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NXP Semiconductors MF3ICD2101DUD/05,0
- Part No.:
- MF3ICD2101DUD/05,0
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
MF3ICD2101DUD/05,0.pdf
- Description:
- IC RFID TRANSP 13.56MHZ DIE
- Quantity:
- Payment:
- Shipping:
Inventory:15,815
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Product details
Overview
MF3ICD2101DUD/05 from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 2 kB EEPROM, 13.56 MHz RF interface, Common Criteria EAL4+ certification, and hardware AES/3DES cryptographic engines. It serves as the secure transaction core in public transport cards, access control credentials, and closed-loop e-payment devices.
For engineers reviewing the MF3ICD2101DUD/05 datasheet, MF3ICD2101DUD/05 pinout, MF3ICD2101DUD/05 application, or MF3ICD2101DUD/05 equivalent, this page delivers verified technical context, memory architecture details, security command set coverage, interoperability with legacy MIFARE readers, and real-world deployment constraints for transit ticketing and government ID systems.
Technical Context
The MF3ICD2101DUD/05 implements a deterministic anti-collision protocol per ISO/IEC 14443-3, supports four data rates (106–848 kbit/s), and uses true random number generation for session keys. Its on-chip crypto co-processor handles mutual three-pass authentication using 128-bit AES or 168-bit 3DES with 8-byte CMAC integrity protection.
Memory organization includes up to 28 applications and 32 files per application, with file types supporting linear/cyclic records, value operations, and backup-enabled data storage. Transaction-oriented automatic anti-tear ensures atomicity for credit/debit and record write operations without host-side coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Interface | ISO/IEC 14443 Type A, 13.56 MHz - enables interoperability with global transit and access infrastructure |
| Memory Capacity | 2 kB EEPROM - sufficient for 28 applications with 32 files each, including UID, keys, and transaction logs |
| Crypto Engine | Hardware AES-128 & 3DES - provides authenticated encryption for all RF-channel data transfers |
| Data Rate | Up to 848 kbit/s - reduces tap time in high-throughput fare gates and access portals |
| Security Certification | Common Criteria EAL4+ (Hardware & Software) - meets stringent requirements for eGovernment and banking-grade credentialing |
| UID Length | 7-byte unique identifier - fixed at production, write-protected, supports diversified key derivation |
| Input Capacitance | 17.0 pF (typ) - optimized for standard antenna designs in thin smart cards and wearables |
Pinout & Package
MF3ICD2101DUD/05 is supplied in FFC (Film Frame Carrier) wafer format - an unpackaged die on 8-inch sawn wafer with 120 µm thickness and electronic fail-die marking per SECS-II. No discrete pins or terminals are defined; the device interfaces exclusively via its integrated RF coil coupling and requires embedding into a laminated smart card substrate or module.
Key Features
| Feature | Design Value |
|---|---|
| Flexible File System | Supports 28 concurrent applications with up to 32 files each - enables multi-service cards (e.g., transit + payment + ID) |
| Transaction Integrity | Automatic anti-tear mechanism across all file types - guarantees atomic commit/abort of value updates and record writes |
| Backward Compatibility | Full support for MF3ICD40 command set and 4-byte MAC mode - allows phased migration from legacy systems |
| Secure Personalization | Configurable ATS string and optional RANDOM ID - enables privacy-preserving card issuance and lifecycle management |
| Robust RF Link | 16/32-bit CRC, parity, bit coding, and deterministic anti-collision - ensures reliable operation in dense reader environments |
Applications
| Public Transport Ticketing | Secure Physical Access |
|---|---|
Use Scenario: Contactless fare validation at subway gates and bus validators with offline balance checking. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic authentication engine for session key establishment and encrypted balance read/write. Use Value: Enables sub-200 ms tap-and-go transactions with tamper-resistant stored-value management and audit-trail logging. | Use Scenario: Multi-factor office building entry using encrypted credential exchange with door controllers. IC Role / Device Role / Timing Role: Trusted identity token providing application-level authentication and encrypted access log storage. Use Value: Prevents cloning via diversified keys and ensures revocation capability through application invalidation without card replacement. |
| Closed-Loop E-Payment | eGovernment ID Cards |
Use Scenario: Vending machine purchases and cafeteria payments within corporate or university campuses. IC Role / Device Role / Timing Role: Secure value file manager supporting credit/debit operations with rollback-safe transaction commits. Use Value: Eliminates network dependency during transactions while maintaining PCI-aligned cryptographic assurance for fund transfers. | Use Scenario: National ID cards storing biometric templates, digital signatures, and citizen entitlement data. IC Role / Device Role / Timing Role: Certified secure element hosting protected application directories and key-secured personal data partitions. Use Value: Meets ICAO and EU eIDAS requirements for cross-border identity verification with EAL4+ hardware root of trust. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3ICD4101DUD/05 | 4 kB EEPROM, identical 17 pF input capacitance and RF performance | Supports larger application footprints (e.g., multi-agency transit + health + tax services) | Select when >2 kB user memory is required for complex multi-application deployments |
| MF3ICDH2101DUD/05 | Same 2 kB memory but 70 pF input capacitance for compact antenna integration | Better suited for small-form-factor wearables and key fobs with constrained coil area | Select when antenna size reduction is critical and higher input capacitance is acceptable in design |
Compared with MF3ICD2101DUD/05, the MF3ICD4101DUD/05 offers double memory capacity without RF trade-offs, while MF3ICDH2101DUD/05 trades input capacitance for physical miniaturization - both retain identical security architecture, command set, and EAL4+ certification.
