My Inquiry
My Account
NXP Semiconductors MMA2301EGR2
- Part No.:
- MMA2301EGR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Accelerometers
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
MMA2301EGR2.pdf
- Description:
- ACCELEROMETER 225G ANALOG 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,512
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MMA2301EGR2 from NXP Semiconductors (formerly Freescale) is a surface-mount, single-axis silicon capacitive micromachined accelerometer with integrated signal conditioning, 4th-order Bessel low-pass filter, and factory-calibrated ±200g full-scale range. It delivers ratiometric linear output (10.0 mV/g/V), operates from 4.75–5.25 V, draws 3.0–6.0 mA, and is qualified to AEC-Q100 Grade 2 (−40°C to +105°C) for automotive crash sensing.
For engineers reviewing the MMA2301EGR2 datasheet, MMA2301EGR2 pinout, MMA2301EGR2 application, or MMA2301EGR2 equivalent, key selection considerations include its self-test capability, status fault latch, zero-g offset stability (±0.1 V at 25°C), clock monitor (50–260 kHz), and SOIC-16 package compatibility with vibration monitoring and impact detection systems.
Technical Context
The MMA2301EGR2 integrates a polysilicon g-cell transducer hermetically sealed at wafer level with a CMOS ASIC implementing switched-capacitor sensing, temperature compensation, and a 4-pole Bessel filter (f−3dB = 400 Hz typ). Its analog output (VOUT) is ratiometric to VDD and centered at VDD/2 under zero-g conditions.
Self-test is initiated via logic-high ST pin, producing a calibrated 24g output shift verified by STATUS pin latching. Fault detection includes low-voltage detect (VLVD = 3.25 V typ), clock frequency failure, and EPROM parity error - all reported on STATUS and resettable via ST pulse.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Full-Scale Range | ±200g - supports high-shock impact detection without clipping in airbag or drop-test applications. |
| Sensitivity | 10.0 mV/g/V - provides predictable scaling across supply voltage variations (4.75–5.25 V). |
| Bandwidth (−3 dB) | 400 Hz - preserves transient pulse integrity for vibration analysis up to ~200 Hz fundamental content. |
| Zero-g Offset (25°C) | 2.5 V ±0.1 V - enables accurate DC-coupled acceleration measurement with minimal calibration overhead. |
| Supply Current | 3.0–6.0 mA - compatible with low-power automotive microcontroller domains and battery-backed systems. |
| Operating Temp | −40°C to +105°C - meets AEC-Q100 Grade 2 requirements for under-hood and safety-critical locations. |
| Self-Test Output Shift | 24g equivalent - verifies mechanical deflection and signal chain functionality end-to-end before deployment. |
Pinout & Package
Package: 16-lead SOIC (Case 475-01), 7.5 mm × 10.3 mm body, 1.27 mm pitch, tape-and-reel packaging (EGR2 suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–3, 9–16 | No Connect (N/C) | Internally unconnected; must be left floating per layout guidelines to avoid noise coupling. |
| 4 | ST (Self-Test Input) | Active-high digital input; initiates electrostatic self-test and resets STATUS latch when pulsed ≥100 µs. |
| 5 | VOUT (Analog Output) | Ratiometric voltage output (0.46–0.54 × VDD) proportional to X-axis acceleration; requires RC filter (1 kΩ + 0.01 µF) to suppress clock noise. |
| 6 | STATUS (Fault Output) | Open-drain logic output; latches high on LVD, clock fail, or EPROM parity error; OR'd with ST for connectivity check. |
| 7 | VSS | Analog ground reference; must be connected to clean system ground plane beneath device footprint. |
| 8 | VDD | Power supply input (4.75–5.25 V); requires 0.1 µF ceramic decoupling capacitor placed adjacent to pin. |
Key Features
| Feature | Design Value |
|---|---|
| 4th-order Bessel filter | Preserves pulse shape integrity for transient impact events; eliminates need for external RC components. |
| Factory-trimmed zero-g offset & sensitivity | Enables plug-and-play integration without user calibration; ±2% FSO nonlinearity over full temperature range. |
| Hermetic wafer-level seal | Ensures long-term reliability in humid, dusty, or thermally cycling environments (e.g., automotive chassis). |
| Integrated fault diagnostics | Combines low-voltage detect, clock monitor, and EPROM parity check into single STATUS pin for system-level health monitoring. |
| Robust shock survivability | Withstands 2000 g unpowered and 1500 g powered shocks - suitable for crash event recording and structural health monitoring. |
Applications
| Automotive Airbag Deployment | Industrial Vibration Monitoring |
|---|---|
|
Use Scenario: Real-time detection of rapid deceleration during frontal collision to trigger pyrotechnic inflator within <10 ms. IC Role / Device Role / Timing Role: Primary X-axis crash sensor providing analog acceleration waveform to airbag control unit ADC. Use Value: 400 Hz bandwidth captures critical crash pulse rise time; self-test validates readiness at power-on and periodically during vehicle operation. |
Use Scenario: Continuous measurement of bearing housing vibration in rotating machinery to identify imbalance, misalignment, or bearing wear. IC Role / Device Role / Timing Role: Analog front-end sensor feeding FFT-based spectral analysis in predictive maintenance edge node. Use Value: ±200g range accommodates startup surges and transient impacts; ratiometric output rejects supply ripple common in industrial power rails. |
| Portable Drop-Test Recorder | Structural Impact Assessment |
|
Use Scenario: Capturing peak acceleration during controlled drop tests of consumer electronics or medical devices onto concrete surfaces. IC Role / Device Role / Timing Role: High-g event recorder with timestamped analog output synchronized to microcontroller sampling. Use Value: 1500 g powered survival rating ensures functionality after 1.2 m drops; STATUS pin flags any internal fault post-impact. |
Use Scenario: Measuring dynamic response of civil infrastructure (e.g., bridges, towers) to seismic activity or heavy vehicle passage. IC Role / Device Role / Timing Role: Embedded structural health monitoring node delivering calibrated acceleration data to gateway. Use Value: −40°C to +105°C operating range supports outdoor deployment; wafer-level hermetic seal prevents moisture-induced drift over years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar single-axis analog-output accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADXL326BCPZ-RL7 | Wider bandwidth (2.5 kHz), lower noise (150 µg/√Hz), but no self-test or STATUS fault reporting; 3.3 V only. | Better suited for high-frequency vibration analysis; lacks built-in diagnostics for safety-critical deployments. | Select ADXL326BCPZ-RL7 when bandwidth >500 Hz is required and fault visibility is handled externally. |
| MMA2262EG | Same SOIC-16 package and pinout; ±6g full-scale range, higher sensitivity (1000 mV/g/V), no STATUS pin or clock monitor. | Optimized for low-g precision motion sensing (e.g., tilt, slow dynamics); not rated for crash or high-shock use. | Choose MMA2262EG for sub-10g applications where resolution outweighs diagnostic capability and shock tolerance. |
Compared with ADXL326BCPZ-RL7 and MMA2262EG, the MMA2301EGR2 uniquely combines AEC-Q100 qualification, integrated fault reporting, and ±200g range in a single SOIC-16 package - making it the only option among the three validated for automotive crash sensing and high-reliability impact logging.
Availability
MMA2301EGR2 is available at Aetrix Electronics and suitable for automotive safety systems, industrial condition monitoring, and portable test equipment requiring stable component supply, long-lifecycle support, and AEC-Q100-compliant performance.
Supply support for MMA2301EGR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and continues to support legacy Xtrinsic sensor products including the MMA series. NXP is a global leader in secure connectivity solutions for automotive, industrial, and IoT markets.
The MMA2301EGR2 belongs to Freescale's Xtrinsic™ family of intelligent sensors, designed specifically for high-reliability automotive crash sensing and industrial impact monitoring where self-test, fault visibility, and wide temperature operation are mandatory.
FAQ
What is the primary sensing axis and orientation for the MMA2301EGR2?
The MMA2301EGR2 is a single-axis X-direction accelerometer. When mounted with the marking dot at the top-left corner (pin 1 location), positive acceleration along the package's longest dimension (from pin 1 toward pin 16) produces an increase in VOUT above VDD/2. The device's mechanical design ensures optimal sensitivity aligned with this physical orientation, and Earth's gravity yields +1g output when oriented accordingly.
Does the MMA2301EGR2 require external passive components for basic operation?
The MMA2301EGR2 requires only two external components for reliable operation: a 0.1 µF ceramic capacitor between VDD and VSS for power supply decoupling, and an RC filter (1 kΩ + 0.01 µF) on VOUT to suppress switched-capacitor clock noise. No external resistors or capacitors are needed for gain setting, filtering, or calibration - all functions are fully integrated and factory-trimmed.
How does the STATUS pin behave during normal operation versus fault conditions?
Under normal operation, the STATUS pin remains low unless the ST pin is asserted high - in which case STATUS goes high to confirm connectivity. If a fault occurs (low-voltage detect, clock failure, or EPROM parity error), STATUS latches high and stays high until reset by a ≥100 µs pulse on ST - provided the fault condition has cleared. This behavior enables robust system-level fault tracking without continuous polling.
Is the MMA2301EGR2 RoHS-compliant and lead-free?
Yes, the MMA2301EGR2 carries the KEG suffix, indicating Pb-free (lead-free) construction per RoHS Directive 2011/65/EU. The device uses matte tin lead finish on its SOIC-16 package and complies with JEDEC J-STD-020 moisture sensitivity level (MSL) 3 requirements for surface-mount assembly.
Can the MMA2301EGR2 be used in battery-powered applications?
Yes, the MMA2301EGR2 draws only 3.0–6.0 mA typical supply current and operates down to 4.75 V, making it viable for 5 V battery-backed systems. Its self-test and STATUS features reduce need for external supervision circuitry, lowering overall system power. However, it is not optimized for ultra-low-power sleep modes - continuous operation is assumed per datasheet specifications.
MMA2301EGR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- MMA
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Analog
- Axis:
- X
- Acceleration Range:
- ±225g
- Sensitivity (LSB/g):
- -
- Sensitivity (mV/g):
- 10
- Bandwidth:
- 400Hz
- Output Type:
- Analog Voltage
- Voltage - Supply:
- 4.75V ~ 5.25V
- Features:
- -
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
MMA2301EGR2 FAQ
1.How can I place an order for MMA2301EGR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMA2301EGR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMA2301EGR2 reliable?
The price and inventory of MMA2301EGR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMA2301EGR2 is usually 5 days.
3.What payment methods are accepted for MMA2301EGR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMA2301EGR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMA2301EGR2?
MMA2301EGR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMA2301EGR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMA2301EGR2?
For technical support, including MMA2301EGR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMA2301EGR2 requirements.
6.How does Aetrix verify that MMA2301EGR2 is sourced from the original manufacturer or authorized distributors?
All MMA2301EGR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMA2301EGR2 meets industry standards.
7.What is the process for return or replacement of MMA2301EGR2?
All MMA2301EGR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMA2301EGR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMA2301EGR2 part is unused and in its original packaging.
Return procedure for MMA2301EGR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MMA2301EGR2 Tags
-
MXC4005XC
Memsic Inc.
-
MC3419
Memsic Inc.
-
MC3479
Memsic Inc.
-
MXC6655XA
Memsic Inc.
-
MC3630
Memsic Inc.
.jpg)
-
LIS2HH12TR
STMicroelectronics
-
KX122-1037
Kionix Inc.
-
LIS2DE12TR
STMicroelectronics
-
LIS2DH12TR
STMicroelectronics
-
MC3635
Memsic Inc.
-
LIS2DS12TR
STMicroelectronics
-
LIS3DHTR
STMicroelectronics
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
