Microchip Technology MQ1N8167US/TR
- Part No.:
- MQ1N8167US/TR
- Manufacturer:
- Microchip Technology
- Category:
- TVS Diodes
- Package:
- SQ-MELF, A
- Datasheet:
-
MQ1N8167US/TR.pdf
- Description:
- LOW CAPACITANCE TVS
- Quantity:
- Payment:

- Shipping:

Inventory:4,418
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MQ1N8167US/TR from Microsemi is a voidless-hermetically-sealed unidirectional transient voltage suppressor (TVS) diode designed for high-reliability, high-frequency signal line protection. It delivers 150 W peak pulse power at 10/1000 µs, 40.0 V working standoff voltage (VWM), 4 pF capacitance, and clamps transients to ≤64.6 V at 300 A IPP - ideal for ESD/EFT protection in aerospace data links and MIL-STD-750-compliant systems.
For engineers reviewing the MQ1N8167US/TR datasheet, MQ1N8167US/TR pinout, MQ1N8167US/TR application, or MQ1N8167US/TR equivalent, key selection criteria include low-capacitance transient suppression, Category 1 metallurgical bond reliability, hermetic glass packaging, and compliance with IEC61000-4-2/4-4/4-5 and MIL-STD-750 Method 1020.
Technical Context
This TVS uses a unique series-connected rectifier diode in anti-parallel configuration with the avalanche junction to achieve ultra-low 4 pF capacitance while maintaining unidirectional operation. Its hard-glass hermetic package incorporates tungsten slugs and internal Category 1 metallurgical bonds for radiation hardness and thermal robustness up to +175 °C junction temperature.
The device operates with 40.0 V working standoff voltage (VWM), 44.7 V minimum breakdown voltage (V(BR)) at 1 mA, and clamps to 64.6 V maximum at 300 A peak impulse current (IPP). It supports steady-state power dissipation of 1.0 W at 25 °C ambient and exhibits a temperature coefficient of breakdown voltage of 0.101 %/°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 40.0 V - Maximum continuous reverse voltage before conduction begins; sets operating margin for protected signal lines. |
| V(BR) min | 44.7 V at 1 mA - Ensures reliable turn-on above system operating voltage with defined margin. |
| VC max | 64.6 V at IPP = 300 A - Clamping voltage limits downstream IC stress during lightning or ESD events. |
| CT | 4 pF - Enables use in >1 GHz RF/data lines without signal integrity degradation. |
| PPP | 150 W at 10/1000 µs - Sustains high-energy transients common in avionics and industrial control interfaces. |
| TJ range | –55 to +175 °C - Supports operation in extreme environments including space-grade and engine-bay applications. |
| RθJA | 150 °C/W - Requires minimal PCB copper area for thermal management in compact layouts. |
Pinout & Package
Package: Hermetically sealed voidless hard-glass axial-leaded package with tungsten slugs; cathode band marking; RoHS-compliant matte tin plating over copper leads; weight ≈ 340 mg.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Positive terminal under forward bias; connected to protected line in unidirectional clamp configuration. | Accepts surge current during reverse-transient clamping; must be routed with low-inductance trace to ground reference. |
| Cathode | Negative terminal; marked by band on glass body; connected to system ground or low-impedance return path. | Serves as clamping reference node; requires direct connection to chassis or power plane ground to minimize voltage overshoot. |
Key Features
| Feature | Design Value |
|---|---|
| Voidless hermetic glass seal | Eliminates moisture ingress and long-term parameter drift in humid or vacuum environments. |
| Category 1 metallurgical bond | Meets MIL-PRF-19500/530 requirements for high-reliability semiconductor interconnects. |
| Triple-layer passivation | Prevents surface leakage and enhances stability under ionizing radiation exposure. |
| Low 4 pF capacitance | Preserves signal rise time and bandwidth in high-speed serial links (e.g., RS-422, ARINC 429). |
| Nonsensitive to ESD | Withstands handling per MIL-STD-750 Method 1020 without parameter shift or failure. |
Applications
| Aerospace Data Bus Protection | Military Radio Front-End |
|---|---|
Use Scenario: Protecting ARINC 429 or MIL-STD-1553B differential receivers from induced lightning transients on aircraft wiring harnesses. IC Role / Device Role / Timing Role: Unidirectional TVS placed at connector interface to clamp common-mode surges before signal conditioning circuitry. Use Value: 4 pF capacitance avoids skew or attenuation of 1 MHz–2 MHz data signals; 150 W rating handles IEC61000-4-5 Level 4 coupling. | Use Scenario: Shielding HF/VHF transceiver antenna input stages from ESD and nearby EMP pulses in field-deployable radios. IC Role / Device Role / Timing Role: Primary transient suppressor mounted directly at SMA connector feedthrough to minimize lead inductance. Use Value: 64.6 V clamping ensures LNA input stays below absolute maximum ratings; hermetic seal prevents corrosion in coastal/humid deployments. |
| Satellite Command Link Interface | Industrial PLC Serial Port |
Use Scenario: Safeguarding S-band telemetry downlink receivers against single-event transients in low-earth orbit missions. IC Role / Device Role / Timing Role: Radiation-hardened TVS on RF signal path between antenna filter and downconverter input. Use Value: Inherent radiation tolerance (MicroNote 050) eliminates need for shielding mass; –55 to +175 °C operation covers orbital thermal cycling. | Use Scenario: Protecting RS-232/RS-485 ports on programmable logic controllers exposed to factory floor EFT noise and ground loop surges. IC Role / Device Role / Timing Role: Standoff-voltage-matched TVS on each data line, referenced to isolated digital ground. Use Value: 40.0 V VWM aligns with ±25 V RS-485 common-mode range; 300 A IPP withstands repetitive 4 kV EFT bursts per IEC61000-4-4. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMCJ40A | Surface-mount DO-214AB package; 65.5 V VC at 32.4 A; 22 pF capacitance; 1500 W PPP rating. | Higher clamping voltage and capacitance; suited for lower-frequency power rail protection, not RF/data lines. | Select when board space is constrained and signal bandwidth < 100 MHz; avoid for high-speed serial interfaces. |
| 1N6105A | Axial-leaded glass package; 43.0 V VWM; 69.4 V VC at 217 A; 150 W PPP; no Category 1 bond or radiation hardening. | Lacks hermetic seal and metallurgical bond certification; rated only to +150 °C junction temperature. | Acceptable for commercial-grade industrial use where radiation or extended temperature is not required. |
Compared with SMCJ40A and 1N6105A, MQ1N8167US/TR uniquely combines 4 pF capacitance, hermetic reliability, and Category 1 bonding - making it irreplaceable for high-frequency, mission-critical aerospace and defense signal protection where parameter stability and survivability are non-negotiable.
Availability
MQ1N8167US/TR is available at Aetrix Electronics and suitable for aerospace data bus protection, military radio front-end design, satellite command link interface, and industrial PLC serial port applications requiring stable component supply across extended product lifecycles.
Supply support for MQ1N8167US/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal ICs, RF solutions, and radiation-hardened components for aerospace, defense, and industrial markets.
The 1N8149–1N8182 family was engineered specifically for ultra-low-capacitance transient suppression in high-frequency, high-reliability signal paths - emphasizing hermetic sealing, metallurgical bond integrity, and compliance with MIL-STD and IEC immunity standards.
FAQ
What is the clamping voltage of MQ1N8167US/TR at its rated peak impulse current?
The MQ1N8167US/TR has a maximum clamping voltage (VC) of 64.6 V when subjected to its rated peak impulse current (IPP) of 300 A under the standard 10/1000 µs waveform. This value is measured at 25 °C ambient and defines the upper voltage limit imposed on protected circuitry during surge events. The MQ1N8167US/TR maintains this clamping performance across its full operating temperature range due to its stable avalanche characteristics and hermetic construction.
Is MQ1N8167US/TR suitable for bidirectional transient protection?
No, MQ1N8167US/TR is a unidirectional TVS diode. For bidirectional protection, two MQ1N8167US/TR devices must be connected in anti-parallel configuration, as shown in Figure 5 of the Microsemi datasheet. This arrangement doubles the effective capacitance to 8 pF but provides symmetrical clamping for AC-coupled or differential signal lines such as RS-422 or CAN. The MQ1N8167US/TR itself conducts only in reverse breakdown and blocks forward current above its VWM.
Does MQ1N8167US/TR meet IEC61000-4-2 and IEC61000-4-4 standards?
Yes, MQ1N8167US/TR is explicitly rated for ESD protection per IEC61000-4-2 and electrical fast transient (EFT) immunity per IEC61000-4-4. Its low 4 pF capacitance and fast response time enable effective suppression of 8 kV contact and 15 kV air-gap ESD discharges, while its 150 W peak pulse power rating supports repeated 4 kV EFT bursts. These capabilities are validated in Microsemi's characterization and referenced in the Applications/Benefits section of the T4-LDS-xxxx datasheet.
What is the meaning of "MQ" in MQ1N8167US/TR?
The "MQ" prefix in MQ1N8167US/TR denotes JAN-level reliability qualification per MIL-PRF-19500, indicating that the device meets enhanced screening, testing, and traceability requirements for military and aerospace applications. It signifies compliance with Category 1 internal metallurgical bonds, hermetic sealing verification, and extended temperature operation - distinguishing it from commercial-grade variants like 1N8167US/TR without the "MQ" prefix.
Can MQ1N8167US/TR be used in surface-mount designs?
No, MQ1N8167US/TR is an axial-leaded through-hole device in a hard-glass package and is not compatible with surface-mount assembly processes. It requires hole mounting and wave or hand soldering. For surface-mount equivalents with similar electrical performance, consider Microsemi's USM-type MELF packages (e.g., 1N8167US in "A" MELF), but note that MQ1N8167US/TR itself is only offered in axial-leaded form per the T4-LDS-xxxx datasheet mechanical drawings and nomenclature table.
MQ1N8167US/TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Package/Case:
- SQ-MELF, A
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 40V
- Voltage - Breakdown (Min):
- 44.7V
- Voltage - Clamping (Max) @ Ipp:
- 64.6V
- Current - Peak Pulse (10/1000µs):
- 2.32A
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- A, SQ-MELF
MQ1N8167US/TR FAQ
1.How can I place an order for MQ1N8167US/TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MQ1N8167US/TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MQ1N8167US/TR reliable?
The price and inventory of MQ1N8167US/TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MQ1N8167US/TR is usually 5 days.
3.What payment methods are accepted for MQ1N8167US/TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MQ1N8167US/TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MQ1N8167US/TR?
MQ1N8167US/TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MQ1N8167US/TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MQ1N8167US/TR?
For technical support, including MQ1N8167US/TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MQ1N8167US/TR requirements.
6.How does Aetrix verify that MQ1N8167US/TR is sourced from the original manufacturer or authorized distributors?
All MQ1N8167US/TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MQ1N8167US/TR meets industry standards.
7.What is the process for return or replacement of MQ1N8167US/TR?
All MQ1N8167US/TR units undergo pre-shipment inspection (PSI). If there is an issue with MQ1N8167US/TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MQ1N8167US/TR part is unused and in its original packaging.
Return procedure for MQ1N8167US/TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MQ1N8167US/TR Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

