NXP Semiconductors MF3ICD8101DUD/05,0

Overview

MF3ICD8101DUD/05 from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 kB EEPROM, 13.56 MHz RF interface, hardware AES-128 and 3DES cryptographic engines, and Common Criteria EAL4+ certification. It supports up to 28 applications and 32 files per application, enabling secure public transport ticketing, access control, and closed-loop e-payment systems.

For engineers reviewing the MF3ICD8101DUD/05 datasheet, MF3ICD8101DUD/05 pinout, MF3ICD8101DUD/05 application, or MF3ICD8101DUD/05 equivalent, key selection considerations include its 8 kB non-volatile memory capacity, 17 pF input capacitance, deterministic anti-collision, transaction-oriented anti-tear mechanism, and support for ISO/IEC 7816-4 APDU commands in addition to native DESFire protocols.

Technical Context

The MF3ICD8101DUD/05 implements a full ISO/IEC 14443-4 protocol stack with RATS/PPS/WTX support and optional ISO/IEC 7816-4 command compatibility (SELECT FILE, READ BINARY, UPDATE BINARY, etc.). Its on-chip crypto co-processor executes mutual three-pass authentication using hardware-accelerated DES, 3DES, or AES-128, generating session keys and enforcing file-level access control via configurable key settings.

Memory organization follows a hierarchical structure: one master key secures up to 28 applications, each with up to 14 keys and 32 files-including standard data, backup data, value, linear record, and cyclic record types. All file operations are protected by an automatic rollback mechanism and transaction commit/abort logic to ensure atomicity and data integrity.

Key Specifications

Pinout & Package

This is a wafer-die product in FFC (Film Frame Carrier) format-8-inch wafer, 120 µm thickness, electronic fail die marking per SECS-II-and has no discrete pins or terminals. It is intended for embedding into contactless smart cards or modules (e.g., MF3MOD8101DA4/05), not direct PCB mounting.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3ICD4101DUD/05, the MF3ICD8101DUD/05 offers double the EEPROM capacity for richer multi-application support; compared with MF3ICDH8101DUD/05, it uses standard 17 pF capacitance optimized for conventional smart card antennas rather than high-capacitance variants for space-constrained designs.

Availability

MF3ICD8101DUD/05 is available at Aetrix Electronics and suitable for public transport schemes, secure access management, and closed-loop e-payment systems requiring stable component supply, long-term lifecycle support, and certified security compliance.

Supply support for MF3ICD8101DUD/05 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with leadership in RFID, NFC, and trusted execution technologies.

The MF3ICD8101DUD/05 belongs to the MIFARE DESFire EV1 family, designed specifically for high-assurance, multi-service contactless smart cards deployed in mission-critical infrastructure such as transit authorities and national ID programs.

FAQ

What is the memory capacity and endurance rating of the MF3ICD8101DUD/05?

The MF3ICD8101DUD/05 integrates 8 kB of EEPROM with a typical write endurance of 500,000 cycles and 10-year data retention at 22 °C. This capacity supports complex multi-application configurations-for example, storing 28 distinct applications each with up to 32 files-while sustaining repeated daily transactions over extended service life. The MF3ICD8101DUD/05's endurance and retention specs are validated per JEDEC standards and documented in NXP's MF3ICDX21_41_81_SDS Rev. 3.2.

Does the MF3ICD8101DUD/05 support ISO/IEC 7816-4 commands, and which ones are implemented?

Yes, the MF3ICD8101DUD/05 supports core ISO/IEC 7816-4 APDU commands including SELECT FILE (INS A4), READ BINARY (INS B0), UPDATE BINARY (INS D6), READ RECORDS (INS B2), APPEND RECORD (INS E2), GET CHALLENGE (INS 84), INTERNAL AUTHENTICATE (INS 88), and EXTERNAL AUTHENTICATE (INS 82). These enable interoperability with legacy smart card middleware and PKI-based systems while retaining native DESFire command performance. Full implementation details appear in Section 9.7 of the MF3ICD8101DUD/05 datasheet.

How does the anti-tear mechanism work in the MF3ICD8101DUD/05, and which file types does it protect?

The MF3ICD8101DUD/05 implements a transaction-oriented automatic anti-tear mechanism that guarantees atomicity for all file operations involving backup data files, value files, linear record files, and cyclic record files. Before committing changes, the IC writes to a backup sector; only upon successful completion does it update the primary sector. If interrupted (e.g., field loss), the rollback restores consistency. Standard data files lack this protection unless explicitly configured with backup. This behavior is inherent to the MF3ICD8101DUD/05's firmware and requires no host-side coordination.

Is the MF3ICD8101DUD/05 pin-compatible with other MIFARE DESFire EV1 variants like MF3ICD4101DUD/05?

The MF3ICD8101DUD/05 is supplied as a bare die in FFC format-not a packaged IC with pins-so "pin compatibility" does not apply. However, it shares identical electrical, RF, and protocol characteristics with MF3ICD4101DUD/05 and MF3ICD2101DUD/05 except for EEPROM size and input capacitance. All three use the same wafer layout, bonding pad configuration, and test methodology, enabling drop-in substitution in module assembly when memory and capacitance requirements align. This uniformity is confirmed in Table 2 of the MF3ICDX21_41_81_SDS.

What security certifications does the MF3ICD8101DUD/05 hold, and what do they cover?

The MF3ICD8101DUD/05 holds Common Criteria EAL4+ certification covering both hardware and software components, validating resistance to side-channel analysis, fault injection, and logical attacks per ISO/IEC 15408. It also complies fully with ISO/IEC 14443A Levels 1–4 and supports optional ISO/IEC 7816-4 commands. The certification scope includes the on-chip crypto engine, memory management unit, anti-tear logic, and UID generation-ensuring end-to-end trust for regulated applications like national ID and transit fare collection. Certification reports are referenced in NXP document 13403**1.