onsemi NSPU5132MUTBG
- Part No.:
- NSPU5132MUTBG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 6-UFDFN Exposed Pad
- Datasheet:
-
NSPU5132MUTBG.pdf
- Description:
- TVS DIODE 13.5VWM 24VC 6UDFN
- Quantity:
- Payment:

- Shipping:

Inventory:11,946
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Product details
Overview
NSPU5132MUTBG from onsemi is a unidirectional ESD and surge protection diode designed for 13.5 V supply rail clamping, with 200 A peak pulse current (8/20 µs), 17.5 V max clamping voltage, 13.5 V working reverse voltage, and 1325 pF junction capacitance at 0 V. It protects USB, HDMI, and industrial I/O interfaces against IEC61000-4-2 Level 4 (±30 kV contact) and IEC61000-4-5 surges.
For engineers reviewing the NSPU5132MUTBG datasheet, pinout, applications, or equivalent options, key selection criteria include VRWM ≥13.5 V, VC ≤17.5 V @ 200 A, low leakage (<0.5 µA), thermal stability over –55°C to +125°C, and UDFN6 package compatibility with high-density PCB layouts.
Technical Context
This device implements a high-voltage Zener-based unidirectional clamping architecture optimized for DC supply rail protection. It operates in avalanche breakdown above VRWM (13.5 V), delivering precise clamping at 15.5 V typical and 17.5 V maximum under 200 A transient stress.
The UDFN6 package integrates four anode-connected VCC pins (1–4) and four cathode-connected GND pins (5–8), with an exposed die attach pad (DAP) requiring grounding for thermal and electrical performance. Junction capacitance of 1325 pF limits use to sub-100 MHz signal paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 13.5 V - Maximum continuous DC operating voltage before clamping initiates |
| VC @ IPP | 17.5 V max @ 200 A - Clamping voltage during worst-case 8/20 µs surge, limiting downstream IC stress |
| VBR @ IT | 13.6 V min @ 1 mA - Verified breakdown threshold ensuring reliable turn-on margin above VRWM |
| IPP | 200 A - Peak surge current capability per IEC61000-4-5, defining robustness against lightning-induced transients |
| CJ | 1325 pF max @ 0 V, 1 MHz - Capacitance loading on protected line; suitable for USB 2.0 but not USB 3.0 or HDMI 2.0 |
| IR @ VRWM | 0.5 µA max - Low leakage preserves power integrity in always-on 13.5 V rails |
| Operating Temp | –55°C to +125°C - Validated for automotive under-hood and industrial control environments |
Pinout & Package
NSPU5132MUTBG is housed in a 6-pin UDFN package (Case 517CS), measuring 1.8 mm × 2.0 mm × 0.55 mm, with an exposed die attach pad (DAP) on the bottom surface that must be soldered to a grounded copper area for thermal dissipation and optimal clamping response.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–4 (VCC) | Cathode | Connected to protected supply rail (e.g., 13.5 V); all four pins are internally tied and must be routed to same net |
| 5–8 (GND) | Anode | Internally common anode node; requires low-inductance connection to system ground plane |
| DAP (bottom) | Thermal & Electrical Ground | Exposed copper pad; must be soldered to ≥100 mm² solid ground pour for thermal relief and ESD path integrity |
Key Features
| Feature | Design Value |
|---|---|
| IEC61000-4-2 Level 4 ESD Protection | ±30 kV contact discharge immunity - meets industrial and automotive EMC requirements without external shielding |
| High Surge Current Rating | 200 A peak (8/20 µs) - withstands severe lightning-induced surges in outdoor or factory-floor equipment |
| Low Clamping Voltage | 15.5 V typical VC - ensures protected ICs (e.g., 16 V-rated LDOs or microcontrollers) remain within safe operating area |
| Pb-Free & RoHS Compliant | Meets EU Directive 2011/65/EU - supports green manufacturing and export compliance for global OEMs |
| Compact UDFN6 Footprint | 1.8 mm × 2.0 mm - enables placement directly at connector entry points with minimal PCB real estate impact |
Applications
| Industrial I/O Protection | Automotive Body Control Module |
|---|---|
Use Scenario: Protecting 12–14 V CAN/LIN bus interface lines and sensor supply rails in PLCs and motor drives exposed to load dump and ESD. IC Role / Device Role / Timing Role: Unidirectional rail clamp placed between power input and local regulator, absorbing transients before they reach sensitive analog front-ends. Use Value: Prevents latch-up and permanent damage in 13.5 V systems subjected to ISO 7637-2 Pulse 5a (load dump) and IEC61000-4-2 events. | Use Scenario: Safeguarding 13.5 V supply inputs to door module MCUs and LED drivers in passenger vehicles. IC Role / Device Role / Timing Role: Primary surge suppressor on battery-fed rails, coordinated with TVS arrays for multi-stage protection. Use Value: Enables compliance with ISO 16750-2 (electrical loads) and reduces field failure rates due to roadside ESD or jump-start transients. |
| USB 2.0 Port Protection | Industrial Camera Interface |
Use Scenario: Clamping VBUS line in embedded USB host ports on medical or test equipment where hot-plug ESD is frequent. IC Role / Device Role / Timing Role: Standalone unidirectional protector on 5 V-derived 13.5 V auxiliary rail powering USB PHY or level shifters. Use Value: Maintains signal integrity (1325 pF compatible with 480 Mbps signaling) while blocking >30 kV contact discharges. | Use Scenario: Protecting 13.5 V power input to GigE Vision or CoaXPress camera modules mounted in factory automation cells. IC Role / Device Role / Timing Role: First-line defense against cable-borne surges induced by nearby welding or motor switching. Use Value: Eliminates need for bulky discrete MOV+Zener stacks; single-device solution reduces BOM count and layout complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar unidirectional surge protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ13A | DO-214AC package; 13 V VRWM; 200 A IPP; 21.5 V VC max - higher clamping voltage and larger footprint | Used in through-hole or high-power board-level designs where UDFN6 thermal constraints are unacceptable | Select when board space allows larger package and higher VC is tolerable for downstream 24 V tolerant ICs |
