Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas NNCD3.9D-T1-AT

Part No.:
NNCD3.9D-T1-AT
Manufacturer:
Renesas
Category:
TVS Diodes
Package:
SC-76, SOD-323
Datasheet:
AetrixNNCD3.9D-T1-AT.pdf
Description:
NNCD3.9D-T1-AT - ELECTROSTATIC D
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:15,000

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

NNCD3.9D-T1-AT from Renesas Electronics is a 2-pin electrostatic discharge (ESD) noise clipping diode in Super Mini Mold package, rated for 200 mW power dissipation, with 3.7–4.1 V breakdown voltage, ≤130 Ω dynamic impedance at 5 mA, and 200 pF capacitance at 1.0 V reverse bias - deployed for ESD protection on external interface circuits such as parallel printer ports and CD-ROM connections.

For engineers reviewing the NNCD3.9D-T1-AT datasheet, NNCD3.9D-T1-AT pinout, NNCD3.9D-T1-AT application, or NNCD3.9D-T1-AT equivalent, key selection criteria include IEC 1000-4-2 compliance (≥30 kV ESD endurance), low clamping impedance under transient surge, junction temperature limit of 150 °C, and suitability for high-capacitance-tolerant signal lines in consumer electronics interfaces.

Technical Context

This device operates as a bidirectional voltage-clamping diode, leveraging avalanche breakdown to shunt ESD transients away from sensitive circuitry. Its 200 pF capacitance and ≤130 Ω dynamic impedance ensure effective suppression of fast-rising ESD pulses while maintaining signal integrity on low-speed parallel interfaces.

Designed for single-pulse surge handling up to 85 W (10 µs pulse width), it relies on thermal mass of the Super Mini Mold package to limit junction temperature rise during transient events. The 3.7–4.1 V breakdown range targets protection of 3.3 V logic-level interfaces without false triggering during normal operation.

Key Specifications

ParameterValue and Actual Design Meaning
Breakdown Voltage3.7–4.1 V at 5 mA - sets clamping threshold above 3.3 V rail but below damage threshold of downstream IC inputs.
Dynamic Impedance≤130 Ω at 5 mA - ensures low-voltage overshoot during ESD event by limiting clamping voltage rise.
Capacitance200 pF at 1.0 V reverse bias - acceptable for parallel bus and low-frequency interface protection, not suitable for USB or HDMI.
ESD Withstand≥30 kV per IEC 1000-4-2 - validated for contact and air-discharge immunity in consumer-grade equipment.
Power Dissipation200 mW continuous - defines maximum steady-state thermal load; transient surge rating is separate (85 W/10 µs).
Junction Temperature150 °C max - constrains PCB layout and ambient operating conditions in enclosed consumer enclosures.

Pinout & Package

Package: Super Mini Mold (SMD), 2-pin, cathode-indicated marking, dimensions 2.5 ± 0.15 mm × 1.25 ± 0.1 mm × 0.3 ± 0.05 mm.

Pin/TerminalCircuit RoleDesign Meaning
AnodeCurrent entry during forward conductionConnected to protected signal line; conducts during positive ESD transients.
CathodeCurrent exit during forward conduction; marked on packageConnected to ground or reference plane; completes clamping path for both polarities via series-back-to-back configuration.

Key Features

FeatureDesign Value
IEC 1000-4-2 compliant ESD protectionValidated ≥30 kV contact/air discharge endurance - meets baseline immunity requirement for CE-marked consumer devices.
Low dynamic impedance clamping≤130 Ω at 5 mA - minimizes peak clamping voltage (VCL = VBR + IPP × ZZ) during 8/20 µs surges.
Wide breakdown voltage range coverage3.3 V to 12 V variants available - enables precise matching to system supply rails (e.g., NNCD3.9D-T1-AT for 3.3 V I/O).
200 mW power rating in compact SMD packageSuper Mini Mold footprint supports high-density PCB layouts without thermal derating penalties in ambient ≤75 °C.

Applications

Parallel Printer Interface ProtectionCD-ROM Drive Data Bus Protection

Use Scenario: Protecting 8-bit parallel data lines between PC motherboard and legacy dot-matrix or inkjet printer.

IC Role / Device Role / Timing Role: Bidirectional voltage clamp placed between each data line and chassis ground to divert ESD energy before reaching host controller GPIO.

Use Value: Prevents latch-up or gate oxide damage in 3.3 V tolerant parallel port drivers during user-handling events (e.g., cable insertion/removal).