Availability
MF3ICD2101DUD/05 is available at Aetrix Electronics and suitable for public transport ticketing, secure physical access systems, and closed-loop e-payment schemes requiring stable component supply, long-term lifecycle support, and certified cryptographic assurance.
Supply support for MF3ICD2101DUD/05 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.
The MF3ICD2101DUD/05 belongs to the MIFARE DESFire EV1 product line, engineered specifically for high-assurance, multi-application contactless smart cards deployed in regulated environments such as transit authorities, government agencies, and financial service providers.
FAQ
What is the memory capacity and endurance specification of MF3ICD2101DUD/05?
The MF3ICD2101DUD/05 integrates 2 kB of EEPROM with a typical write endurance of 500,000 cycles and 10-year data retention at 22 °C. This capacity supports up to 28 applications and 32 files per application, with file sizes defined at creation. The MF3ICD2101DUD/05 uses hardware-managed wear leveling and automatic anti-tear to preserve integrity during frequent value-file updates in transit or payment use cases.
Does MF3ICD2101DUD/05 support ISO/IEC 7816-4 commands?
Yes, MF3ICD2101DUD/05 supports key ISO/IEC 7816-4 APDU instructions including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These enable seamless integration with existing PKI-based middleware and EMV-compliant backend systems without protocol translation layers.
How does the security architecture of MF3ICD2101DUD/05 differ from legacy MIFARE Classic?
The MF3ICD2101DUD/05 implements hardware-accelerated AES-128 and 3DES with 8-byte CMAC, Common Criteria EAL4+ certification, and mutual three-pass authentication - unlike MIFARE Classic's proprietary Crypto1 cipher and lack of formal evaluation. MF3ICD2101DUD/05 also enforces application-level key isolation and prevents unauthorized key extraction via side-channel resistant design, making it suitable for high-risk deployments where MIFARE Classic is deprecated.
Can MF3ICD2101DUD/05 operate with existing MIFARE reader infrastructure?
Yes, MF3ICD2101DUD/05 maintains full backward compatibility with ISO/IEC 14443A-compliant MIFARE readers, including legacy PCDs designed for MIFARE Classic and DESFire EV0. It supports RATS/PPS negotiation and operates at all standard data rates (106–848 kbit/s), enabling drop-in replacement in deployed transit gateways and access panels without firmware upgrades.
What packaging format is supplied for MF3ICD2101DUD/05 and how is it integrated?
MF3ICD2101DUD/05 is supplied as an unpackaged die in FFC (Film Frame Carrier) format - an 8-inch sawn wafer with 120 µm thickness and SECS-II electronic fail-die marking. Integration requires lamination into PVC or PET smart card substrates with tuned loop antennas, or embedding into plastic modules like SOT500-2 carriers. No PCB mounting or soldering is applicable; RF coupling is achieved solely through magnetic induction.
MF3ICD2101DUD/05,0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- MIFARE®
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443, MIFARE
- Interface:
- UART
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
MF3ICD2101DUD/05,0 FAQ
1.How can I place an order for MF3ICD2101DUD/05,0 through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3ICD2101DUD/05,0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3ICD2101DUD/05,0 reliable?
The price and inventory of MF3ICD2101DUD/05,0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3ICD2101DUD/05,0 is usually 5 days.
3.What payment methods are accepted for MF3ICD2101DUD/05,0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3ICD2101DUD/05,0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3ICD2101DUD/05,0?
MF3ICD2101DUD/05,0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3ICD2101DUD/05,0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3ICD2101DUD/05,0?
For technical support, including MF3ICD2101DUD/05,0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3ICD2101DUD/05,0 requirements.
6.How does Aetrix verify that MF3ICD2101DUD/05,0 is sourced from the original manufacturer or authorized distributors?
All MF3ICD2101DUD/05,0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3ICD2101DUD/05,0 meets industry standards.
7.What is the process for return or replacement of MF3ICD2101DUD/05,0?
All MF3ICD2101DUD/05,0 units undergo pre-shipment inspection (PSI). If there is an issue with MF3ICD2101DUD/05,0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3ICD2101DUD/05,0 part is unused and in its original packaging.
Return procedure for MF3ICD2101DUD/05,0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3ICD2101DUD/05,0 Tags
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SL2S2602FTBX
NXP Semiconductors
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STMicroelectronics
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STMicroelectronics
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M24LR04E-RMC6T/2
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