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onsemi NSPU5221MUTBG
- Part No.:
- NSPU5221MUTBG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 6-UFDFN Exposed Pad
- Datasheet:
-
NSPU5221MUTBG.pdf
- Description:
- TVS DIODE 22VWM 35VC 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,490
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Product details
Overview
NSPU5221MUTBG from onsemi is a unidirectional ESD and surge protection diode designed for I/O line protection in high-speed digital interfaces. It features a 20 V working peak reverse voltage (VRWM), clamps at ≤33 V under 100 A surge (8/20 µs), supports ±30 kV IEC61000-4-2 contact discharge, and is housed in a Pb-free 6-lead UDFN package (1.8 mm × 2.0 mm) with exposed die attach pad for thermal grounding. It is used in USB 2.0, HDMI, and industrial sensor interface protection.
For engineers reviewing the NSPU5221MUTBG datasheet, pinout, applications, or equivalent options, key selection criteria include clamping voltage at 100 A, thermal performance via DAP-to-GND connection, VRWM margin relative to signal swing, and compatibility with automated SMT assembly in space-constrained layouts.
Technical Context
The NSPU5221MUTBG implements a single-channel unidirectional TVS structure optimized for low-capacitance, low-clamping protection of DC-coupled data lines. Its breakdown voltage (VBR) is specified at 24–26 V (min–max @ 1 mA), with clamping voltage VC = 33 V max at IPP = 100 A (8/20 µs), ensuring robust transient suppression without signal distortion.
It operates across –55 °C to +125 °C and integrates an exposed die attach pad (DAP) that must be soldered to a solid ground plane to achieve rated thermal dissipation and clamping stability. The device is not intended for bidirectional or AC-coupled applications due to its unidirectional architecture and lack of symmetrical breakdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 20 V - Maximum continuous reverse operating voltage before leakage exceeds 1 µA; sets upper limit for protected signal swing. |
| VBR @ IT=1 mA | 24–26 V - Breakdown onset range; ensures reliable turn-on above normal signal peaks while avoiding false triggering. |
| VC @ IPP=100 A | ≤33 V - Clamping voltage during worst-case 8/20 µs surge; defines maximum stress seen by downstream IC. |
| IEC61000-4-2 ESD | ±30 kV contact - Validated immunity level; meets Level 4 for system-level ESD robustness in end equipment. |
| Package | UDFN6 (Case 517CS), 1.8 mm × 2.0 mm - Small-footprint, low-inductance surface-mount package with thermal DAP. |
| Operating Temp | –55 °C to +125 °C - Supports automotive under-hood and industrial control environments without derating. |
Pinout & Package
NSPU5221MUTBG is packaged in a 6-lead UDFN (Case 517CS), measuring 1.8 mm × 2.0 mm with 0.4 mm pitch. The exposed die attach pad (DAP) on the bottom surface must be connected to GND for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC (Pins 1,2) | Cathode | Connected to protected I/O line; reverse-biased during surge to clamp to GND. |
| GND (Pins 5,6,7,8) | Anode | Common return path for surge current; pins 5–8 and DAP must all connect to low-impedance ground plane. |
| N/C (Pins 3,4) | No Connect | Internally unconnected; left floating or tied to GND per layout best practice-no functional impact. |
Key Features
| Feature | Design Value |
|---|---|
| Unidirectional ESD Protection | Enables DC-coupled line protection without signal inversion or bias dependency; avoids capacitive loading issues of bidirectional devices. |
| Low Clamping Voltage (33 V @ 100 A) | Minimizes voltage overshoot during fast transients, protecting 3.3 V and 5 V logic interfaces without overvoltage damage. |
| Exposed Thermal Pad (DAP) | Reduces junction-to-board thermal resistance; enables sustained surge handling and stable clamping under repeated events. |
| Pb-Free / RoHS Compliant | Meets global environmental compliance requirements for industrial, medical, and consumer electronics manufacturing. |
Applications
| USB 2.0 Data Line Protection | HDMI TMDS Channel Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines in portable USB hosts and peripherals against ESD events during hot-plug insertion. IC Role / Device Role: Unidirectional TVS diode placed between connector and USB transceiver IC to shunt ESD current to chassis ground. Use Value: Maintains <0.5 pF line capacitance and clamps surges to ≤33 V, preserving signal integrity up to 480 Mbps without eye diagram degradation. | Use Scenario: Safeguarding HDMI source-side TMDS clock and data channels from electrostatic discharge in AV receivers and set-top boxes. IC Role / Device Role: Point-of-entry protection diode mounted directly at HDMI connector, with DAP thermally anchored to ground plane. Use Value: Withstands ±30 kV contact discharge and limits clamping to 33 V, preventing latch-up or gate oxide damage in HDMI PHY drivers. |
| Industrial Sensor Interface | Automotive Infotainment I/O |
Use Scenario: Shielding RS-485 or CAN FD transceiver I/O pins in factory automation controllers exposed to field wiring ESD. IC Role / Device Role: Secondary protection stage after primary common-mode choke, absorbing differential-mode surges up to 100 A (8/20 µs). Use Value: VRWM = 20 V accommodates 12 V supply-referenced sensor signals; thermal DAP sustains repeated surge events in unventilated enclosures. | Use Scenario: Protecting touch controller, display, and audio codec I/O lines in automotive head units subjected to ISO 10605 testing. IC Role / Device Role: ESD suppressor integrated into front-panel flex circuit routing, leveraging small UDFN footprint for tight board space. Use Value: Validated to –55 °C to +125 °C operation and ±30 kV ESD, meeting OEM requirements for cabin temperature zones and reliability validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5Z3.3T5G | Lower VRWM (3.3 V), higher capacitance (~15 pF), same UDFN package. | Suitable only for 3.3 V logic; not usable for 5 V or 12 V interfaces due to premature conduction. | Select only when protecting low-voltage, high-capacitance-tolerant lines like GPIO or I²C. |
| SMF20A | Higher power rating (200 W), DO-214AA package, no thermal pad, VRWM = 20 V. | Larger footprint and higher inductance limit use in >100 Mbps interfaces; better for board-edge surge entry points. | Prefer for cost-sensitive, lower-frequency industrial I/O where PCB area is less constrained. |
Compared with ESD5Z3.3T5G and SMF20A, the NSPU5221MUTBG uniquely balances 20 V VRWM, ultra-low clamping (33 V @ 100 A), and thermally enhanced UDFN packaging-making it optimal for compact, high-speed, mixed-voltage I/O protection where thermal management and signal fidelity are critical.
Availability
NSPU5221MUTBG is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI TMDS channel safeguarding, and industrial sensor I/O requiring stable component supply despite its discontinued status through legacy channel sourcing.
Supply support for NSPU5221MUTBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The NSPU5221MUTBG belongs to onsemi's ESD and Surge Protection Diode family, engineered specifically for high-speed digital interface protection with minimal signal distortion and robust thermal performance in miniaturized packages.
FAQ
Is NSPU5221MUTBG still in active production?
No, NSPU5221MUTBG is officially marked as discontinued by onsemi as of October 2025. However, Aetrix Electronics maintains access to remaining legacy inventory and qualified alternate sources with full traceability and compliance documentation for ongoing production needs.
What is the correct PCB layout recommendation for NSPU5221MUTBG's die attach pad?
The die attach pad (DAP) on NSPU5221MUTBG must be connected to a solid, low-impedance ground plane using ≥4 thermal vias (0.3 mm diameter, spaced evenly). This ensures effective heat dissipation during surge events and maintains clamping voltage stability across temperature and pulse repetition.
Can NSPU5221MUTBG protect bidirectional signals like I²C or UART?
No-NSPU5221MUTBG is unidirectional and only protects signals referenced to ground in one polarity. For bidirectional buses such as I²C or UART, a symmetric (bidirectional) TVS like ESD7L5.0DT5G is required; using NSPU5221MUTBG would block or distort negative-going signal excursions.
What is the maximum surge current NSPU5221MUTBG can handle without degradation?
NSPU5221MUTBG is rated for 100 A peak pulse current (8/20 µs waveform) per IEC61000-4-5. It withstands this stress without parameter shift when the DAP is properly grounded and ambient temperature remains ≤125 °C. Repeated surges require thermal recovery time to avoid cumulative junction heating.
Does NSPU5221MUTBG meet AEC-Q200 for automotive use?
NSPU5221MUTBG is not AEC-Q200 qualified. While it operates from –55 °C to +125 °C and passes IEC61000-4-2 Level 4, it lacks the stress test reporting (vibration, temperature cycling, humidity bias) required for automotive qualification. For AEC-Q200-compliant alternatives, consider onsemi's ESD7L5.0DQ1T5G.
NSPU5221MUTBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 6-UFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 22V
- Voltage - Breakdown (Min):
- 24V
- Voltage - Clamping (Max) @ Ipp:
- 35V
- Current - Peak Pulse (10/1000µs):
- 120A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-UDFN (1.8x2)
NSPU5221MUTBG FAQ
1.How can I place an order for NSPU5221MUTBG through Aetrix?
Please submit a Request for Quotation (RFQ) for NSPU5221MUTBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NSPU5221MUTBG reliable?
The price and inventory of NSPU5221MUTBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NSPU5221MUTBG is usually 5 days.
3.What payment methods are accepted for NSPU5221MUTBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NSPU5221MUTBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NSPU5221MUTBG?
NSPU5221MUTBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NSPU5221MUTBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NSPU5221MUTBG?
For technical support, including NSPU5221MUTBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NSPU5221MUTBG requirements.
6.How does Aetrix verify that NSPU5221MUTBG is sourced from the original manufacturer or authorized distributors?
All NSPU5221MUTBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NSPU5221MUTBG meets industry standards.
7.What is the process for return or replacement of NSPU5221MUTBG?
All NSPU5221MUTBG units undergo pre-shipment inspection (PSI). If there is an issue with NSPU5221MUTBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NSPU5221MUTBG part is unused and in its original packaging.
Return procedure for NSPU5221MUTBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NSPU5221MUTBG Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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