3DHA200DA6/02J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DHA200DA6/02J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DHA200DA6/02J reliable?
The price and inventory of MF3DHA200DA6/02J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DHA200DA6/02J is usually 5 days.
3.What payment methods are accepted for MF3DHA200DA6/02J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DHA200DA6/02J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DHA200DA6/02J?
MF3DHA200DA6/02J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DHA200DA6/02J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DHA200DA6/02J?
For technical support, including MF3DHA200DA6/02J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DHA200DA6/02J requirements.
6.How does Aetrix verify that MF3DHA200DA6/02J is sourced from the original manufacturer or authorized distributors?
All MF3DHA200DA6/02J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DHA200DA6/02J meets industry standards.
7.What is the process for return or replacement of MF3DHA200DA6/02J?
All MF3DHA200DA6/02J units undergo pre-shipment inspection (PSI). If there is an issue with MF3DHA200DA6/02J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DHA200DA6/02J part is unused and in its original packaging.
Return procedure for MF3DHA200DA6/02J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DHA200DA6/02J Tags
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SL2S2602FTBX
NXP Semiconductors
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ST25DV04K-IER6S3
STMicroelectronics
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ST25DV04K-IER6C3
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NT3H2111W0FTTJ
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NT3H2111W0FHKH
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M24LR04E-RMC6T/2
STMicroelectronics
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ST25DV04KC-JF6D3
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ST25DV64KC-IE6S3
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ST25DV64K-IER6T3
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