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Microchip Technology MXLPLAD18KP170A
- Part No.:
- MXLPLAD18KP170A
- Manufacturer:
- Microchip Technology
- Category:
- TVS Diodes
- Package:
- Nonstandard SMD
- Datasheet:
-
MXLPLAD18KP170A.pdf
- Description:
- TVS DIODE 170VWM 275VC PLAD
- Quantity:
- Payment:
- Shipping:
Inventory:7,470
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Product details
Overview
MXLPLAD18KP170A from Microsemi is a unidirectional surface-mount transient voltage suppressor (TVS) designed for high-energy lightning and load dump protection in aerospace and automotive power systems. It delivers 18,000 W peak pulse power at 10/1000 μs, features a 170 V reverse standoff voltage (VWM), clamps to ≤275 V at 10 A IPP, and exhibits <5 ns response time. It is qualified to AEC-Q101 and meets RTCA DO-160F Waveform 4 Level 4 and IEC 61000-4-5 Class 1–5 secondary lightning protection.
For engineers reviewing the MXLPLAD18KP170A datasheet, MXLPLAD18KP170A pinout, MXLPLAD18KP170A application, or MXLPLAD18KP170A equivalent, key selection criteria include its 170 V VWM rating, 275 V max clamping voltage at 10 A, 0.7 °C/W junction-to-case thermal resistance, RoHS-compliant e3 plating, and qualification for aircraft-level pin injection transients per DO-160F.
Technical Context
The MXLPLAD18KP170A employs an avalanche diode structure optimized for low clamping ratio and minimal thermal resistance. Its metal-base cathode construction enables direct heatsinking, supporting sustained surge handling under multi-stroke lightning conditions per RTCA DO-160 Section 22. The device operates with a 170 V working standoff and achieves breakdown at 189–209 V (min/max) at specified test current.
It complies with IEC 61000-4-2 ESD (±15 kV air/±8 kV contact), IEC 61000-4-4 EFT (40 A), and IEC 61000-4-5 surge (42 Ω, 12 Ω, and 2 Ω source impedances). Thermal design is enabled by RθJC = 0.7 °C/W and RθJA = 50 °C/W on FR4 with recommended pad layout, allowing integration into space-constrained avionics and engine control modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Pulse Power (10/1000 μs) | 18,000 W - sustains full-rated lightning surge energy without failure |
| Reverse Standoff Voltage (VWM) | 170 V - maximum continuous DC or peak AC voltage before conduction begins |
| Max Clamping Voltage (VC @ 10 A) | 275 V - limits downstream circuit voltage during 10 A transient, protecting 200 V-rated components |
| Breakdown Voltage (V(BR)) | 189–209 V @ I(BR) - ensures reliable avalanche initiation above operating voltage margin |
| Junction-to-Case Thermal Resistance | 0.7 °C/W - enables efficient heat transfer to PCB copper or heatsink for repeated surge duty |
| Response Time | <5 ns - suppresses fast-rising transients before sensitive ICs experience overstress |
| Steady-State Power Dissipation | 2.5 W @ TA = 25°C - supports continuous biasing in always-on protection circuits |
Pinout & Package
MXLPLAD18KP170A uses a surface-mount plastic package with metal base cathode termination. The case serves as the cathode terminal, enabling low-inductance, high-current surge path and direct thermal coupling to PCB ground plane or heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Metal Base (Bottom) | Cathode | Primary surge return path; must be soldered to large copper area for thermal and electrical performance |
| Top Surface Pad | Anode | Input connection point for protected line; low-inductance routing critical for fast transient suppression |
Key Features
| Feature | Design Value |
|---|---|
| DO-160F Waveform 4 Level 4 compliance | Withstands 6.4/69 μs pin injection transients up to 170 V VWM devices - certified for aircraft avionics interfaces |
| AEC-Q101 qualification | Validated for automotive under-hood and powertrain applications including 12 V/24 V load dump |
| RoHS-compliant e3 matte-tin plating | Enables lead-free reflow assembly without solderability degradation or whisker risk |
