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NXP Semiconductors NHS3100W8/A1V
- Part No.:
- NHS3100W8/A1V
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
NHS3100W8/A1V.pdf
- Description:
- IC RFID READER/TRAN 13.56MHZ DIE
- Quantity:
- Payment:
- Shipping:
Inventory:4,820
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Product details
Overview
NHS3100W8/A1V from NXP Semiconductors is an NFC-powered and battery-powered Arm Cortex-M0+ temperature sensor IC optimized for ultra-low-power temperature monitoring and logging. It integrates an on-die temperature sensor (±0.3 °C accuracy from 0 °C to +45 °C), NFC/RFID ISO 14443 Type A interface, and 32 kB flash/8 kB SRAM memory - enabling standalone, single-layer foil-based cold-chain validation sensors without external microcontroller or power management.
For engineers reviewing the NHS3100W8/A1V datasheet, NHS3100W8/A1V pinout, NHS3100W8/A1V application, or NHS3100W8/A1V equivalent, key selection criteria include its bumped-die form factor (2.51 × 2.51 × 0.16 mm), dual-power capability (1.72–3.6 V battery or NFC field), deep power-down mode (< 50 nA), and software-configurable I/O mapping via IOCON registers - critical for embedded foil tag and disposable sensor designs.
Technical Context
The NHS3100W8/A1V implements a fully integrated system-on-die architecture with Arm Cortex-M0+ core running at up to 8 MHz (configurable down to 62.5 kHz), dedicated 32 kHz timer oscillator for RTC, and independent 8 MHz internal RC oscillator trimmed to ±2%. Its power management unit (PMU) autonomously selects between VDDBAT and NFC rectified power, supports five low-power states (Active, Sleep, Deep-sleep, Deep power-down, Battery-off), and retains data in four general-purpose registers during deep power-down.
Temperature sensing is performed by an on-chip analog sensor with calibrated accuracy across three ranges (−40 °C to 0 °C: ±0.5 °C; 0 °C to +45 °C: ±0.3 °C; +45 °C to +85 °C: ±0.5 °C), clocked independently of system clock divider settings. Communication is handled via NFC/RFID ISO 14443 Type A (NFC Forum Type 2 certified) and I²C-bus (400 kbit/s fast mode), with all GPIO functions assigned dynamically through IOCONFIG registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M0+ with NVIC, SWD debug, system tick timer - enables firmware-upgradable sensor logic without external MCU |
| Temperature Accuracy | ±0.3 °C (0 °C to +45 °C) - meets cold-chain validation requirements for pharmaceuticals and biologics transport |
| Memory | 32 kB flash / 8 kB SRAM / 4 kB EEPROM (320 B write-protected) - sufficient for firmware, logs, and secure configuration storage |
| Power Modes | Five modes including Battery-off (< 50 nA @ 3.0 V) - enables multi-year shelf life and activation-on-demand in passive tags |
| NFC Interface | ISO 14443 Type A, NFC Forum Type 2 certified (ID 58516) - ensures interoperability with standard smartphones and readers |
| Supply Range | 1.72 V to 3.6 V battery or NFC-field powered - eliminates need for voltage regulation in thin-film implementations |
| Package | Bumped die (SOT1870-1), 8 functional bumps, 2.51 × 2.51 × 0.16 mm - designed for direct die bonding onto flexible substrates or antenna foils |
Pinout & Package
Package: Bumped die (SOT1870-1), 2.51 × 2.51 × 0.16 mm, gold bumps, no marking code. Designed for direct integration into NFC foil tags and disposable temperature loggers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: PIO0_0/WAKEUP | GPIO / Deep power-down wake input | Configurable as interrupt source; must be pulled LOW ≥100 μs to exit deep power-down - enables event-triggered logging |
| 2: TP0 | Test pin | Do not connect; reserved for factory test - requires floating or grounded per design guidelines |
| 3: LA | NFC antenna terminal A | Direct connection point to NFC coil trace - forms half of resonant LC tank with LB |
| 4: LB | NFC antenna terminal B | Direct connection point to NFC coil trace - completes resonant LC tank with LA |
| 5: PIO0_11/CT32B_M1/SWDIO | GPIO / 32-bit timer output / SWD I/O | Multi-function bump supporting debug, timing, or general I/O - configurable via IOCON register |
| 6: PIO0_10/CT32B_M0/SWCLK | GPIO / 32-bit timer output / SWD clock | Enables in-system programming and real-time debugging without additional interface hardware |
| 7: TP1 | Test pin | Do not connect or tie to ground - no user functionality; grounding avoids floating node issues |
| 8: VSS | Ground reference | Primary supply return path - must be low-impedance connection to foil substrate or PCB ground plane |
| 9: VDDBAT | Battery supply input | Accepts 1.72–3.6 V; powers internal LDOs when active - enables hybrid NFC/battery operation |
| 10: PIO0_6 | GPIO | Configurable digital I/O with repeater mode support - usable for status indication or external sensor interface |
| 11: TP2 | Test pin | Do not connect - reserved for wafer-level testing; must remain unconnected in final assembly |
| 12: TP3 | Test pin | Do not connect - reserved for wafer-level testing; must remain unconnected in final assembly |
Key Features
| Feature | Design Value |
|---|---|
| Software-defined I/O mapping | All 12 GPIO pins (PIO0_0–PIO0_11) assigned via IOCON registers - eliminates fixed pinout constraints in foil-based layouts |
| Dual power source arbitration | Automatic switching between VDDBAT and NFC field power with priority to battery - ensures continuous operation during reader proximity transitions |
| Ultra-low leakage in Battery-off mode | < 50 nA current consumption at 3.0 V - enables >10-year shelf life before first activation in cold-chain packaging |
| On-chip temperature calibration | Factory-trimmed accuracy across −40 °C to +85 °C with three-range specification - removes need for external calibration in field-deployed tags |
| NFC Forum Type 2 certification | Certification ID 58516 - guarantees compatibility with Android NFC Host Card Emulation (HCE) and iOS Core NFC APIs |
Applications
| Pharmaceutical Cold Chain Monitoring | Disposable Medical Device Logging |
|---|---|
|
Use Scenario: Embedded in vaccine vial labels or shipping container liners to record temperature history during global transport. IC Role / Device Role / Timing Role: Standalone temperature logger with NFC readout; RTC-driven periodic sampling; autonomous wake-up on threshold breach. Use Value: Eliminates external MCU and battery management circuitry - reduces bill-of-materials and enables sub-0.5 mm profile foil tags compliant with ISO 15408 tamper-evidence requirements. |
Use Scenario: Integrated into single-use surgical instrument pouches to verify sterilization temperature exposure and post-sterilization storage conditions. IC Role / Device Role / Timing Role: Self-powered thermal event recorder; triggered logging on WAKEUP pin; NFC-initiated data retrieval at point-of-use. Use Value: Provides auditable, non-erasable temperature log directly readable by hospital NFC scanners - satisfies FDA 21 CFR Part 11 electronic record integrity requirements. |
| Smart Packaging for Perishables | Industrial Asset Temperature Validation |
|
Use Scenario: Bonded to food packaging films to monitor ambient temperature during retail display and consumer storage. IC Role / Device Role / Timing Role: Battery-assisted NFC sensor; deep-sleep between 30-second sampling intervals; NFC-field wake-up for instant readout. Use Value: Enables real-time shelf-life estimation via smartphone scan - replaces printed "best before" dates with dynamic, condition-based expiration logic. |
Use Scenario: Mounted inside HVAC ductwork or transformer enclosures to log thermal stress over equipment lifetime. IC Role / Device Role / Timing Role: Long-duration temperature historian; RTC-synchronized hourly logging; NFC download during maintenance visits. Use Value: Delivers traceable thermal history without wired infrastructure - supports predictive maintenance analytics while avoiding conduit installation costs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NFC-enabled temperature monitoring applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ST25DV04K | EEPROM-based NFC tag with integrated temperature sensor (±1 °C); no MCU, no programmable logic, no RTC | Limited to basic read-only logging; cannot execute custom firmware or support wake-on-event or complex sampling profiles | Select when only passive, pre-programmed temperature readout is required - lower cost but zero flexibility |
| NHS3100UK | Same die, WLCSP25 package (2.51 × 2.51 × 0.5 mm); includes 25-ball interconnect and full GPIO set (12 pins) | Suitable for PCB-mounted designs requiring solderable I/O access; not optimized for direct foil bonding like NHS3100W8 | Select when board-level integration with test/debug access is needed - trades thinness for manufacturability and signal routing headroom |
Compared with ST25DV04K and NHS3100UK, the NHS3100W8/A1V uniquely combines bumped-die form factor, Arm-based programmability, and certified NFC Type 2 interface - making it the only option capable of field-upgradable firmware, event-driven wake-up, and sub-0.2 mm total thickness in foil-based smart packaging.
Availability
NHS3100W8/A1V is available at Aetrix Electronics and suitable for cold-chain validation, disposable medical device logging, and smart packaging applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for regulated industries.
Supply support for NHS3100W8/A1V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with headquarters in Eindhoven, Netherlands.
The NHS3100W8/A1V belongs to NXP's NTAG SmartSensor family, engineered specifically for battery-constrained, NFC-accessible temperature monitoring in disposable and foil-based systems - prioritizing ultra-low leakage, minimal external components, and NFC Forum certification.
FAQ
What is the primary function of the NHS3100W8/A1V?
The NHS3100W8/A1V is an NFC-powered and battery-powered Arm Cortex-M0+ temperature sensor IC designed for ultra-low-power, standalone temperature monitoring and logging in foil-based and disposable applications. It integrates an on-die temperature sensor, NFC interface, flash memory, and programmable I/O - enabling self-contained sensor nodes without external microcontrollers. The NHS3100W8/A1V delivers certified NFC Type 2 communication and factory-calibrated thermal accuracy across −40 °C to +85 °C.
How does the NHS3100W8/A1V handle power sourcing?
The NHS3100W8/A1V automatically selects between VDDBAT (1.72–3.6 V) and NFC-field power using an internal PMU source selector. When both sources are present, VDDBAT takes priority; if VDDBAT drops below threshold, it seamlessly switches to NFC power. In Battery-off mode, the NHS3100W8/A1V draws less than 50 nA - enabling multi-year shelf life. Activation occurs via RESETN edge or NFC field detection, initiating a ~2.5 ms power-up sequence.
Can the NHS3100W8/A1V operate without a battery?
Yes, the NHS3100W8/A1V operates fully in NFC-only mode using power harvested from the RF field - supporting passive temperature readout and limited logging. However, sustained operation (e.g., continuous sampling or firmware execution) requires battery backup. The NHS3100W8/A1V's dual-power architecture allows hybrid use: NFC for data retrieval and battery for background logging - all managed autonomously by the integrated PMU without host intervention.
What are the key differences between NHS3100W8/A1V and NHS3100UK?
The NHS3100W8/A1V is a bumped die (SOT1870-1) with 8 functional bumps optimized for direct die bonding onto flexible foils or antennas. The NHS3100UK uses a WLCSP25 package (2.51 × 2.51 × 0.5 mm) with 25 solder balls, providing full 12-pin GPIO access and easier PCB assembly. Both share identical silicon functionality, memory, and sensor specs - but the NHS3100W8/A1V achieves thinner profiles (<0.2 mm total) essential for label-integrated smart packaging, while NHS3100UK suits board-level designs needing debug and routing flexibility.
Is the NHS3100W8/A1V NFC Forum certified?
Yes, the NHS3100W8/A1V is NFC Forum Type 2 certified under certification ID 58516 (as of September 22, 2017). This certification confirms interoperability with standard NFC readers and smartphones supporting ISO 14443 Type A, including Android Beam, iOS Core NFC, and Windows Phone NFC stacks. The NHS3100W8/A1V implements the full Type 2 Tag Operation specification, enabling reliable memory read/write and NDEF message exchange without proprietary drivers.
NHS3100W8/A1V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Reader/Transponder
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443, NFC
- Interface:
- I2C
- Voltage - Supply:
- 1.72V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
NHS3100W8/A1V FAQ
1.How can I place an order for NHS3100W8/A1V through Aetrix?
Please submit a Request for Quotation (RFQ) for NHS3100W8/A1V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NHS3100W8/A1V reliable?
The price and inventory of NHS3100W8/A1V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NHS3100W8/A1V is usually 5 days.
3.What payment methods are accepted for NHS3100W8/A1V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NHS3100W8/A1V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NHS3100W8/A1V?
NHS3100W8/A1V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NHS3100W8/A1V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NHS3100W8/A1V?
For technical support, including NHS3100W8/A1V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NHS3100W8/A1V requirements.
6.How does Aetrix verify that NHS3100W8/A1V is sourced from the original manufacturer or authorized distributors?
All NHS3100W8/A1V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NHS3100W8/A1V meets industry standards.
7.What is the process for return or replacement of NHS3100W8/A1V?
All NHS3100W8/A1V units undergo pre-shipment inspection (PSI). If there is an issue with NHS3100W8/A1V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NHS3100W8/A1V part is unused and in its original packaging.
Return procedure for NHS3100W8/A1V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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