onsemi NSPU3061N2T5G
- Part No.:
- NSPU3061N2T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XDFN
- Datasheet:
-
NSPU3061N2T5G.pdf
- Description:
- TVS DIODE 6.3VWM 10.4VC 2X2DFN
- Quantity:
- Payment:

- Shipping:

Inventory:55,443
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Product details
Overview
NSPU3061N2T5G from onsemi is a unidirectional ESD and surge protection diode designed for I/O line protection in portable electronics. It features 6.3 V working peak reverse voltage, ±30 kV IEC 61000−4−2 contact ESD rating, 36 A 8/20 µs surge current capability, 90–110 pF junction capacitance, and X2DFN2 (1.0 mm × 0.6 mm) package - optimized for USB VBUS/CC, microphone, and GPIO lines in space-constrained designs.
For engineers reviewing the NSPU3061N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include clamping voltage under 8 A TLP (6.4 V), low leakage (<1 µA at 6.3 V), dynamic resistance (0.025 Ω), IEC 61000−4−5 lightning robustness, and RoHS-compliant Pb-free packaging.
Technical Context
The NSPU3061N2T5G operates as a single-channel, cathode-to-GND unidirectional TVS diode with avalanche breakdown triggering. Its clamping behavior is characterized via TLP (100 ns pulse, Z₀ = 50 Ω) and IEC 61000−4−2 waveforms, delivering sub-7.7 V clamping at 36 A (8/20 µs) and 6.4 V at 8 A TLP - meeting Level 4 ESD immunity requirements.
It exhibits low dynamic resistance (0.025 Ω) and tight capacitance control (90–110 pF @ 1 MHz, 0 V), enabling high-speed signal integrity preservation on data lines like USB CC and audio paths without signal distortion or timing skew.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 6.3 V - defines maximum continuous DC bias before leakage rises significantly; sets upper limit for protected line voltage. |
| Clamping Voltage @ 8 A TLP | 6.4 V - voltage seen by downstream IC during ±4 kV ESD event; ensures safe margin below typical 6.5 V I/O absolute max ratings. |
| Peak Pulse Current (8/20 µs) | 36 A - withstands IEC 61000−4−5 lightning surges up to 36 A without failure; validated per Figure 1 waveform. |
| Junction Capacitance | 90–110 pF @ 1 MHz - low enough for USB 2.0 and analog audio lines; avoids signal attenuation or rise-time degradation. |
| ESD Rating (IEC 61000−4−2) | ±30 kV contact - exceeds Level 4 requirement; protects against direct human-body discharge in handheld devices. |
| Dynamic Resistance | 0.025 Ω - enables fast, low-impedance clamping; minimizes voltage overshoot during fast-rising ESD transients. |
| Leakage Current @ VRWM | ≤1 µA - prevents battery drain in always-on portable circuits; critical for mic bias and low-power GPIO protection. |
Pinout & Package
NSPU3061N2T5G is housed in the X2DFN2 surface-mount package (1.0 mm × 0.6 mm × 0.37 mm, 0.65 mm pitch), featuring two terminals in a cathode-anode configuration. The compact outline supports high-density PCB layouts in smartphones, tablets, and wearables.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | Ground Reference Terminal | Connected to system GND; provides return path for ESD current; must be low-inductance connection to maintain clamping performance. |
| 2 (Anode) | I/O Line Terminal | Connected to protected signal line (e.g., USB VBUS); conducts transient current to GND when voltage exceeds VRWM + VBR. |
Key Features
| Feature | Design Value |
|---|---|
| Low Clamping Voltage | 6.4 V @ 8 A TLP - keeps protected IC pins below damage threshold during common ESD events. |
| Ultra-Low Leakage | <1 µA @ 6.3 V - eliminates standby power loss in battery-powered microphone and sensor interfaces. |
| Small Footprint | 1.0 mm × 0.6 mm - saves >50% board area vs. SOD-323; enables routing under connectors and narrow flex traces. |
| IEC 61000−4−5 Compliance | 36 A (8/20 µs) - meets industrial surge immunity requirements for USB ports and external I/Os. |
| Pb-Free & RoHS | Halogen-free/BFR-free construction - satisfies global environmental compliance and reflow compatibility. |
Applications
| USB VBUS and CC Line Protection | Microphone Line Protection |
|---|---|
Use Scenario: Protecting USB Type-C VBUS (5 V) and Configuration Channel (CC) lines from ESD during cable insertion and hot-plug events in smartphones and accessories. IC Role / Device Role / Timing Role: Unidirectional TVS diode placed between VBUS/CC and GND; clamps transients within nanoseconds while maintaining DC blocking. Use Value: Prevents latch-up or oxide damage in USB controller ICs by limiting peak voltage to ≤6.4 V during ±8 kV contact discharge. | Use Scenario: Shielding electret microphone bias lines (2.5–3.3 V) from ESD induced by user handling or connector mating in earbuds and voice assistants. IC Role / Device Role / Timing Role: Low-capacitance, low-leakage clamp on MIC_BIAS rail; preserves signal-to-noise ratio and DC bias stability. Use Value: Maintains <1 µA leakage to avoid mic bias shift and delivers 90–110 pF capacitance that does not attenuate 20 Hz–20 kHz audio band. |
| GPIO Protection | Industrial Sensor Interface Protection |
Use Scenario: Safeguarding general-purpose I/O pins of microcontrollers and PMICs exposed to user touch or board-level handling in IoT edge nodes and wearables. IC Role / Device Role / Timing Role: Standalone ESD shunt on each GPIO; placed directly at connector or button switch to minimize trace inductance. Use Value: Enables robust ±30 kV contact ESD immunity without adding series resistance or degrading digital edge rates up to 10 MHz. | Use Scenario: Protecting analog sensor inputs (e.g., temperature, humidity) connected to external headers in factory automation modules subject to maintenance-related ESD. IC Role / Device Role / Timing Role: Low-clamp, low-capacitance TVS on 0–5 V sensor output lines; co-located with input op-amp to reduce loop area. Use Value: Limits transient overvoltage to <7.7 V at 36 A surge, preventing op-amp saturation and ADC offset drift during field service events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar unidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5Z3.3T5G | 3.3 V VRWM, higher capacitance (130 pF), same X2DFN2 package | Better suited for 3.3 V logic rails; less appropriate for 5 V USB VBUS due to lower breakdown margin | Select when protecting sub-3.6 V I/Os where tighter voltage matching reduces clamping overhead |
| SP1001-01UTG | 6.5 V VRWM, 100 pF capacitance, SOD-523 package (1.3 mm × 0.85 mm) | Larger footprint; slightly higher clamping (7.0 V @ 8 A); same IEC 61000−4−2 rating | Choose if board layout allows larger package and requires legacy footprint compatibility |
Compared with ESD5Z3.3T5G and SP1001-01UTG, the NSPU3061N2T5G offers optimal balance of 6.3 V VRWM headroom for 5 V systems, industry-leading 6.4 V TLP clamping, and smallest available footprint - making it preferred for next-gen compact USB and audio interfaces.
Availability
NSPU3061N2T5G is available at Aetrix Electronics and suitable for USB Type-C interface protection, portable audio subsystems, and microcontroller GPIO hardening requiring stable component supply across high-mix consumer electronics production.
Supply support for NSPU3061N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient technologies for automotive, industrial, cloud, and intelligent edge applications.
The NSPU3061N2T5G belongs to onsemi's precision ESD protection portfolio, engineered specifically for high-density portable electronics where minimal capacitance, ultra-low leakage, and sub-7 V clamping are mandatory for signal integrity and reliability.
FAQ
What is the maximum working voltage supported by the NSPU3061N2T5G?
The NSPU3061N2T5G has a working peak reverse voltage (VRWM) of 6.3 V, meaning it can safely protect signal lines operating up to 6.3 V DC without significant leakage. This makes it ideal for 5 V USB VBUS and 3.3 V–5 V GPIO applications. Exceeding 6.3 V risks increased reverse current and potential thermal stress. The NSPU3061N2T5G datasheet specifies VRWM under TA = 25°C conditions with tight tolerance control.
Does the NSPU3061N2T5G meet IEC 61000−4−2 Level 4 ESD requirements?
Yes, the NSPU3061N2T5G is rated for ±30 kV contact discharge per IEC 61000−4−2 Level 4 - the highest standard level for system-level ESD immunity. This rating is verified using standardized test setups per Figure 14 in the official datasheet. The NSPU3061N2T5G achieves this through low dynamic resistance and fast avalanche response, ensuring reliable clamping during real-world human-body model discharges.
What is the junction capacitance of the NSPU3061N2T5G and why does it matter?
The NSPU3061N2T5G exhibits 90–110 pF junction capacitance at 0 V bias and 1 MHz, measured per Table 3 in the datasheet. This low, controlled capacitance prevents signal integrity degradation on high-speed or analog lines - such as USB CC or microphone bias paths - where excessive capacitance would cause rise-time slowing or frequency roll-off. The NSPU3061N2T5G maintains this spec across its operating temperature range.
Can the NSPU3061N2T5G be used for bidirectional protection?
No, the NSPU3061N2T5G is a unidirectional ESD protection device, configured with cathode tied to ground and anode connected to the protected line. It only clamps positive transients above VRWM + VBR and does not protect against negative excursions beyond −0.7 V (forward conduction). For bidirectional protection, a different device such as the ESD7L5.0D is required. The NSPU3061N2T5G pinout and electrical characteristics confirm strict unidirectional operation.
What package type does the NSPU3061N2T5G use and what are its dimensions?
The NSPU3061N2T5G uses the X2DFN2 package (Case 714AB), measuring 1.0 mm × 0.6 mm × 0.37 mm with 0.65 mm terminal pitch. This ultra-compact, two-terminal DFN format enables placement directly at I/O connectors and under fine-pitch components. The NSPU3061N2T5G marking "6M" corresponds to date code and device variant per the onsemi marking diagram in the datasheet.
NSPU3061N2T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 6.3V (Max)
- Voltage - Breakdown (Min):
- 6.4V
- Voltage - Clamping (Max) @ Ipp:
- 10.4V
- Current - Peak Pulse (10/1000µs):
- 30A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 90pF @ 1MHz
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X2DFN (1x0.6)
NSPU3061N2T5G FAQ
1.How can I place an order for NSPU3061N2T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for NSPU3061N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NSPU3061N2T5G reliable?
The price and inventory of NSPU3061N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NSPU3061N2T5G is usually 5 days.
3.What payment methods are accepted for NSPU3061N2T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NSPU3061N2T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NSPU3061N2T5G?
NSPU3061N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NSPU3061N2T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NSPU3061N2T5G?
For technical support, including NSPU3061N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NSPU3061N2T5G requirements.
6.How does Aetrix verify that NSPU3061N2T5G is sourced from the original manufacturer or authorized distributors?
All NSPU3061N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NSPU3061N2T5G meets industry standards.
7.What is the process for return or replacement of NSPU3061N2T5G?
All NSPU3061N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with NSPU3061N2T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NSPU3061N2T5G part is unused and in its original packaging.
Return procedure for NSPU3061N2T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NSPU3061N2T5G Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
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