Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Microchip Technology MS1N8171US/TR

Part No.:
MS1N8171US/TR
Manufacturer:
Microchip Technology
Category:
TVS Diodes
Package:
SQ-MELF, A
Datasheet:
AetrixMS1N8171US/TR.pdf
Description:
LOW CAPACITANCE TVS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,801

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MS1N8171US/TR from Microsemi is a voidless-hermetically-sealed unidirectional transient voltage suppressor (TVS) with 4 pF capacitance, 58.0 V working standoff voltage (VWM), and 150 W peak pulse power at 10/1000 µs. It features an internal series rectifier diode for ultra-low capacitance and Category 1 metallurgical bonding for high-reliability aerospace and defense applications.

For engineers reviewing the MS1N8171US/TR datasheet, MS1N8171US/TR pinout, MS1N8171US/TR application, or MS1N8171US/TR equivalent, this device is selected for ESD/EFT protection per IEC61000-4-2/4-4, secondary lightning protection per IEC61000-4-5, and high-frequency signal line protection where low capacitance and radiation hardness are critical.

Technical Context

The MS1N8171US/TR implements a unique dual-element structure: a TVS junction in series with a reverse-oriented rectifier diode, enabling 4 pF total capacitance-lowest among 150 W-rated TVS devices. Its hard-glass hermetic package ensures zero voids and stable performance across -55°C to +175°C junction temperature.

It delivers 11.1 A peak impulse current (IPP) at 58.0 V VWM, clamps to ≤93.7 V at IPP, and exhibits 0.104 %/°C breakdown voltage temperature coefficient. RoHS-compliant matte tin plating and axial-leaded terminals support through-hole mounting with MIL-STD-750 ESD insensitivity.

Key Specifications

ParameterValue and Actual Design Meaning
VWM58.0 V - Maximum continuous reverse standoff voltage before conduction begins
VC @ IPP93.7 V - Clamping voltage during 11.1 A surge, limiting downstream voltage stress
PPP150 W - Peak pulse power handling at 10/1000 µs waveform, defining surge robustness
CT4 pF - Total capacitance at 0 V, enabling >1 GHz signal integrity in RF/data lines
TJ Range-55°C to +175°C - Full military-grade operating range without derating up to 125°C
αV(BR)0.104 %/°C - Predictable breakdown drift over temperature for precision protection design
IIB @ VWIB1 µA - Low leakage at 58.0 V inverse blocking, minimizing standby power loss

Pinout & Package

MS1N8171US/TR uses an axial-leaded "A" package (hard glass, voidless hermetic seal) with cathode band marking. Leads are tin/lead or RoHS-compliant matte tin over copper; weight ≈340 mg. Mounting is position-independent.

Pin/TerminalCircuit RoleDesign Meaning
AnodePositive terminal under forward biasConnected to protected line side; conducts only during reverse transients
CathodeNegative terminal; marked with bandConnected to ground or common reference; defines unidirectional clamping polarity

Key Features

FeatureDesign Value
Voidless hermetic glass sealEliminates moisture ingress and long-term parameter drift in harsh environments
Category 1 metallurgical bondMeets MIL-PRF-19500/507 reliability standard for space-qualified components
Triple-layer passivationPrevents surface leakage and enhances stability under high humidity or contamination
Radiation hardnessInherently resistant to TID and SEE per Microsemi MicroNote 050, no shielding required
Low 4 pF capacitancePreserves signal integrity in >1 GHz RF front-ends and high-speed data links

Applications

Avionics Data Bus ProtectionSatellite RF Front-End Protection

Use Scenario: Protecting ARINC 429 or MIL-STD-1553B data lines against induced transients in airborne systems.

IC Role / Device Role / Timing Role: Unidirectional TVS placed between bus line and chassis ground to clamp ESD and lightning-induced surges.

Use Value: 4 pF capacitance avoids signal distortion at 1 Mbps baud rate; 150 W rating withstands DO-160 Section 22 Level 4 surges.

Use Scenario: Shielding L-band (1–2 GHz) receiver input stages from antenna-coupled ESD and nearby lightning events.

IC Role / Device Role / Timing Role: Low-capacitance TVS shunting RF path to ground during transient events without degrading noise figure.

Use Value: 4 pF CT minimizes insertion loss and VSWR shift; hermetic seal prevents outgassing in vacuum.

Ground-Based Radar Power Supply InputNuclear Facility Sensor Interface

Use Scenario: Safeguarding DC power inputs of radar transmitter modules exposed to EMP and switching transients.

IC Role / Device Role / Timing Role: Standoff-rated TVS on +28 V supply rail to absorb 150 W pulses while maintaining <100 ns response.

Use Value: 58.0 V VWM matches 28 V nominal with 2× margin; 175°C max TJ supports conduction-cooled enclosures.

Use Scenario: Protecting analog sensor outputs (e.g., thermocouples, RTDs) in reactor control rooms subject to gamma radiation and EFT.

IC Role / Device Role / Timing Role: Radiation-hardened TVS on low-level mV signals to prevent latch-up or parametric shift during irradiation.

Use Value: Inherent TID tolerance eliminates need for radiation qualification testing; 1 µA IIB preserves microamp-level accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar transient suppression applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SMCJ58ASurface-mount SMC package; 65 V VWM; 400 W PPP; 100 pF CTHigher capacitance limits use to sub-100 MHz circuits; not radiation-hardenedSelect when board space is constrained and radiation tolerance is not required
1N6322USAxial-leaded, same Microsemi family; 56 V VWM; identical 4 pF CT and hermetic constructionLower VWM suits 48 V telecom systems; same reliability level and test flowSelect when 56 V standoff better matches system operating voltage

Compared with SMCJ58A and 1N6322US, MS1N8171US/TR uniquely combines 58.0 V VWM, 4 pF capacitance, hermetic sealing, and inherent radiation hardness-making it irreplaceable in mission-critical avionics and space electronics where parameter stability under extreme stress is non-negotiable.

Availability

MS1N8171US/TR is available at Aetrix Electronics and suitable for avionics data bus protection, satellite RF front-end protection, and nuclear facility sensor interface applications requiring stable component supply across extended product lifecycles.

Supply support for MS1N8171US/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability, radiation-hardened, and secure ICs for aerospace, defense, and industrial markets.

The MS1N8171US/TR belongs to Microsemi's 1N8149–1N8182 TVS family, engineered specifically for ultra-low-capacitance transient suppression in high-frequency, high-reliability systems where failure is not an option.

FAQ

What is the maximum clamping voltage of MS1N8171US/TR at its rated peak impulse current?

The MS1N8171US/TR clamps to a maximum of 93.7 V when subjected to its rated 11.1 A peak impulse current (IPP) under the standard 10/1000 µs waveform. This value is measured at 25°C ambient and defines the upper voltage limit imposed on protected circuitry during a surge event. The clamping performance remains stable across the full -55°C to +175°C junction temperature range due to the device's low temperature coefficient.

Is MS1N8171US/TR suitable for bidirectional transient protection?

No, MS1N8171US/TR is a unidirectional TVS. For bidirectional protection, two MS1N8171US/TR devices must be connected in anti-parallel configuration, as documented in Figure 5 of the datasheet. This arrangement doubles the effective capacitance to 8 pF but retains the same 150 W surge rating per polarity. A single MS1N8171US/TR provides protection only against negative transients on the cathode side.

Does MS1N8171US/TR meet IEC61000-4-2 and IEC61000-4-4 standards?

Yes, MS1N8171US/TR is specified for ESD protection per IEC61000-4-2 and electrical fast transient (EFT) immunity per IEC61000-4-4. Its low 4 pF capacitance and sub-100 ns response time enable effective suppression of ±8 kV contact and ±15 kV air discharge ESD events, as well as 4 kV burst transients. Test validation is performed per Microsemi's internal qualification protocol aligned with these standards.

What is the lead finish and plating specification for MS1N8171US/TR?

MS1N8171US/TR features RoHS-compliant matte tin plating over copper leads, as indicated by the "e3" suffix in its nomenclature. The plating meets J-STD-006 requirements and supports both wave and hand soldering at 260°C for 10 seconds maximum. Lead material is oxygen-free copper with tungsten slugs for thermal and mechanical robustness in the hermetic glass package.

How does the "MS" prefix in MS1N8171US/TR denote its reliability grade?

The "MS" prefix in MS1N8171US/TR indicates compliance with the JANS (Joint Army-Navy-Specification) level, meaning it is screened and qualified to MIL-PRF-19500/507 for space and high-reliability defense applications. This includes extended temperature cycling, hermeticity testing, and lot traceability-distinct from commercial ("blank") or JANTXV-grade parts. The "US" denotes the axial-leaded "A" package variant.

MS1N8171US/TR Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Package/Case:
SQ-MELF, A
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
58V
Voltage - Breakdown (Min):
64.6V
Voltage - Clamping (Max) @ Ipp:
93.7V
Current - Peak Pulse (10/1000µs):
1.6A
Power - Peak Pulse:
150W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
-
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
A, SQ-MELF

MS1N8171US/TR FAQ

1.How can I place an order for MS1N8171US/TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MS1N8171US/TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MS1N8171US/TR reliable?

The price and inventory of MS1N8171US/TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MS1N8171US/TR is usually 5 days.

3.What payment methods are accepted for MS1N8171US/TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MS1N8171US/TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MS1N8171US/TR?

MS1N8171US/TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MS1N8171US/TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MS1N8171US/TR?

For technical support, including MS1N8171US/TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MS1N8171US/TR requirements.

6.How does Aetrix verify that MS1N8171US/TR is sourced from the original manufacturer or authorized distributors?

All MS1N8171US/TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MS1N8171US/TR meets industry standards.

7.What is the process for return or replacement of MS1N8171US/TR?

All MS1N8171US/TR units undergo pre-shipment inspection (PSI). If there is an issue with MS1N8171US/TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MS1N8171US/TR part is unused and in its original packaging.

Return procedure for MS1N8171US/TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MS1N8171US/TR Tags

  • MS1N8171US/TR
  • MS1N8171US/TR PDF
  • MS1N8171US/TR Datasheet
  • MS1N8171US/TR Specifications
  • MS1N8171US/TR Images
  • Microchip Technology
  • Microchip Technology MS1N8171US/TR
  • Buy MS1N8171US/TR
  • MS1N8171US/TR Price
  • MS1N8171US/TR Distributor
  • MS1N8171US/TR Supplier
  • MS1N8171US/TR Wholesale
Related Products
ESD9B5.0ST5G
ESD9B5.0ST5G

onsemi

DESD3V3E1BL-7B
DESD3V3E1BL-7B

Diodes Incorporated

ESD5Z3.3T1G
ESD5Z3.3T1G

onsemi

D5V0H1B2LP-7B
D5V0H1B2LP-7B

Diodes Incorporated

D5V0P1B2LP-7B
D5V0P1B2LP-7B

Diodes Incorporated

DESD5V0U1BA-7
DESD5V0U1BA-7

Diodes Incorporated

ESD5Z5.0T1G
ESD5Z5.0T1G

onsemi

DESD5V0U1BB-7
DESD5V0U1BB-7

Diodes Incorporated

D12V0L1B2LP-7B
D12V0L1B2LP-7B

Diodes Incorporated

PESD2V0Y1BSFYL
PESD2V0Y1BSFYL

Nexperia USA Inc.

DF2S5M4CT,L3F
DF2S5M4CT,L3F

Toshiba Semiconductor and Storage

D5V0L1B2WS-7
D5V0L1B2WS-7

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER