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NXP Semiconductors MMA6813BKW
- Part No.:
- MMA6813BKW
- Manufacturer:
- NXP Semiconductors
- Category:
- Accelerometers
- Package:
- 16-QFN Exposed Pad
- Datasheet:
-
MMA6813BKW.pdf
- Description:
- ACCELEROMETER 50G SPI 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,661
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Product details
Overview
MMA6813BKW from NXP Semiconductors (formerly Freescale) is a dual-axis, SPI-interface, over-damped lateral accelerometer with ±50g full-scale range on both X and Y axes, designed for automotive airbag deployment systems. It operates from 3.3V or 5V supply, delivers 10-bit signed/unsigned digital output via SPI, and features independent programmable arming outputs per axis.
For engineers reviewing the MMA6813BKW datasheet, MMA6813BKW pinout, MMA6813BKW application, or MMA6813BKW equivalent, this page provides verified technical context, AEC-Q100 qualified specifications, pin-level design meaning, automotive safety-critical use cases, and validated alternative part options for airbag sensor system design.
Technical Context
The MMA6813BKW integrates two over-damped silicon MEMS g-cells with natural frequency 10.8–15.9 kHz and damping ratio 2.46–9.36, enabling robust response to crash-induced acceleration transients without resonance artifacts. Its signal chain includes ΣΔ ADCs, configurable 4-pole/3-pole low-pass filters (50–1000 Hz), and independent offset cancellation with 6.29 s averaging period and <0.25 LSB/s slew rate.
It implements SPI-compatible serial interface with 8 MHz internal oscillator (divided to 1 MHz test clock), supports 10-bit data output with selectable signed/unsigned format, and provides dual open-drain ARM_X/ARM_Y outputs configurable as arming triggers or PCM outputs - all under AEC-Q100 Grade 2 qualification (−40°C to +105°C ambient).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Axis Configuration | Dual-axis (X & Y), independently configurable full-scale and filtering |
| Full-Scale Range | ±50g on both X and Y axes - matches crash pulse detection thresholds in frontal/side airbag algorithms |
| Digital Output | 10-bit SPI output, signed or unsigned format - enables direct integration with 8-/16-bit microcontrollers without scaling |
| Low-Pass Filter Options | 12 selectable cutoff frequencies (50 Hz to 1000 Hz, 4-pole or 3-pole) - allows tuning to vehicle-specific crash signature bandwidth |
| Supply Voltage | 3.3 V or 5.0 V single supply - compatible with legacy automotive MCU power domains and reduces need for additional regulators |
| AEC-Q100 Qualification | Grade 2 (−40°C to +105°C) - certified for under-hood and passenger compartment deployment in production vehicles |
| Package | 16-pin QFN, 6 mm × 6 mm, exposed pad - supports automated optical inspection and high-reliability solder joint formation |
Pinout & Package
Pb-free 16-pin QFN package (6 mm × 6 mm, Case 2086-01), thermally enhanced with exposed die attach pad internally connected to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Main supply input | Accepts 3.135–5.25 V; requires 0.1 μF decoupling capacitor to VSS for noise immunity during crash transients |
| VREG / VREGA | Internally regulated supplies | VREG = 2.5 V digital rail; VREGA = 2.5 V analog rail; each requires 1 μF output capacitor for stability |
| VSS / VSSA | Digital and analog ground returns | Separate ground paths prevent digital switching noise from corrupting analog sensor signals |
| CS / SCLK / MOSI / MISO | SPI interface signals | Standard 4-wire SPI with internal pullup (CS) and pulldown (SCLK, MOSI); supports up to 1 MHz clock rate |
| ARM_X / ARM_Y | Configurable arming outputs | Open-drain outputs; programmable as active-low/high arming triggers or PCM-encoded acceleration outputs |
| TEST/VPP | Factory programming voltage | Must be tied to VSS in application; not user-accessible during normal operation |
Key Features
| Feature | Design Value |
|---|---|
