Microchip Technology MPLAD18KP51CAE3
- Part No.:
- MPLAD18KP51CAE3
- Manufacturer:
- Microchip Technology
- Category:
- TVS Diodes
- Package:
- Nonstandard SMD
- Datasheet:
-
MPLAD18KP51CAE3.pdf
- Description:
- TVS DIODE 51VWM 82.4VC PLAD
- Quantity:
- Payment:

- Shipping:

Inventory:3,387
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPLAD18KP51CAE3 from Microsemi is a bidirectional surface-mount transient voltage suppressor (TVS) designed for high-energy surge protection in aerospace, automotive, and industrial systems. It delivers 18,000 W peak pulse power at 10/1000 μs, features a 51 V reverse standoff voltage (VWM), clamps to ≤82.4 V at 219 A peak current, and meets RTCA DO-160F Level 4 pin injection and IEC 61000-4-5 Class 1–5 secondary lightning protection with 42 Ω source impedance.
For engineers reviewing the MPLAD18KP51CAE3 datasheet, MPLAD18KP51CAE3 pinout, MPLAD18KP51CAE3 application, or MPLAD18KP51CAE3 equivalent, key selection criteria include its bidirectional polarity, low thermal resistance (RθJC = 0.7 °C/W), RoHS-compliant matte-tin plating, UL94V-0 epoxy package, and qualification per AEC-Q101 and MIL-PRF-19500 screening options.
Technical Context
This TVS diode operates as a clamping device in parallel with sensitive circuitry, activating when transient voltage exceeds its 51 V standoff threshold. Its silicon avalanche structure provides sub-5 ns response time and stable breakdown voltage (56.7–62.7 V at I(BR)), with temperature coefficient of +60 mV/°C ensuring predictable derating across -55°C to +150°C junction range.
Designed for multi-stroke lightning immunity, it sustains repeated 10/1000 μs surges at ≤0.05% duty factor on FR4 PCBs with recommended pad layout. The metal-base cathode configuration enables efficient heat transfer to the PCB ground plane, supporting steady-state dissipation up to 71 W at TC = 100°C when heatsinked.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Pulse Power (PPP) | 18,000 W @ 10/1000 μs - supports aircraft-level lightning strike energy absorption without failure |
| Reverse Standoff Voltage (VWM) | 51 V - maximum continuous operating voltage before clamping initiates |
| Clamping Voltage (VC) | ≤82.4 V @ IPP = 219 A - limits downstream voltage stress during surge events |
| Breakdown Voltage (V(BR)) | 56.7–62.7 V @ I(BR) - defines precise conduction onset for reliable overvoltage triggering |
| Thermal Resistance (RθJC) | 0.7 °C/W - enables direct PCB heat sinking for sustained high-power transient handling |
| Surge Current (IPP) | 219 A @ 10/1000 μs - quantifies maximum single-event current capacity |
| Temperature Coefficient | +60 mV/°C - allows accurate clamping voltage prediction across full operating range |
Pinout & Package
Package: Surface-mount PLAD (Plastic Low-profile Avalanche Diode) with metal base cathode terminal. Void-free UL94V-0 epoxy body (12.32 × 10.54 × 5.08 mm), matte-tin plated terminals solderable per MIL-STD-750 Method 2026. Cathode is the exposed metal base (bottom side); anode is top-side metallization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Metal Base (Bottom) | Cathode | Primary heat path to PCB ground plane; must be soldered to large copper area for thermal management |
| Top-Side Metallization | Anode | Signal-side connection point; routed to protected line (e.g., avionics data bus or power rail) |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping | Protects AC-coupled or differential signal lines (e.g., RS-485, CAN bus) against ± transients without polarity constraints |
| AEC-Q101 qualified | Validated for automotive under-hood environments including thermal cycling, humidity, and mechanical shock |
| RTCA DO-160F Waveform 4 compliance | Meets Level 4 pin injection immunity (6.4/69 μs) required for commercial aircraft avionics interfaces |
| IEC 61000-4-5 Class 1–5 support | Enables system-level secondary lightning protection design with 42 Ω, 12 Ω, or 2 Ω source impedances |
| RoHS-compliant (e3) | Matte-tin plating ensures lead-free assembly compatibility and eliminates tin whisker risk in high-reliability applications |
Applications
| Avionics Data Bus Protection | Automotive Load Dump Suppression |
|---|---|
Use Scenario: Protecting ARINC 429 or MIL-STD-1553B data lines from induced lightning transients in aircraft fuselage wiring harnesses. IC Role / Device Role / Timing Role: Bidirectional TVS placed across differential pair to clamp common-mode surges while preserving signal integrity. Use Value: Enables compliance with RTCA DO-160 Section 22 multi-stroke lightning testing without adding series impedance or signal distortion. | Use Scenario: Safeguarding engine control unit (ECU) power inputs during alternator load dump events (ISO 7637-2 Pulse 5a/b). IC Role / Device Role / Timing Role: Parallel-connected surge absorber that diverts >100 A transients away from DC-DC converters and microcontrollers. Use Value: Prevents latch-up or permanent damage during 12 V/24 V system voltage spikes up to 120 V for 400 ms. |
| Industrial Ethernet Port Protection | Railway Signaling Interface Protection |
Use Scenario: Securing Gigabit Ethernet PHY ports in outdoor network switches exposed to induced surges from nearby lightning strikes. IC Role / Device Role / Timing Role: Bidirectional TVS on each twisted pair (TX+/TX−, RX+/RX−) to suppress differential and common-mode transients. Use Value: Maintains IEEE 802.3 compliance by limiting clamped voltage to <85 V, preventing PHY IC damage while avoiding false link-down events. | Use Scenario: Shielding trackside signaling relays and sensors connected to 75 V DC interlocking systems from traction current surges and switching transients. IC Role / Device Role / Timing Role: High-energy TVS installed at field cable entry points to absorb repetitive 10/1000 μs surges up to 18 kW. Use Value: Extends mean time between failures (MTBF) by eliminating transient-induced contact welding or insulation breakdown in safety-critical circuits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMBJ51CA | 600 W PPP rating, SMC package, RθJC ≈ 15 °C/W - significantly lower energy handling and thermal performance | Targeted at consumer-grade or non-safety-critical industrial electronics with lower surge exposure | Select only if system-level surge requirements are ≤600 W and PCB space/thermal budget preclude PLAD footprint |
| SMCJ51CA | 1500 W PPP rating, SMC package, RθJC ≈ 10 °C/W - moderate upgrade over SMBJ but still 12× lower peak power than MPLAD18KP51CAE3 | Suitable for automotive infotainment or ADAS camera modules where DO-160 compliance is not required | Choose when cost sensitivity outweighs aerospace/industrial reliability needs and surge test levels are limited to IEC 61000-4-5 Class 3 |
Compared with SMBJ51CA and SMCJ51CA, the MPLAD18KP51CAE3 delivers 30× and 12× higher peak pulse power respectively, enabling compliance with RTCA DO-160F Level 4 and IEC 61000-4-5 Class 5 - critical for flight-critical avionics and railway signaling where single-event failure is unacceptable.
Availability
MPLAD18KP51CAE3 is available at Aetrix Electronics and suitable for avionics interface protection, automotive ECU load dump suppression, and industrial Ethernet port hardening requiring stable component supply across extended production lifecycles.
Supply support for MPLAD18KP51CAE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) designs high-reliability semiconductor solutions for aerospace, defense, communications, and industrial markets, with emphasis on radiation-hardened ICs, timing devices, and power protection components.
The MPLAD18KP51CAE3 belongs to Microsemi's high-power PLAD TVS family, engineered specifically for multi-stroke lightning resilience and DO-160F compliance in mission-critical airborne and rail transport systems.
FAQ
What is the clamping voltage of MPLAD18KP51CAE3 at its rated peak pulse current?
The MPLAD18KP51CAE3 has a maximum clamping voltage (VC) of 82.4 V when subjected to its peak pulse current (IPP) of 219 A under 10/1000 μs waveform conditions. This value is measured across the device terminals during standardized surge testing and defines the upper voltage limit imposed on protected circuitry during worst-case transients.
Is MPLAD18KP51CAE3 certified for automotive applications?
Yes, MPLAD18KP51CAE3 is qualified to AEC-Q101 standards, confirming its suitability for automotive under-hood and powertrain applications. It undergoes rigorous stress testing including temperature cycling, humidity bias, and mechanical shock - validating reliability in harsh vehicle environments where load dump and switching transients occur.
How does the metal base cathode configuration affect PCB layout for MPLAD18KP51CAE3?
The metal base cathode of MPLAD18KP51CAE3 must be soldered directly to a large, thermally robust copper pour on the PCB to serve as both electrical return and primary heat sink. Layout requires minimum 10 cm² of 2 oz copper connected via multiple thermal vias to internal ground planes - failure to implement this compromises RθJC = 0.7 °C/W and risks thermal runaway during repeated surges.
Does MPLAD18KP51CAE3 meet IEC 61000-4-5 with 2 Ω source impedance?
No, MPLAD18KP51CAE3 is rated for IEC 61000-4-5 Class 2 and 3 only when tested with 2 Ω source impedance. For Class 4 compliance at 2 Ω, Microsemi specifies lower-voltage variants such as MPLAD18KP36CA or MPLAD18KP40CA - the 51 V standoff version is validated for Classes 2–3 under this condition per RF01215 Rev B.
What is the meaning of the "E3" suffix in MPLAD18KP51CAE3?
The "E3" suffix in MPLAD18KP51CAE3 indicates RoHS-compliant matte-tin plating on all external terminals, conforming to EU Directive 2011/65/EU. This finish ensures compatibility with lead-free reflow soldering processes (up to 260°C for 10 seconds), eliminates tin whisker formation risk, and supports long-term reliability in high-humidity operational environments.
MPLAD18KP51CAE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Package/Case:
- Nonstandard SMD
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 51V
- Voltage - Breakdown (Min):
- 56.7V
- Voltage - Clamping (Max) @ Ipp:
- 82.4V
- Current - Peak Pulse (10/1000µs):
- 219A
- Power - Peak Pulse:
- 18000W (18kW)
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Military
- Qualification:
- MIL-PRF-19500
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLAD
MPLAD18KP51CAE3 FAQ
1.How can I place an order for MPLAD18KP51CAE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPLAD18KP51CAE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPLAD18KP51CAE3 reliable?
The price and inventory of MPLAD18KP51CAE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPLAD18KP51CAE3 is usually 5 days.
3.What payment methods are accepted for MPLAD18KP51CAE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPLAD18KP51CAE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPLAD18KP51CAE3?
MPLAD18KP51CAE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPLAD18KP51CAE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPLAD18KP51CAE3?
For technical support, including MPLAD18KP51CAE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPLAD18KP51CAE3 requirements.
6.How does Aetrix verify that MPLAD18KP51CAE3 is sourced from the original manufacturer or authorized distributors?
All MPLAD18KP51CAE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPLAD18KP51CAE3 meets industry standards.
7.What is the process for return or replacement of MPLAD18KP51CAE3?
All MPLAD18KP51CAE3 units undergo pre-shipment inspection (PSI). If there is an issue with MPLAD18KP51CAE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPLAD18KP51CAE3 part is unused and in its original packaging.
Return procedure for MPLAD18KP51CAE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPLAD18KP51CAE3 Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