| SMF13A | SOD-123FL package; 13 V VRWM; 100 A IPP; 20.9 V VC max - half the surge rating and 2× higher clamping than NSPU5132MUTBG | Suitable for cost-sensitive consumer electronics with lower surge exposure (IEC61000-4-2 Level 2 only) | Choose only if system-level testing confirms 100 A surge immunity is sufficient and layout permits SOD-123FL placement |
Compared with SMAJ13A and SMF13A, NSPU5132MUTBG delivers superior clamping performance (17.5 V vs. ≥20.9 V), smaller size (UDFN6 vs. DO-214AC/SOD-123FL), and verified suitability for high-reliability 13.5 V rail protection - making it optimal for space-constrained industrial and automotive modules requiring robust Level 4 ESD immunity.
Availability
NSPU5132MUTBG is available at Aetrix Electronics and suitable for industrial I/O protection, automotive body control modules, and USB 2.0 port hardening requiring stable component supply across long-lifecycle programs.
Supply support for NSPU5132MUTBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensors, and logic solutions for automotive, industrial, cloud, and IoT applications.
NSPU5132MUTBG belongs to onsemi's transient voltage suppression (TVS) diode product line, engineered specifically for compact, high-current unidirectional clamping in 12–15 V automotive and industrial power rails.
FAQ
What is the maximum clamping voltage of NSPU5132MUTBG under full-rated surge current?
The NSPU5132MUTBG has a maximum clamping voltage (VC) of 17.5 V when subjected to its rated 200 A peak pulse current (8/20 µs waveform). This value is guaranteed across temperature and process variation per onsemi's datasheet Table 2, ensuring protected circuitry remains below critical overvoltage thresholds during worst-case transients.
Can NSPU5132MUTBG be used for bidirectional signal line protection?
No, NSPU5132MUTBG is strictly unidirectional and intended only for DC supply rail protection. Its internal Zener structure conducts only when the anode (pins 5–8) is at lower potential than the cathode (pins 1–4). For bidirectional data lines like USB D+/D− or RS-485, a dedicated bidirectional TVS such as ESD7L5.0T1G is required instead of NSPU5132MUTBG.
How should the exposed die attach pad (DAP) on NSPU5132MUTBG be connected?
The DAP on NSPU5132MUTBG must be soldered to a solid, low-impedance ground plane using a minimum 100 mm² copper area. Thermal vias (≥4× 0.3 mm diameter) should connect the DAP pad to inner-layer ground planes. This connection is essential for both heat dissipation during surge events and maintaining low-inductance ESD current paths - failure to ground the DAP degrades clamping performance and risks thermal runaway.
Is NSPU5132MUTBG compliant with automotive AEC-Q200 qualification?
No, NSPU5132MUTBG is not AEC-Q200 qualified. While it operates from –55°C to +125°C and meets IEC61000-4-2/4-5, onsemi does not list it in their AEC-Q200 stress-tested portfolio. For automotive-critical applications requiring AEC-Q200, consider alternatives like SZ1.5SMC13A or NUP4105MR6T1G - NSPU5132MUTBG is intended for industrial-grade reliability, not automotive safety-critical systems.
What is the junction capacitance of NSPU5132MUTBG and how does it affect high-speed signal lines?
NSPU5132MUTBG exhibits a maximum junction capacitance of 1325 pF at 0 V and 1 MHz. This value makes it unsuitable for high-speed differential interfaces (e.g., USB 3.0, HDMI, PCIe), where sub-2 pF loading is typical. It is appropriate for protecting low-frequency supply rails and slower single-ended buses like UART, CAN, or 10/100 Ethernet power inputs - always verify signal integrity impact via IBIS simulation before deploying NSPU5132MUTBG near active data paths.
NSPU5132MUTBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 6-UFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 13.5V (Max)
- Voltage - Breakdown (Min):
- 13.6V
- Voltage - Clamping (Max) @ Ipp:
- 24V
- Current - Peak Pulse (10/1000µs):
- 200A (8/20µs)
- Power - Peak Pulse:
- 4800W (4.8kW)
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 1325pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-UDFN (1.8x2)
NSPU5132MUTBG FAQ
1.How can I place an order for NSPU5132MUTBG through Aetrix?
Please submit a Request for Quotation (RFQ) for NSPU5132MUTBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NSPU5132MUTBG reliable?
The price and inventory of NSPU5132MUTBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NSPU5132MUTBG is usually 5 days.
3.What payment methods are accepted for NSPU5132MUTBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NSPU5132MUTBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NSPU5132MUTBG?
NSPU5132MUTBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NSPU5132MUTBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NSPU5132MUTBG?
For technical support, including NSPU5132MUTBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NSPU5132MUTBG requirements.
6.How does Aetrix verify that NSPU5132MUTBG is sourced from the original manufacturer or authorized distributors?
All NSPU5132MUTBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NSPU5132MUTBG meets industry standards.
7.What is the process for return or replacement of NSPU5132MUTBG?
All NSPU5132MUTBG units undergo pre-shipment inspection (PSI). If there is an issue with NSPU5132MUTBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NSPU5132MUTBG part is unused and in its original packaging.
Return procedure for NSPU5132MUTBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NSPU5132MUTBG Tags

-
ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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ESD5Z3.3T1G
onsemi

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D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

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D5V0L1B2WS-7
Diodes Incorporated
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