Use Scenario: Shielding ATAPI/IDE data bus lines connecting CD-ROM drive to motherboard southbridge.

IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor on each signal line (D0–D7, IORD#, IOWR#) referenced to common ground plane.

Use Value: Maintains signal edge integrity at ≤10 MHz transfer rates while surviving repeated 30 kV contact discharges per IEC standard.

Consumer Audio Equipment Line-In PortIndustrial Panel PC External I/O Connector

Use Scenario: Guarding unbalanced analog audio input jacks on home theater receivers against user-induced static discharge.

IC Role / Device Role / Timing Role: Clamping diode pair (anode-to-line, cathode-to-ground) on left/right channel inputs to limit differential and common-mode transients.

Use Value: Eliminates audible pop/crackle during jack insertion and prevents op-amp input stage damage without degrading 20 Hz–20 kHz frequency response.

Use Scenario: Hardening DB9/DB25 serial and parallel ports on industrial panel PCs exposed to factory-floor ESD events.

IC Role / Device Role / Timing Role: Discrete ESD protection element mounted directly at connector footprint, minimizing trace inductance in clamping path.

Use Value: Enables reliable operation in EN 61000-4-2 Level 4 environments (8 kV contact / 15 kV air) without requiring multi-stage TVS arrays.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor NSVL3.3DWT1G3.3 V nominal breakdown, 150 pF capacitance, same 200 mW rating and SOD-323 packageBetter suited for 3.3 V-only systems where tighter VBR tolerance reduces false triggering riskSelect when lower clamping voltage is prioritized over margin for process variation
Vishay SMAJ3.3A3.3 V standoff, 400 W peak pulse power, DO-214AC package, higher capacitance (~400 pF)Targeted at higher-energy surge events (e.g., lightning-induced), not optimized for high-speed signal linesChoose only for non-data-line protection where board space allows larger package and higher capacitance is acceptable

Compared with NNCD3.9D-T1-AT, NSVL3.3DWT1G offers tighter breakdown control for precision 3.3 V rail protection, while SMAJ3.3A trades signal integrity for higher surge robustness - making NNCD3.9D-T1-AT optimal for cost-sensitive, space-constrained parallel interface ESD hardening where 200 pF capacitance is permissible.

Availability

NNCD3.9D-T1-AT is available at Aetrix Electronics and suitable for parallel printer interfaces, CD-ROM drive data buses, consumer audio line-in ports, and industrial panel PC external I/O connectors requiring stable component supply across long-lifecycle consumer and industrial programs.

Supply support for NNCD3.9D-T1-AT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer formed in 2010 through merger of NEC Electronics and Renesas Technology, specializing in microcontrollers, analog, and power devices for automotive, industrial, and consumer markets.

The NNCD series was developed by Renesas (formerly NEC) specifically for cost-effective, surface-mount ESD protection of low-speed external interfaces in Standard-grade consumer electronics - emphasizing manufacturability, IEC compliance, and thermal reliability in compact packages.

FAQ

What is the maximum ESD voltage that NNCD3.9D-T1-AT can withstand per IEC 1000-4-2?

NNCD3.9D-T1-AT is rated for ≥30 kV ESD withstand voltage under both contact and air discharge test conditions per IEC 1000-4-2. This rating is verified using standardized 150 pF/330 Ω network and applies to single-pulse events. The device achieves this performance through controlled avalanche breakdown and low dynamic impedance, ensuring consistent clamping behavior across production lots.

Does NNCD3.9D-T1-AT require external biasing or control signals to operate?

No, NNCD3.9D-T1-AT is a passive, two-terminal device requiring no external bias, power, or control signals. It functions automatically as a voltage-clamping element: conducting when reverse voltage exceeds its 3.7–4.1 V breakdown range or forward voltage exceeds ~0.7 V. Its operation is intrinsic to the PN junction physics and does not depend on supporting circuitry.

Can NNCD3.9D-T1-AT be used for protecting USB 2.0 data lines?

No, NNCD3.9D-T1-AT is not suitable for USB 2.0 data line protection due to its 200 pF capacitance, which exceeds the 10 pF maximum recommended for full-speed (12 Mbps) and high-speed (480 Mbps) differential signaling. Using NNCD3.9D-T1-AT on USB lines would degrade signal integrity, increase bit error rate, and likely cause enumeration failures. Dedicated low-capacitance ESD arrays (e.g., <5 pF) are required instead.

