Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology MS1N8149US/TR

Part No.:
MS1N8149US/TR
Manufacturer:
Microchip Technology
Category:
TVS Diodes
Package:
SQ-MELF, A
Datasheet:
AetrixMS1N8149US/TR.pdf
Description:
LOW CAPACITANCE TVS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,047

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MS1N8149US/TR from Microsemi is a voidless-hermetically-sealed unidirectional transient voltage suppressor (TVS) with 4 pF capacitance, 6.8 V working standoff voltage (VWM), and 150 W peak pulse power at 10/1000 µs. It features an internal series rectifier diode for ultra-low capacitance and Category 1 metallurgical bonding for high-reliability aerospace and defense applications.

For engineers reviewing the MS1N8149US/TR datasheet, MS1N8149US/TR pinout, MS1N8149US/TR application, or MS1N8149US/TR equivalent, this device is selected for ESD/EFT protection in RF front-ends, avionics data links, and radiation-hardened telemetry interfaces where low capacitance and hermetic reliability are mandatory.

Technical Context

The MS1N8149US/TR implements a unique dual-element structure: a TVS junction in series with a reverse-oriented rectifier diode, enabling 4 pF total capacitance-lowest among 150 W-rated TVS devices. Its hard-glass hermetic package eliminates voids and supports operation from –55 °C to +175 °C.

It delivers 11.7 A peak surge current (IPP) at 12.8 V clamping voltage (VC) under 10/1000 µs waveform, with 0.5 µA standby leakage (ID) at 6.8 V VWM and ±0.065 %/°C breakdown voltage temperature coefficient (αV(BR)).

Key Specifications

ParameterValue and Actual Design Meaning
VWM6.8 V - Maximum continuous reverse-biased operating voltage before conduction begins
VC @ IPP12.8 V at 11.7 A - Clamped voltage during 10/1000 µs surge, limiting downstream IC stress
CT4 pF - Enables use in >1 GHz RF signal paths without impedance disruption
PPP150 W - Sustains high-energy transients per IEC61000-4-5 Level 3 secondary lightning
TJ Range–55 °C to +175 °C - Supports extended-temperature deployment in engine-mounted avionics
RθJA150 °C/W - Requires minimal PCB copper area for thermal management in sealed enclosures
ID @ VWM0.5 µA - Negligible leakage in battery-backed or low-power sensor circuits

Pinout & Package

MS1N8149US/TR uses an axial-leaded "A" package (hard glass, voidless hermetic seal) with cathode band marking. Leads are tin/lead or RoHS-compliant matte tin over copper. Weight: ~340 mg. Dimensions: BD = 0.060–0.085", BL = 0.106–0.175", LD = 0.028–0.032", LL = 0.800–1.300".

Pin/TerminalCircuit RoleDesign Meaning
AnodeTransient current entry point during positive surgesConnected to protected line (e.g., RS-422 A/B, RF antenna feed)
CathodeTransient current return path to ground or railMarked by band; ties to system ground plane or negative rail for low-inductance path

Key Features

FeatureDesign Value
Voidless hermetic glass sealEliminates moisture ingress and internal delamination under thermal cycling or vacuum
Category 1 metallurgical bondMeets MIL-STD-750 Method 2070 for die attach integrity in space-grade assemblies
Triple-layer passivationPrevents surface leakage and ion migration in high-humidity or salt-fog environments
Lowest 150 W TVS capacitance4 pF enables direct placement on 50 Ω RF traces without matching network redesign
Radiation hardnessInherently tolerant to TID ≥ 100 krad(Si) per MicroNote 050, suitable for LEO satellite payloads

Applications

Avionics Data Link ProtectionSpacecraft Telemetry Interface

Use Scenario: Protecting ARINC 429 or MIL-STD-1553B differential bus lines from induced lightning transients in aircraft fuselage wiring.

IC Role / Device Role / Timing Role: Unidirectional TVS placed across each signal line to ground, clamping surges before receiver input stages.

Use Value: 4 pF capacitance avoids signal rise-time degradation at 1 Mbps data rates; 12.8 V VC ensures logic-level compatibility with 5 V receivers.

Use Scenario: Shielding S-band telemetry downlink receivers from electrostatic discharge during launch vehicle separation events.

IC Role / Device Role / Timing Role: Anode-to-RF-in, cathode-to-ground configuration on coaxial feedline input of LNA front-end.

Use Value: Hermetic seal prevents outgassing-induced parameter shift in vacuum; 175 °C max TJ accommodates proximity to propulsion systems.

High-Frequency Radar Front-EndNuclear Instrumentation Signal Conditioning

Use Scenario: Guarding GaN PA output stage against load mismatch reflections and ESD during antenna switching.

IC Role / Device Role / Timing Role: TVS mounted directly at PA output port, shunting fast transients before harmonic filters.

Use Value: 4 pF CT preserves VSWR < 1.25 up to 3 GHz; 150 W PPP handles reflected energy from 10 kW pulsed radar.

Use Scenario: Protecting gamma spectrometer preamplifier inputs from cable discharge events in reactor containment buildings.

IC Role / Device Role / Timing Role: Low-leakage TVS (0.5 µA ID) placed between detector bias line and op-amp input.

Use Value: Sub-microamp leakage avoids baseline drift in charge-integrating circuits; radiation hardness ensures stable gain over 20-year service life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar transient suppression applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SMCJ6.8ASurface-mount DO-214AB package; 65 pF capacitance; 1500 W PPP ratingHigher capacitance limits use to sub-100 MHz signals; suited for industrial power rails, not RFSelect when board space is constrained and RF performance is not required
1N6105AAxial-leaded, non-hermetic epoxy package; 10 pF CT; no radiation hardness documentationLacks Category 1 bond and voidless seal; unsuitable for space or high-reliability mil-aeroChoose only for commercial-grade cost-sensitive designs with ambient temp ≤ 125 °C

Compared with SMCJ6.8A and 1N6105A, MS1N8149US/TR uniquely combines hermetic reliability, 4 pF capacitance, and radiation tolerance-making it irreplaceable in RF-critical, mission-critical deployments where failure is not an option.

Availability

MS1N8149US/TR is available at Aetrix Electronics and suitable for avionics data links, spacecraft telemetry interfaces, high-frequency radar front-ends, and nuclear instrumentation signal conditioning requiring stable component supply across extended product lifecycles.

Supply support for MS1N8149US/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) designs high-reliability analog and mixed-signal semiconductors for aerospace, defense, and industrial markets, with emphasis on radiation-hardened, hermetic, and high-temperature solutions.

The MS1N8149US/TR belongs to Microsemi's legacy 1N81xx TVS family, engineered specifically for ultra-low-capacitance transient suppression in mission-critical RF and telemetry systems where conventional TVS devices introduce unacceptable signal distortion or reliability risk.

FAQ

What is the clamping voltage of MS1N8149US/TR at its rated peak surge current?

The MS1N8149US/TR has a maximum clamping voltage (VC) of 12.8 V at 11.7 A peak impulse current (IPP), measured under the standard 10/1000 µs waveform. This value ensures protected circuitry remains within safe operating limits during transient events. The MS1N8149US/TR achieves this while maintaining only 4 pF capacitance-critical for preserving signal integrity in high-speed or RF applications.

Is MS1N8149US/TR suitable for bidirectional transient protection?

No, MS1N8149US/TR is unidirectional. For bidirectional protection, two MS1N8149US/TR devices must be connected in anti-parallel, as documented in Figure 5 of the datasheet. This configuration doubles the effective capacitance to 8 pF but retains the same clamping and surge-handling capability in both polarities.

Does MS1N8149US/TR meet IEC61000-4-2 and IEC61000-4-4 standards?

Yes, MS1N8149US/TR provides ESD protection per IEC61000-4-2 and EFT protection per IEC61000-4-4. Its 4 pF capacitance and fast response enable effective suppression of contact and air-discharge events up to ±15 kV, while the hermetic construction ensures long-term compliance stability in harsh environments.

What is the maximum operating temperature range for MS1N8149US/TR?

The MS1N8149US/TR operates from –55 °C to +175 °C, verified per MIL-STD-750 Test Method 1037. This extended range supports deployment in engine compartments, space payloads, and nuclear facilities where ambient temperatures exceed commercial-grade limits. The MS1N8149US/TR maintains full electrical specifications across this entire range.

How does the internal series rectifier diode in MS1N8149US/TR reduce capacitance?

The MS1N8149US/TR integrates a rectifier diode in series and opposite polarity to the TVS junction. This arrangement blocks low-voltage AC coupling paths that contribute to parasitic capacitance, reducing total capacitance to 4 pF-less than one-third of typical 150 W TVS devices. This architecture is exclusive to Microsemi's voidless hermetic 1N81xx series and is physically realized within the single glass package.

MS1N8149US/TR Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Package/Case:
SQ-MELF, A
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
6.8V
Voltage - Breakdown (Min):
7.79V
Voltage - Clamping (Max) @ Ipp:
12.8V
Current - Peak Pulse (10/1000µs):
11.7A
Power - Peak Pulse:
150W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
-
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
A, SQ-MELF

MS1N8149US/TR FAQ

1.How can I place an order for MS1N8149US/TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MS1N8149US/TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MS1N8149US/TR reliable?

The price and inventory of MS1N8149US/TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MS1N8149US/TR is usually 5 days.

3.What payment methods are accepted for MS1N8149US/TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MS1N8149US/TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MS1N8149US/TR?

MS1N8149US/TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MS1N8149US/TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MS1N8149US/TR?

For technical support, including MS1N8149US/TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MS1N8149US/TR requirements.

6.How does Aetrix verify that MS1N8149US/TR is sourced from the original manufacturer or authorized distributors?

All MS1N8149US/TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MS1N8149US/TR meets industry standards.

7.What is the process for return or replacement of MS1N8149US/TR?

All MS1N8149US/TR units undergo pre-shipment inspection (PSI). If there is an issue with MS1N8149US/TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MS1N8149US/TR part is unused and in its original packaging.

Return procedure for MS1N8149US/TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MS1N8149US/TR Tags

  • MS1N8149US/TR
  • MS1N8149US/TR PDF
  • MS1N8149US/TR Datasheet
  • MS1N8149US/TR Specifications
  • MS1N8149US/TR Images
  • Microchip Technology
  • Microchip Technology MS1N8149US/TR
  • Buy MS1N8149US/TR
  • MS1N8149US/TR Price
  • MS1N8149US/TR Distributor
  • MS1N8149US/TR Supplier
  • MS1N8149US/TR Wholesale
Related Products
ESD9B5.0ST5G
ESD9B5.0ST5G

onsemi

DESD3V3E1BL-7B
DESD3V3E1BL-7B

Diodes Incorporated

ESD5Z3.3T1G
ESD5Z3.3T1G

onsemi

D5V0H1B2LP-7B
D5V0H1B2LP-7B

Diodes Incorporated

D5V0P1B2LP-7B
D5V0P1B2LP-7B

Diodes Incorporated

DESD5V0U1BA-7
DESD5V0U1BA-7

Diodes Incorporated

ESD5Z5.0T1G
ESD5Z5.0T1G

onsemi

DESD5V0U1BB-7
DESD5V0U1BB-7

Diodes Incorporated

D12V0L1B2LP-7B
D12V0L1B2LP-7B

Diodes Incorporated

PESD2V0Y1BSFYL
PESD2V0Y1BSFYL

Nexperia USA Inc.

DF2S5M4CT,L3F
DF2S5M4CT,L3F

Toshiba Semiconductor and Storage

D5V0L1B2WS-7
D5V0L1B2WS-7

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER