My Inquiry
My Account
Microchip Technology MSP1N5659A
- Part No.:
- MSP1N5659A
- Manufacturer:
- Microchip Technology
- Category:
- TVS Diodes
- Package:
- DO-202AA, DO-13, Axial
- Datasheet:
-
MSP1N5659A.pdf
- Description:
- 165V 9.1A UNI-DIRECTIONAL TVS TH
- Quantity:
- Payment:
- Shipping:
Inventory:2,258
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP1N5659A from Microchip Technology is a unidirectional transient voltage suppressor (TVS) diode in a hermetically sealed DO-13 metal package, designed for high-reliability surge protection in aerospace, avionics, and industrial systems. It features a 97.2 V rated standoff voltage (VWM), 108–114 V breakdown voltage (V(BR)), 173 A peak pulse current (IPP), 173 V maximum clamping voltage (VC), and 1500 W peak pulse power rating at 10/1000 µs.
For engineers reviewing the MSP1N5659A datasheet, MSP1N5659A pinout, MSP1N5659A application, or MSP1N5659A equivalent, this device delivers sub-100 ps response time, radiation-hardened performance per MicroNote 050, and IEC 61000-4-2/4-4/4-5 compliance for ESD, EFT, and secondary lightning protection in harsh environments.
Technical Context
The MSP1N5659A operates as a unidirectional avalanche diode, entering controlled breakdown when transient voltage exceeds its V(BR) threshold to clamp downstream circuitry. Its DO-13 metal-glass package ensures hermetic sealing and thermal robustness, with junction-to-lead thermal resistance of 50°C/W and operating temperature range from –55°C to +175°C.
It is rated for 1500 W non-repetitive peak pulse power under 10/1000 µs waveform, with clamping voltage tightly bounded at 173 V @ 173 A. Standby leakage remains ≤5 µA at 97.2 V, and temperature coefficient of V(BR) is +0.107%/°C - critical for stable operation across wide ambient ranges in avionics and military platforms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 97.2 V - Maximum continuous reverse operating voltage before conduction; sets system-level DC bus compatibility. |
| V(BR) min/max | 108 V / 114 V @ 1 mA - Confirmed avalanche onset range; ensures predictable turn-on margin above VWM. |
| VC @ IPP | 173 V @ 173 A - Clamped voltage during worst-case 10/1000 µs surge; defines maximum stress on protected ICs. |
| PPP | 1500 W - Peak pulse power handling capacity; enables protection against high-energy transients like inductive switch-off. |
| ID @ VWM | ≤5 µA - Ultra-low leakage at rated standoff; minimizes standby power loss and avoids false triggering. |
| Response time | <100 ps - Near-instantaneous avalanche response; essential for ESD immunity per IEC 61000-4-2 Level 4. |
| Package | DO-13 (DO-202AA) - Hermetically sealed metal-glass case with cathode-to-case polarity; supports MIL-PRF-19500/500 qualification. |
Pinout & Package
DO-13 (DO-202AA) hermetically sealed metal-glass package with axial leads; cathode terminal electrically connected to case and marked by diode symbol on body. Lead length ≥1.000", weight ≈1.4 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Lead 2) | Transient current entry point during reverse surge | Connected to protected line; carries full IPP during clamping event. |
| Cathode (Lead 1) | Transient current return path | Internally bonded to metal case; must be tied to system ground plane for effective low-inductance discharge. |
Key Features
| Feature | Design Value |
|---|---|
| Unidirectional TVS architecture | Enables precise DC-biased line protection without forward-conduction interference in power rails. |
| 1500 W peak pulse power (10/1000 µs) | Withstands high-energy transients from relay switching, motor commutation, or lightning-induced surges. |
| Hermetic DO-13 metal package | Guarantees long-term reliability in high-humidity, high-vibration, or radiation-exposed environments (e.g., airborne avionics). |
| Inherent radiation hardness | Validated per Microsemi MicroNote 050 - eliminates need for external radiation hardening in space-grade designs. |
| MIL-PRF-19500/500 qualified variants | JANTXV prefix available (e.g., JANTXVMSP1N5659A); meets stringent screening for military and aerospace applications. |
Applications
| Aerospace Avionics Power Bus Protection | Industrial Motor Drive Control Board |
|---|---|
Use Scenario: Protecting 28 V DC distribution buses in aircraft flight control systems from load dump and induced RF transients. IC Role / Device Role / Timing Role: Unidirectional TVS placed across bus rails to clamp surges before they reach power management ICs and FPGAs. Use Value: Sub-100 ps response prevents latch-up in sensitive logic; DO-13 hermeticity ensures no moisture ingress over 20+ year service life. |
Use Scenario: Safeguarding gate drivers and microcontrollers on PLC-mounted motor control boards exposed to inductive kickback. IC Role / Device Role / Timing Role: Primary surge suppression element on 24 V control supply lines feeding isolated gate drivers. Use Value: 173 V clamping limits stress on 200 V-rated MOSFET drivers; 1500 W rating handles repeated 8.3 ms half-sine surges up to 200 A. |
| Military Vehicle Communication Interface | Energy Meter Surge Protection Module |
Use Scenario: Shielding RS-485 transceivers and CAN controllers in armored vehicle data networks from ESD and EMP coupling. IC Role / Device Role / Timing Role: Point-of-entry TVS on differential signal pairs, referenced to chassis ground via cathode-to-case connection. Use Value: Radiation hardness and MIL-qualified variants ensure uninterrupted operation in nuclear-hardened platforms; <100 ps response blocks fast-rising ESD events. |
Use Scenario: Secondary lightning protection stage in Class 3 IEC 61000-4-5 (42 Ω source) metering modules installed in utility substations. IC Role / Device Role / Timing Role: Downstream clamping device after gas discharge tube (GDT), limiting let-through voltage to <200 V. Use Value: 173 V VC ensures protected MCU and ADC remain within absolute maximum ratings; DO-13 thermal mass sustains multiple surge events without degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar unidirectional TVS diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMCJ97A | Surface-mount SMC package; 97 V VWM, 173 V VC @ 173 A; same PPP but lower thermal mass. | Used where PCB real estate is constrained and reflow assembly is required; lacks hermetic seal and radiation hardness. | Select when automated assembly and compact layout outweigh requirements for aerospace-grade reliability and radiation tolerance. |
| 1N5659A (Microchip) | Same electrical specs and DO-13 package; differs only in part numbering convention (no "MSP" prefix) and commercial vs. qualified screening. | Identical function and footprint; used in non-military commercial programs where MIL-PRF-19500/500 qualification is not mandated. | Choose for cost-sensitive industrial applications requiring identical performance without military screening overhead. |
Compared with MSP1N5659A, SMCJ97A offers surface-mount convenience but sacrifices hermeticity and radiation resilience, while 1N5659A provides identical protection in commercial-grade form - enabling trade-offs between qualification rigor, mounting method, and lifecycle assurance.
Availability
MSP1N5659A is available at Aetrix Electronics and suitable for aerospace avionics, industrial motor drives, military vehicle communications, and utility energy metering requiring stable component supply across extended product lifecycles.
Supply support for MSP1N5659A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology (including legacy Microsemi assets) is a global semiconductor provider specializing in high-reliability analog, mixed-signal, and radiation-tolerant components for aerospace, defense, and industrial markets.
The MSP1N5659A belongs to Microchip's legacy high-power unidirectional TVS diode family, engineered specifically for mission-critical transient suppression in environments demanding hermetic packaging, extreme temperature operation, and radiation hardness.
FAQ
What is the standoff voltage rating of the MSP1N5659A?
The MSP1N5659A has a rated standoff voltage (VWM) of 97.2 V, meaning it remains non-conductive under continuous reverse bias up to this level. This value is selected to exceed typical 28 V or 48 V DC system operating voltages while maintaining sufficient margin below the 108–114 V breakdown threshold - ensuring reliable operation without leakage or premature conduction in MSP1N5659A-based protection circuits.
Does the MSP1N5659A meet IEC 61000-4-5 for lightning surge protection?
Yes, the MSP1N5659A is validated for secondary lightning protection per IEC 61000-4-5 with 42 Ω, 12 Ω, and 2 Ω source impedances - supporting Class 1 through Class 4 depending on impedance configuration. Its 1500 W peak pulse power and 173 V clamping voltage enable it to limit let-through energy to safe levels for downstream components in MSP1N5659A-protected systems such as energy meters and avionics interfaces.
Is the MSP1N5659A radiation hardened?
Yes, the MSP1N5659A exhibits inherent radiation hardness per Microsemi MicroNote 050, a documented characteristic of its DO-13 metal-glass construction and silicon process. This makes MSP1N5659A suitable for low-earth orbit (LEO) satellite subsystems and nuclear-hardened military platforms where total ionizing dose (TID) and single-event effects (SEE) resilience are mandatory - without requiring additional shielding or derating.
What is the thermal resistance of the MSP1N5659A package?
The MSP1N5659A in its DO-13 package has a junction-to-lead thermal resistance of 50°C/W when measured at 0.375 inches (10 mm) from the case body. This low thermal resistance allows efficient heat dissipation during transient events, supporting repeated surge handling without thermal runaway - a key design factor in MSP1N5659A deployments on high-reliability power distribution boards.
Can the MSP1N5659A be used for ESD protection per IEC 61000-4-2?
Yes, the MSP1N5659A clamps transients in less than 100 picoseconds, making it effective for contact and air discharge ESD protection per IEC 61000-4-2 Level 4 (±8 kV contact / ±15 kV air). Its 173 V clamping voltage ensures protected interfaces - such as RS-485 or CAN transceivers - remain within safe operating limits during fast-rising ESD events, confirming MSP1N5659A's suitability for front-end port protection in ruggedized equipment.
MSP1N5659A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Package/Case:
- DO-202AA, DO-13, Axial
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 102V
- Voltage - Breakdown (Min):
- 114V
- Voltage - Clamping (Max) @ Ipp:
- 165V
- Current - Peak Pulse (10/1000µs):
- 9.1A
- Power - Peak Pulse:
- 1500W (1.5kW)
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -65°C ~ 175°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- DO-13 (DO-202AA)
MSP1N5659A FAQ
1.How can I place an order for MSP1N5659A through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP1N5659A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP1N5659A reliable?
The price and inventory of MSP1N5659A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP1N5659A is usually 5 days.
3.What payment methods are accepted for MSP1N5659A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP1N5659A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP1N5659A?
MSP1N5659A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP1N5659A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP1N5659A?
For technical support, including MSP1N5659A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP1N5659A requirements.
6.How does Aetrix verify that MSP1N5659A is sourced from the original manufacturer or authorized distributors?
All MSP1N5659A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP1N5659A meets industry standards.
7.What is the process for return or replacement of MSP1N5659A?
All MSP1N5659A units undergo pre-shipment inspection (PSI). If there is an issue with MSP1N5659A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP1N5659A part is unused and in its original packaging.
Return procedure for MSP1N5659A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP1N5659A Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