| Moisture Sensitivity Level 1 | No dry pack or baking required prior to SMT assembly - reduces manufacturing overhead |
| 3σ lot norm screening on ID | Ensures consistent standby leakage across production lots - critical for low-power always-on systems |
Applications
| Aerospace Avionics Protection | Automotive Engine Control Unit (ECU) |
|---|---|
Use Scenario: Protecting ARINC 429 data lines and sensor inputs in flight management computers against DO-160 Section 22 lightning-induced surges. IC Role / Device Role / Timing Role: Primary transient clamp at board edge, shunting >15 kA surge currents away from interface ICs and ADC front-ends. Use Value: Enables compliance with RTCA DO-160F Waveform 4 Level 4 without external heatsinking or derating - reduces system size and weight. |
Use Scenario: Safeguarding 5 V and 12 V microcontroller I/O and CAN transceivers during alternator load dump events in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: High-energy TVS placed upstream of LDO regulators and signal conditioners to prevent latch-up and permanent damage. Use Value: Withstands 18 kW pulses while maintaining clamping below 275 V - protects 3.3 V/5 V logic rails downstream of DC-DC converters. |
| Railway Signaling Interface | Industrial Motor Drive DC Bus |
Use Scenario: Shielding Ethernet PHYs and RS-485 transceivers in wayside signaling cabinets exposed to induced lightning surges on long cable runs. IC Role / Device Role / Timing Role: Secondary protection stage after gas discharge tube (GDT), providing fast-response clamping for residual transients. Use Value: Achieves IEC 61000-4-5 Class 4 compliance with 42 Ω source impedance - eliminates need for additional series impedance or filtering. |
Use Scenario: Guarding gate drivers and current sense amplifiers on 170 V-rated DC bus in variable-frequency drives for HVAC and pumps. IC Role / Device Role / Timing Role: Unidirectional clamp referenced to bus ground, absorbing commutation spikes and regenerative energy transients. Use Value: Matches 170 V VWM to nominal bus voltage - minimizes leakage while ensuring robust turn-on margin during overvoltage events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Littelfuse SMAJ170A | Lower PPP rating (400 W), smaller SMC package, higher RθJA (60 °C/W), no DO-160 qualification | Suitable for commercial-grade industrial I/O protection but not certified for aviation or automotive safety-critical use | Select when cost and board space are prioritized over aerospace qualification and multi-kW surge handling |
| Vishay V170CH8 | Same 170 V VWM, 1500 W PPP, TO-277 package, AEC-Q101 qualified, but lacks DO-160F Waveform 4 certification | Valid for automotive ECU protection but requires supplemental testing for avionics pin injection compliance | Select for automotive-only designs where DO-160F is not mandated and thermal budget allows higher RθJC |
Compared with SMAJ170A and V170CH8, the MXLPLAD18KP170A uniquely combines 18 kW surge capability, DO-160F Waveform 4 Level 4 certification, and 0.7 °C/W thermal resistance - making it the only option qualified for primary lightning protection in certified airborne equipment without external heatsinking.
Availability
MXLPLAD18KP170A is available at Aetrix Electronics and suitable for aerospace avionics, automotive powertrain, railway signaling, and industrial motor drive applications requiring stable component supply, long-term lifecycle support, and traceable high-reliability sourcing.
Supply support for MXLPLAD18KP170A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, mixed-signal, and radiation-hardened solutions for aerospace, defense, and industrial markets.
The MPLAD family was developed specifically for high-energy transient suppression in mission-critical platforms where DO-160, AEC-Q101, and IEC 61000-4-x compliance are mandatory - emphasizing thermal efficiency, surge repeatability, and process traceability.
FAQ
What is the maximum clamping voltage of the MXLPLAD18KP170A at its rated peak pulse current?
The MXLPLAD18KP170A has a maximum clamping voltage (VC) of 275 V at 10 A peak pulse current (IPP), measured under 10/1000 μs waveform conditions. This value ensures downstream 200 V-rated components remain within safe operating limits during surge events. The MXLPLAD18KP170A maintains this clamping performance across its full operating temperature range of –55°C to +150°C.
Is the MXLPLAD18KP170A qualified for automotive applications?
Yes, the MXLPLAD18KP170A is fully qualified to AEC-Q101 for automotive use, including under-hood and powertrain environments. It withstands load dump transients and meets ESD (IEC 61000-4-2), EFT (IEC 61000-4-4), and surge (IEC 61000-4-5) requirements. The MXLPLAD18KP170A also supports wafer and assembly lot traceability - essential for Tier 1 automotive supply chain compliance.
Does the MXLPLAD18KP170A require special PCB layout considerations?
Yes - the MXLPLAD18KP170A's metal base cathode must be soldered to a minimum 12.3 mm × 10.5 mm copper pad (per RF01215 Rev B) to achieve rated thermal performance (RθJC = 0.7 °C/W). Short, wide traces to the anode pad and direct connection of the cathode pad to internal ground planes are mandatory to minimize inductance and ensure sub-5 ns response. The MXLPLAD18KP170A's performance degrades significantly if pad dimensions or copper area fall below specification.
What does the "MXL" prefix indicate in MXLPLAD18KP170A?
The "MXL" prefix denotes Microsemi's highest reliability screening level - exceeding standard MIL-PRF-19500 requirements and including enhanced lot traceability, 3σ standby current screening, and extended surge testing. This distinguishes the MXLPLAD18KP170A from standard MPLAD variants and confirms suitability for safety-critical aerospace and defense systems. The MXLPLAD18KP170A is not a generic variant - it is a defined high-reliability grade with documented process controls.
Can the MXLPLAD18KP170A be used in bidirectional configurations?
No - the MXLPLAD18KP170A is unidirectional only, as indicated by the "A" suffix (versus "CA" for bidirectional versions like MXLPLAD18KP170CA). Its cathode is the metal base, and it conducts only during reverse-biased transients. Using the MXLPLAD18KP170A in AC or bipolar signal paths would result in forward conduction and potential failure. For bidirectional protection at 170 V, the MXLPLAD18KP170CA must be selected instead.
MXLPLAD18KP170A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Package/Case:
- Nonstandard SMD
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 170V
- Voltage - Breakdown (Min):
- 189V
- Voltage - Clamping (Max) @ Ipp:
- 275V
- Current - Peak Pulse (10/1000µs):
- 66A
- Power - Peak Pulse:
- 18000W (18kW)
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Military
- Qualification:
- MIL-PRF-19500
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLAD
MXLPLAD18KP170A FAQ
1.How can I place an order for MXLPLAD18KP170A through Aetrix?
Please submit a Request for Quotation (RFQ) for MXLPLAD18KP170A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MXLPLAD18KP170A reliable?
The price and inventory of MXLPLAD18KP170A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MXLPLAD18KP170A is usually 5 days.
3.What payment methods are accepted for MXLPLAD18KP170A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MXLPLAD18KP170A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MXLPLAD18KP170A?
MXLPLAD18KP170A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MXLPLAD18KP170A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MXLPLAD18KP170A?
For technical support, including MXLPLAD18KP170A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MXLPLAD18KP170A requirements.
6.How does Aetrix verify that MXLPLAD18KP170A is sourced from the original manufacturer or authorized distributors?
All MXLPLAD18KP170A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MXLPLAD18KP170A meets industry standards.
7.What is the process for return or replacement of MXLPLAD18KP170A?
All MXLPLAD18KP170A units undergo pre-shipment inspection (PSI). If there is an issue with MXLPLAD18KP170A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MXLPLAD18KP170A part is unused and in its original packaging.
Return procedure for MXLPLAD18KP170A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MXLPLAD18KP170A Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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