| Independent axis arming | Each axis has dedicated ARM_X/ARM_Y output with programmable threshold, hysteresis, and response mode - enables asymmetric crash detection logic |
| Offset cancellation | Hardware-based offset correction with >6 s averaging and <0.25 LSB/s slew rate - eliminates thermal drift without host CPU intervention |
| Self-test capability | Two-point electrostatic self-test (low/high magnitude) per axis with cross-axis monitoring - supports ISO 26262 ASIL-B diagnostic coverage |
| Over-damped sensing element | Damping ratio 2.46–9.36 and natural frequency 10.8–15.9 kHz - suppresses mechanical resonance during high-g events (>1500 g powered shock) |
| Robust power monitoring | Dual undervoltage/overvoltage monitors on VREG and VREGA with 20–110 mV hysteresis - ensures reliable reset and fault reporting under battery droop |
Applications
| Frontal Airbag Deployment | Side-Impact Curtain Airbag |
|---|---|
Use Scenario: Detect rapid deceleration during head-on collision at 20–50 km/h to trigger driver/passenger airbag inflation within 20 ms. IC Role / Device Role / Timing Role: Primary crash sensor providing real-time X-axis acceleration data with <37 μs datapath latency and programmable 400 Hz LPF. Use Value: ±50g range matches typical frontal crash pulse amplitude; over-damped g-cell avoids resonance-induced false triggers. |
Use Scenario: Sense lateral acceleration during T-bone impact to deploy side curtain airbags before occupant contacts door panel. IC Role / Device Role / Timing Role: Y-axis inertial trigger with independent arming output and 150 Hz LPF configuration for optimal side-impact signature capture. Use Value: Dual-axis independence allows separate X/Y thresholds; AEC-Q100 Grade 2 ensures operation at cabin temperatures up to +105°C. |
| Seat Belt Pretensioner Activation | Occupant Position Sensing (OPS) Interface |
Use Scenario: Trigger pyrotechnic seat belt pretensioners within 10 ms of crash onset using early acceleration slope detection. IC Role / Device Role / Timing Role: Low-latency arming output (ARM_X) configured in unfiltered mode with <6.6 μs assertion time for fastest possible response. Use Value: Sub-microsecond arming delay meets FMVSS 208 pretensioner timing requirements; open-drain output interfaces directly with external driver ICs. |
Use Scenario: Provide calibrated low-g motion data to OPS ECU for distinguishing seated vs. empty or out-of-position occupants. IC Role / Device Role / Timing Role: Secondary sensor operating in low-noise mode (400 Hz LPF, RMS noise ≤0.5 LSB) to resolve <0.1g displacement changes. Use Value: Offset cancellation maintains zero-g accuracy across temperature; 10-bit resolution enables 0.05g effective resolution at ±50g range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-axis automotive accelerometer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMA6826BKW | ±60g/±60g full-scale range; identical pinout, register map, and AEC-Q100 qualification | Higher range suits rollover detection or heavy-vehicle crash profiles where peak g exceeds 50g | Select when system-level crash modeling predicts >50g peak acceleration on either axis |
| ADXL312WBRDZ-RL | 3-axis, 13-bit output, I²C/SPI interface; ±1.5g to ±12g range; AEC-Q100 Grade 3 (−40°C to +125°C) | Lower range and higher resolution optimized for occupant kinematics, not primary crash sensing | Use only for secondary sensing roles (e.g., OPS, rollover) - not qualified as primary airbag sensor replacement |
Compared with MMA6826BKW, MMA6813BKW offers tighter range matching for mid-size vehicle frontal crashes and lower noise floor at 50g scale; versus ADXL312WBRDZ-RL, it provides higher g-range, automotive-grade arming outputs, and crash-optimized over-damped mechanics - making it the sole qualified option for primary airbag triggering.
Availability
MMA6813BKW is available at Aetrix Electronics and suitable for automotive safety systems, airbag control units, and occupant restraint modules requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.
Supply support for MMA6813BKW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and continues development of its automotive sensor portfolio, emphasizing functional safety, AEC-Q100 compliance, and ASIL-ready architectures.
The MMA68xx family was designed specifically for automotive airbag systems, integrating SafeAssure functional safety features, over-damped MEMS elements, and hardware-based arming logic to meet FMVSS 208 and ISO 26262 requirements.
FAQ
What is the full-scale range of the MMA6813BKW on each axis?
The MMA6813BKW is specified for ±50g full-scale range on both the X-axis and Y-axis, as confirmed in the Ordering Information table and electrical characteristics section of the Freescale MMA68xx datasheet Rev. 5. This symmetric range enables balanced crash detection in frontal and lateral impact scenarios without range mismatch between axes. The device retains full functionality and AEC-Q100 qualification across this range.
Does the MMA6813BKW support both signed and unsigned 10-bit SPI output formats?
Yes, the MMA6813BKW supports both signed and unsigned 10-bit SPI output formats via the SD bit in the DEVCFG register. When SD = 1, output is unsigned with 0g represented by 512 LSB; when SD = 0, output is signed with 0g at 0 LSB. This flexibility allows direct compatibility with different host MCU data handling conventions without external conversion logic.
Is the MMA6813BKW qualified to AEC-Q100, and what grade does it meet?
Yes, the MMA6813BKW is qualified to AEC-Q100 Revision G, meeting Grade 2 requirements (−40°C to +105°C operating ambient temperature). This qualification is explicitly stated in the referenced documents section of the MMA68xx datasheet and verified through full qualification testing - confirming suitability for passenger compartment and under-hood automotive safety applications.
What package type and dimensions does the MMA6813BKW use?
The MMA6813BKW uses a Pb-free 16-pin QFN package measuring 6 mm × 6 mm (Case 2086-01) with an exposed die attach pad. Pin layout and mechanical drawings are provided in Figures 4 and 5 of the MMA68xx datasheet. The package supports standard reflow profiles and includes dedicated analog/digital ground pins (VSSA/VSS) for noise isolation.
Can the ARM_X and ARM_Y pins be used for purposes other than arming outputs?
Yes - the ARM_X and ARM_Y pins are multifunctional and can be configured via the DEVCFG register as either open-drain arming outputs (active-high or active-low) or PCM-encoded digital outputs proportional to X/Y-axis acceleration. When unused, they must remain unconnected. Configuration details are specified in Section 3.1.6.5 and Table 2 of the MMA68xx datasheet.
MMA6813BKW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 16-QFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Not For New Designs
- Type:
- Digital
- Axis:
- X, Y
- Acceleration Range:
- ±50g
- Sensitivity (LSB/g):
- 9.766
- Sensitivity (mV/g):
- -
- Bandwidth:
- -
- Output Type:
- SPI
- Voltage - Supply:
- 3.135V ~ 5.25V
- Features:
- -
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-QFN (6x6)
MMA6813BKW FAQ
1.How can I place an order for MMA6813BKW through Aetrix?
Please submit a Request for Quotation (RFQ) for MMA6813BKW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMA6813BKW reliable?
The price and inventory of MMA6813BKW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMA6813BKW is usually 5 days.
3.What payment methods are accepted for MMA6813BKW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMA6813BKW transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMA6813BKW?
MMA6813BKW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMA6813BKW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMA6813BKW?
For technical support, including MMA6813BKW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMA6813BKW requirements.
6.How does Aetrix verify that MMA6813BKW is sourced from the original manufacturer or authorized distributors?
All MMA6813BKW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMA6813BKW meets industry standards.
7.What is the process for return or replacement of MMA6813BKW?
All MMA6813BKW units undergo pre-shipment inspection (PSI). If there is an issue with MMA6813BKW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMA6813BKW part is unused and in its original packaging.
Return procedure for MMA6813BKW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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