What is the thermal resistance (θJA) of NNCD3.9D-T1-AT in typical PCB mounting?

The datasheet does not specify θJA for NNCD3.9D-T1-AT. However, Figure 1 shows power derating versus ambient temperature, indicating 200 mW rating at TA = 25 °C and zero dissipation at TA = 150 °C - implying an effective θJA of approximately 625 °C/W on a standard 30 × 30 × 1.6 mm glass-epoxy PCB. Actual thermal performance depends on copper area, layer count, and airflow.

Is NNCD3.9D-T1-AT compliant with RoHS and lead-free soldering requirements?

Yes, NNCD3.9D-T1-AT complies with EU RoHS Directive 2011/65/EU and is compatible with lead-free reflow soldering profiles (JEDEC J-STD-020). Renesas confirms halogen-free and lead-free construction for this part, with termination finish specified as matte tin. No exemptions apply, and material declarations are available upon request through Renesas' environmental compliance portal.

NNCD3.9D-T1-AT Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
SC-76, SOD-323
Series:
-
Packaging:
Bulk
Product Status:
Obsolete
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
1V (Max)
Voltage - Breakdown (Min):
3.7V
Voltage - Clamping (Max) @ Ipp:
-
Current - Peak Pulse (10/1000µs):
-
Power - Peak Pulse:
85W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
200pF @ 1MHz
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
2-Super Mini Mold

NNCD3.9D-T1-AT FAQ

1.How can I place an order for NNCD3.9D-T1-AT through Aetrix?

Please submit a Request for Quotation (RFQ) for NNCD3.9D-T1-AT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NNCD3.9D-T1-AT reliable?

The price and inventory of NNCD3.9D-T1-AT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NNCD3.9D-T1-AT is usually 5 days.

3.What payment methods are accepted for NNCD3.9D-T1-AT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NNCD3.9D-T1-AT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NNCD3.9D-T1-AT?

NNCD3.9D-T1-AT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NNCD3.9D-T1-AT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NNCD3.9D-T1-AT?

For technical support, including NNCD3.9D-T1-AT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NNCD3.9D-T1-AT requirements.

6.How does Aetrix verify that NNCD3.9D-T1-AT is sourced from the original manufacturer or authorized distributors?

All NNCD3.9D-T1-AT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NNCD3.9D-T1-AT meets industry standards.

7.What is the process for return or replacement of NNCD3.9D-T1-AT?

All NNCD3.9D-T1-AT units undergo pre-shipment inspection (PSI). If there is an issue with NNCD3.9D-T1-AT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NNCD3.9D-T1-AT part is unused and in its original packaging.

Return procedure for NNCD3.9D-T1-AT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

NNCD3.9D-T1-AT Tags

  • NNCD3.9D-T1-AT
  • NNCD3.9D-T1-AT PDF
  • NNCD3.9D-T1-AT Datasheet
  • NNCD3.9D-T1-AT Specifications
  • NNCD3.9D-T1-AT Images
  • Renesas
  • Renesas NNCD3.9D-T1-AT
  • Buy NNCD3.9D-T1-AT
  • NNCD3.9D-T1-AT Price
  • NNCD3.9D-T1-AT Distributor
  • NNCD3.9D-T1-AT Supplier
  • NNCD3.9D-T1-AT Wholesale
Related Products
ESD9B5.0ST5G
ESD9B5.0ST5G

onsemi

DESD3V3E1BL-7B
DESD3V3E1BL-7B

Diodes Incorporated

ESD5Z3.3T1G
ESD5Z3.3T1G

onsemi

D5V0H1B2LP-7B
D5V0H1B2LP-7B

Diodes Incorporated

D5V0P1B2LP-7B
D5V0P1B2LP-7B

Diodes Incorporated

DESD5V0U1BA-7
DESD5V0U1BA-7

Diodes Incorporated

ESD5Z5.0T1G
ESD5Z5.0T1G

onsemi

DESD5V0U1BB-7
DESD5V0U1BB-7

Diodes Incorporated

D12V0L1B2LP-7B
D12V0L1B2LP-7B

Diodes Incorporated

PESD2V0Y1BSFYL
PESD2V0Y1BSFYL

Nexperia USA Inc.

DF2S5M4CT,L3F
DF2S5M4CT,L3F

Toshiba Semiconductor and Storage

D5V0L1B2WS-7
D5V0L1B2WS-7

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER