Microchip Technology MS1N8171US/TR
- Part No.:
- MS1N8171US/TR
- Manufacturer:
- Microchip Technology
- Category:
- TVS Diodes
- Package:
- SQ-MELF, A
- Datasheet:
-
MS1N8171US/TR.pdf
- Description:
- LOW CAPACITANCE TVS
- Quantity:
- Payment:

- Shipping:

Inventory:2,801
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MS1N8171US/TR from Microsemi is a voidless-hermetically-sealed unidirectional transient voltage suppressor (TVS) with 4 pF capacitance, 58.0 V working standoff voltage (VWM), and 150 W peak pulse power at 10/1000 µs. It features an internal series rectifier diode for ultra-low capacitance and Category 1 metallurgical bonding for high-reliability aerospace and defense applications.
For engineers reviewing the MS1N8171US/TR datasheet, MS1N8171US/TR pinout, MS1N8171US/TR application, or MS1N8171US/TR equivalent, this device is selected for ESD/EFT protection per IEC61000-4-2/4-4, secondary lightning protection per IEC61000-4-5, and high-frequency signal line protection where low capacitance and radiation hardness are critical.
Technical Context
The MS1N8171US/TR implements a unique dual-element structure: a TVS junction in series with a reverse-oriented rectifier diode, enabling 4 pF total capacitance-lowest among 150 W-rated TVS devices. Its hard-glass hermetic package ensures zero voids and stable performance across -55°C to +175°C junction temperature.
It delivers 11.1 A peak impulse current (IPP) at 58.0 V VWM, clamps to ≤93.7 V at IPP, and exhibits 0.104 %/°C breakdown voltage temperature coefficient. RoHS-compliant matte tin plating and axial-leaded terminals support through-hole mounting with MIL-STD-750 ESD insensitivity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 58.0 V - Maximum continuous reverse standoff voltage before conduction begins |
| VC @ IPP | 93.7 V - Clamping voltage during 11.1 A surge, limiting downstream voltage stress |
| PPP | 150 W - Peak pulse power handling at 10/1000 µs waveform, defining surge robustness |
| CT | 4 pF - Total capacitance at 0 V, enabling >1 GHz signal integrity in RF/data lines |
| TJ Range | -55°C to +175°C - Full military-grade operating range without derating up to 125°C |
| αV(BR) | 0.104 %/°C - Predictable breakdown drift over temperature for precision protection design |
| IIB @ VWIB | 1 µA - Low leakage at 58.0 V inverse blocking, minimizing standby power loss |
Pinout & Package
MS1N8171US/TR uses an axial-leaded "A" package (hard glass, voidless hermetic seal) with cathode band marking. Leads are tin/lead or RoHS-compliant matte tin over copper; weight ≈340 mg. Mounting is position-independent.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Positive terminal under forward bias | Connected to protected line side; conducts only during reverse transients |
| Cathode | Negative terminal; marked with band | Connected to ground or common reference; defines unidirectional clamping polarity |
Key Features
| Feature | Design Value |
|---|---|
| Voidless hermetic glass seal | Eliminates moisture ingress and long-term parameter drift in harsh environments |
| Category 1 metallurgical bond | Meets MIL-PRF-19500/507 reliability standard for space-qualified components |
| Triple-layer passivation | Prevents surface leakage and enhances stability under high humidity or contamination |
| Radiation hardness | Inherently resistant to TID and SEE per Microsemi MicroNote 050, no shielding required |
| Low 4 pF capacitance | Preserves signal integrity in >1 GHz RF front-ends and high-speed data links |
Applications
| Avionics Data Bus Protection | Satellite RF Front-End Protection |
|---|---|
Use Scenario: Protecting ARINC 429 or MIL-STD-1553B data lines against induced transients in airborne systems. IC Role / Device Role / Timing Role: Unidirectional TVS placed between bus line and chassis ground to clamp ESD and lightning-induced surges. Use Value: 4 pF capacitance avoids signal distortion at 1 Mbps baud rate; 150 W rating withstands DO-160 Section 22 Level 4 surges. | Use Scenario: Shielding L-band (1–2 GHz) receiver input stages from antenna-coupled ESD and nearby lightning events. IC Role / Device Role / Timing Role: Low-capacitance TVS shunting RF path to ground during transient events without degrading noise figure. Use Value: 4 pF CT minimizes insertion loss and VSWR shift; hermetic seal prevents outgassing in vacuum. |
| Ground-Based Radar Power Supply Input | Nuclear Facility Sensor Interface |
Use Scenario: Safeguarding DC power inputs of radar transmitter modules exposed to EMP and switching transients. IC Role / Device Role / Timing Role: Standoff-rated TVS on +28 V supply rail to absorb 150 W pulses while maintaining <100 ns response. Use Value: 58.0 V VWM matches 28 V nominal with 2× margin; 175°C max TJ supports conduction-cooled enclosures. | Use Scenario: Protecting analog sensor outputs (e.g., thermocouples, RTDs) in reactor control rooms subject to gamma radiation and EFT. IC Role / Device Role / Timing Role: Radiation-hardened TVS on low-level mV signals to prevent latch-up or parametric shift during irradiation. Use Value: Inherent TID tolerance eliminates need for radiation qualification testing; 1 µA IIB preserves microamp-level accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMCJ58A | Surface-mount SMC package; 65 V VWM; 400 W PPP; 100 pF CT | Higher capacitance limits use to sub-100 MHz circuits; not radiation-hardened | Select when board space is constrained and radiation tolerance is not required |
| 1N6322US | Axial-leaded, same Microsemi family; 56 V VWM; identical 4 pF CT and hermetic construction | Lower VWM suits 48 V telecom systems; same reliability level and test flow | Select when 56 V standoff better matches system operating voltage |
Compared with SMCJ58A and 1N6322US, MS1N8171US/TR uniquely combines 58.0 V VWM, 4 pF capacitance, hermetic sealing, and inherent radiation hardness-making it irreplaceable in mission-critical avionics and space electronics where parameter stability under extreme stress is non-negotiable.
Availability
MS1N8171US/TR is available at Aetrix Electronics and suitable for avionics data bus protection, satellite RF front-end protection, and nuclear facility sensor interface applications requiring stable component supply across extended product lifecycles.
Supply support for MS1N8171US/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability, radiation-hardened, and secure ICs for aerospace, defense, and industrial markets.
The MS1N8171US/TR belongs to Microsemi's 1N8149–1N8182 TVS family, engineered specifically for ultra-low-capacitance transient suppression in high-frequency, high-reliability systems where failure is not an option.
FAQ
What is the maximum clamping voltage of MS1N8171US/TR at its rated peak impulse current?
The MS1N8171US/TR clamps to a maximum of 93.7 V when subjected to its rated 11.1 A peak impulse current (IPP) under the standard 10/1000 µs waveform. This value is measured at 25°C ambient and defines the upper voltage limit imposed on protected circuitry during a surge event. The clamping performance remains stable across the full -55°C to +175°C junction temperature range due to the device's low temperature coefficient.
Is MS1N8171US/TR suitable for bidirectional transient protection?
No, MS1N8171US/TR is a unidirectional TVS. For bidirectional protection, two MS1N8171US/TR devices must be connected in anti-parallel configuration, as documented in Figure 5 of the datasheet. This arrangement doubles the effective capacitance to 8 pF but retains the same 150 W surge rating per polarity. A single MS1N8171US/TR provides protection only against negative transients on the cathode side.
Does MS1N8171US/TR meet IEC61000-4-2 and IEC61000-4-4 standards?
Yes, MS1N8171US/TR is specified for ESD protection per IEC61000-4-2 and electrical fast transient (EFT) immunity per IEC61000-4-4. Its low 4 pF capacitance and sub-100 ns response time enable effective suppression of ±8 kV contact and ±15 kV air discharge ESD events, as well as 4 kV burst transients. Test validation is performed per Microsemi's internal qualification protocol aligned with these standards.
What is the lead finish and plating specification for MS1N8171US/TR?
MS1N8171US/TR features RoHS-compliant matte tin plating over copper leads, as indicated by the "e3" suffix in its nomenclature. The plating meets J-STD-006 requirements and supports both wave and hand soldering at 260°C for 10 seconds maximum. Lead material is oxygen-free copper with tungsten slugs for thermal and mechanical robustness in the hermetic glass package.
How does the "MS" prefix in MS1N8171US/TR denote its reliability grade?
The "MS" prefix in MS1N8171US/TR indicates compliance with the JANS (Joint Army-Navy-Specification) level, meaning it is screened and qualified to MIL-PRF-19500/507 for space and high-reliability defense applications. This includes extended temperature cycling, hermeticity testing, and lot traceability-distinct from commercial ("blank") or JANTXV-grade parts. The "US" denotes the axial-leaded "A" package variant.
MS1N8171US/TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Package/Case:
- SQ-MELF, A
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 58V
- Voltage - Breakdown (Min):
- 64.6V
- Voltage - Clamping (Max) @ Ipp:
- 93.7V
- Current - Peak Pulse (10/1000µs):
- 1.6A
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- A, SQ-MELF
MS1N8171US/TR FAQ
1.How can I place an order for MS1N8171US/TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MS1N8171US/TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MS1N8171US/TR reliable?
The price and inventory of MS1N8171US/TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MS1N8171US/TR is usually 5 days.
3.What payment methods are accepted for MS1N8171US/TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MS1N8171US/TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MS1N8171US/TR?
MS1N8171US/TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MS1N8171US/TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MS1N8171US/TR?
For technical support, including MS1N8171US/TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MS1N8171US/TR requirements.
6.How does Aetrix verify that MS1N8171US/TR is sourced from the original manufacturer or authorized distributors?
All MS1N8171US/TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MS1N8171US/TR meets industry standards.
7.What is the process for return or replacement of MS1N8171US/TR?
All MS1N8171US/TR units undergo pre-shipment inspection (PSI). If there is an issue with MS1N8171US/TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MS1N8171US/TR part is unused and in its original packaging.
Return procedure for MS1N8171US/TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MS1N8171US/TR Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

