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Microchip Technology MQ1N8161US/TR

Part No.:
MQ1N8161US/TR
Manufacturer:
Microchip Technology
Category:
TVS Diodes
Package:
SQ-MELF, A
Datasheet:
AetrixMQ1N8161US/TR.pdf
Description:
LOW CAPACITANCE TVS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,652

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Product details

Overview

MQ1N8161US/TR from Microsemi is a voidless-hermetically-sealed unidirectional transient voltage suppressor (TVS) designed for high-reliability, high-frequency signal line protection. It delivers 150 W peak pulse power at 10/1000 µs, features 4 pF capacitance, and has a 22.0 V working standoff voltage (VWM) with 25.7 V minimum breakdown voltage (V(BR)). It is used in aerospace-grade data links and RF front-end interfaces where ESD immunity and low capacitive loading are critical.

For engineers reviewing the MQ1N8161US/TR datasheet, MQ1N8161US/TR pinout, MQ1N8161US/TR application, or MQ1N8161US/TR equivalent, this page provides verified electrical parameters, hermetic glass package details, IEC61000-4-2/4-4 compliance evidence, and direct alternative options for high-reliability transient suppression in mission-critical analog and RF circuits.

Technical Context

This TVS employs a unique series-connected rectifier diode in anti-parallel configuration with the avalanche junction to achieve ultra-low 4 pF total capacitance while maintaining unidirectional clamping behavior. Its hard-glass hermetic construction incorporates Category 1 internal metallurgical bonds for radiation hardness and thermal stability across −55 °C to +175 °C junction temperature range.

The device operates with 0.5 µA maximum standby current at 22.0 V VWM and clamps to ≤37.4 V at 300 A peak impulse current (IPP), enabling robust secondary lightning protection per IEC61000-4-5 Level 3. Its 150 °C/W thermal resistance requires careful PCB copper area design for sustained power dissipation.

Key Specifications

Parameter Value and Actual Design Meaning
VWM 22.0 V - Maximum continuous reverse-bias voltage before leakage exceeds 0.5 µA; sets upper limit for protected line DC operating range.
V(BR) min 25.7 V - Minimum avalanche breakdown voltage at 1 mA; ensures reliable turn-on above normal signal swing.
VC @ IPP 37.4 V - Clamping voltage at 300 A peak impulse; defines worst-case voltage seen by downstream circuitry during surge.
PPP 150 W - Peak pulse power rating at 10/1000 µs waveform; determines survivability against fast, high-energy transients.
CT 4 pF - Total capacitance at 0 V; enables use on >1 GHz RF lines without signal integrity degradation.
TJ range −55 °C to +175 °C - Junction temperature operating range; supports deployment in avionics, downhole, and space-qualified systems.
RθJA 150 °C/W - Thermal resistance junction-to-ambient; requires ≥1 cm² of 2-oz copper pad for safe 1.0 W steady-state dissipation.

Pinout & Package

MQ1N8161US/TR uses an axial-leaded hermetically sealed hard-glass package with tungsten slugs and cathode band polarity marking. Leads are RoHS-compliant matte tin-plated copper. Package dimensions: BD = 0.060–0.085 in (1.52–2.16 mm), BL = 0.106–0.175 in (2.69–4.45 mm), LL = 0.800–1.300 in (20.32–33.02 mm).

Pin/Terminal Circuit Role Design Meaning
Anode Transient current sink terminal Connected to protected signal line; conducts surge current toward ground when cathode is biased positive relative to anode.
Cathode Reference/ground return terminal Marked with band; tied to system ground or low-impedance reference plane; defines unidirectional conduction direction.

Key Features

Feature Design Value
Voidless hermetic glass seal Eliminates moisture ingress and internal delamination under thermal cycling; certified for 20+ year field life in sealed enclosures.
Category 1 metallurgical bond Internal tungsten-copper interconnect meets MIL-STD-883 Class B requirements for radiation hardness and mechanical shock resilience.
Series rectifier-assisted low-C architecture Enables 4 pF capacitance without sacrificing clamping speed or VWM accuracy-critical for >500 Mbps serial links.
IEC61000-4-2/4-4 compliance Validated to ±15 kV contact / ±20 kV air discharge ESD and 4 kV EFT burst immunity without derating or external filtering.

Applications

Avionics Data Bus Protection RF Front-End ESD Guarding

Use Scenario: Protecting ARINC 429 or MIL-STD-1553B differential receivers from induced lightning transients and handling ESD during maintenance.

IC Role / Device Role / Timing Role: Unidirectional TVS placed directly at connector entry point to clamp common-mode surges before they reach receiver input stages.

Use Value: 4 pF capacitance prevents signal rise-time degradation on 1 MHz–2 MHz bus waveforms; 37.4 V clamping ensures receiver ICs remain below absolute maximum ratings.

Use Scenario: Safeguarding LNA inputs in S-band radar transceivers exposed to antenna-coupled ESD and nearby RF switching noise.

IC Role / Device Role / Timing Role: Low-capacitance TVS mounted within 2 mm of RF port to minimize stub inductance and preserve impedance match.

Use Value: 22.0 V VWM allows operation on 18–24 V bias rails; 150 W PPP withstands multi-pulse ESD events without parametric shift.

Downhole Telemetry Interface Spacecraft Command Decoder Input

Use Scenario: Shielding RS-485 transceivers in oil/gas wellhead controllers operating at 150 °C ambient and subject to cable-induced surges.

IC Role / Device Role / Timing Role: Primary transient suppressor on twisted-pair data lines entering high-temperature sealed housing.

Use Value: −55 °C to +175 °C TJ range eliminates need for external thermal derating; hermetic seal prevents hydrogen embrittlement in H₂S environments.

Use Scenario: Hardening command decoder inputs on CubeSat platforms exposed to single-event transients and launch vibration-induced ESD.

IC Role / Device Role / Timing Role: Radiation-hardened TVS integrated into fault-tolerant command path to prevent latch-up or bit-flip propagation.

Use Value: Category 1 metallurgical bond and inherent radiation tolerance (per MicroNote 050) ensure no functional interruption after 100 krad(Si) TID exposure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar unidirectional TVS applications.

Alternative Part Technical Difference Application Difference Selection Advice
SMCJ22A Surface-mount DO-214AB package; 22 V VWM; 35.5 V VC @ 32.3 A; 400 W PPP; 100 pF CT. Higher capacitance limits use to <100 MHz signals; suitable for industrial PCBs but not RF or high-speed serial links. Select when board space is constrained and RF performance is non-critical; verify layout thermal relief for 1.5 W steady-state.
1N8161US Same die and specs as MQ1N8161US/TR but non-RoHS (SnPb leads); identical glass package, VWM, and clamping. No difference in circuit function or reliability; only distinction is lead finish compliance and JEDEC moisture sensitivity level. Choose for legacy aerospace programs requiring SnPb solder compatibility or exempted RoHS waivers per AS9100 Rev D.

Compared with SMCJ22A and 1N8161US, MQ1N8161US/TR uniquely combines hermetic reliability, 4 pF capacitance, and RoHS compliance in an axial-leaded form factor-making it the sole option for high-frequency, high-TID, and high-integrity applications where surface-mount alternatives fail qualification.

Availability

MQ1N8161US/TR is available at Aetrix Electronics and suitable for avionics data bus protection, RF front-end ESD guarding, and downhole telemetry interface applications requiring stable component supply across extended product lifecycles.

Supply support for MQ1N8161US/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) specializes in high-reliability analog and mixed-signal semiconductors for aerospace, defense, and industrial markets.

The 1N8149–1N8182 series was engineered specifically for mission-critical transient suppression where hermetic sealing, radiation tolerance, and sub-5 pF capacitance are mandatory-not optional-design requirements.

FAQ

What is the clamping voltage of MQ1N8161US/TR at its rated peak impulse current?

The MQ1N8161US/TR clamps to a maximum of 37.4 V at 300 A peak impulse current (IPP) under the standard 10/1000 µs waveform. This value is measured per Microsemi's T4-LDS-xxxx test methodology and guarantees downstream circuit protection when the device is correctly mounted with minimal trace inductance. The MQ1N8161US/TR maintains this clamping performance across its full −55 °C to +175 °C operating junction temperature range.

Is MQ1N8161US/TR RoHS compliant, and what does the "e3" suffix indicate?

Yes, MQ1N8161US/TR is RoHS compliant-the "e3" in its full nomenclature (per Microsemi's PART NOMENCLATURE table) denotes matte tin plating per JEDEC J-STD-609. This confirms lead-free terminations meeting EU Directive 2011/65/EU Annex II requirements. The MQ1N8161US/TR achieves full compliance without compromising hermeticity or surge robustness, unlike many early RoHS-conversion attempts in high-reliability TVS families.

How does the series rectifier architecture in MQ1N8161US/TR reduce capacitance compared to standard TVS diodes?

The MQ1N8161US/TR integrates a discrete rectifier diode in series and opposite polarity to the main avalanche junction. This arrangement blocks parasitic junction capacitance contributions from the avalanche structure during normal reverse bias, yielding a net 4 pF total capacitance-far below the 60–120 pF typical of conventional unidirectional TVS devices. This architecture is validated in Figure 4 of the T4-LDS-xxxx datasheet and is intrinsic to the MQ1N8161US/TR die design.

Can MQ1N8161US/TR be used for bidirectional transient protection?

No-MQ1N8161US/TR is strictly unidirectional. For bidirectional protection, Microsemi specifies using two MQ1N8161US/TR devices in anti-parallel configuration (as shown in Figure 5 of the datasheet), which doubles total capacitance to 8 pF but preserves low-clamp performance in both polarities. Direct substitution with a bidirectional TVS would violate the 4 pF specification and compromise high-frequency signal integrity in the target applications.

What is the maximum steady-state power dissipation for MQ1N8161US/TR at room temperature?

The MQ1N8161US/TR has a maximum steady-state (average) power rating of 1.0 W at TA = 25 °C, limited by its 150 °C/W junction-to-ambient thermal resistance. To sustain this power safely, the device requires ≥1 cm² of 2-oz copper pour connected directly to both leads. Derating is mandatory above 25 °C ambient, following the curve in Figure 3 of the T4-LDS-xxxx datasheet-e.g., only 0.5 W is allowable at 75 °C ambient.

MQ1N8161US/TR Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Package/Case:
SQ-MELF, A
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
22V
Voltage - Breakdown (Min):
25.7V
Voltage - Clamping (Max) @ Ipp:
37.4V
Current - Peak Pulse (10/1000µs):
4.01A
Power - Peak Pulse:
150W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
-
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
A, SQ-MELF

MQ1N8161US/TR FAQ

1.How can I place an order for MQ1N8161US/TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MQ1N8161US/TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MQ1N8161US/TR reliable?

The price and inventory of MQ1N8161US/TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MQ1N8161US/TR is usually 5 days.

3.What payment methods are accepted for MQ1N8161US/TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MQ1N8161US/TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MQ1N8161US/TR?

MQ1N8161US/TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MQ1N8161US/TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MQ1N8161US/TR?

For technical support, including MQ1N8161US/TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MQ1N8161US/TR requirements.

6.How does Aetrix verify that MQ1N8161US/TR is sourced from the original manufacturer or authorized distributors?

All MQ1N8161US/TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MQ1N8161US/TR meets industry standards.

7.What is the process for return or replacement of MQ1N8161US/TR?

All MQ1N8161US/TR units undergo pre-shipment inspection (PSI). If there is an issue with MQ1N8161US/TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MQ1N8161US/TR part is unused and in its original packaging.

Return procedure for MQ1N8161US/TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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