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NXP Semiconductors NT2H1311TTDUDZ
- Part No.:
- NT2H1311TTDUDZ
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
NT2H1311TTDUDZ.pdf
- Description:
- IC RFID READR/TRAN 13.56MZ WAFER
- Quantity:
- Payment:
- Shipping:
Inventory:4,948
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Product details
Overview
NT2H1311TTDUDZ from NXP Semiconductors is an NFC Forum Type 2 Tag compliant contactless IC designed for mass-market smart labeling and authentication applications. It delivers 144 bytes of user memory, 50 pF input capacitance, 13.56 MHz operating frequency, and full ISO/IEC 14443 Type A compliance - enabling integration into compact labels, business cards, and product authentication tags.
For engineers reviewing the NT2H1311TTDUDZ datasheet, NT2H1311TTDUDZ pinout, NT2H1311TTDUDZ application, or NT2H1311TTDUDZ equivalent, this page provides verified technical context, memory architecture details, security features (ECC originality signature, 7-byte UID, password protection), and real-world deployment constraints for NFC tag design and inlay manufacturing.
Technical Context
The NT2H1311TTDUDZ implements a fully autonomous RF interface with integrated rectifier, clock regenerator, and voltage regulator - requiring no external components beyond an antenna coil. Its digital control unit supports anticollision, FAST_READ command execution, and state-driven memory access across IDLE, READY1, READY2, ACTIVE, AUTHENTICATED, and HALT states.
Memory organization comprises 45 pages × 4 bytes (180 bytes total), with 144 bytes user-programmable, 26 bytes reserved for manufacturer data and configuration, and dedicated static lock bytes (page 02h) plus dynamic lock bytes (page 28h) for granular write protection. EEPROM endurance is rated at 100,000 write cycles with 10-year data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| User Memory | 144 bytes freely programmable read/write area - sufficient for standard NDEF records like URLs, text, or small authentication payloads. |
| Input Capacitance | 50 pF - enables compact antenna designs and supports ultrathin inlays (e.g., 75 µm wafer thickness). |
| Operating Frequency | 13.56 MHz - ensures interoperability with all NFC Forum–compliant readers and smartphones. |
| Data Rate | 106 kbit/s - matches ISO/IEC 14443-3A high-speed mode for fast tag interrogation in production environments. |
| UID Length | 7-byte unique identifier with two CRC check bytes - factory-programmed and read-only for secure device identification. |
| Security Features | ECC-based originality signature, 32-bit password protection, field-programmable page locking - prevents cloning and unauthorized memory modification. |
| EEPROM Endurance | 100,000 write cycles - supports repeated reprogramming in dynamic tagging applications such as shelf label updates. |
Pinout & Package
NT2H1311TTDUDZ is supplied in MOA8 plastic leadless module carrier package (SOT500-4), optimized for tape-and-reel automated assembly. The IC interfaces exclusively via two antenna terminals - no power supply pins or digital I/O are present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LA | Antenna connection LA | Primary RF terminal for coupling to printed loop antenna; forms resonant LC tank with external coil inductance. |
| LB | Antenna connection LB | Secondary RF terminal completing antenna interface; polarity-insensitive for flexible PCB layout routing. |
Key Features
| Feature | Design Value |
|---|---|
| FAST_READ command | Reads full NDEF message in one transaction - reduces reader overhead and accelerates high-throughput label encoding. |
| True anticollision | Enables simultaneous operation of multiple NT2H1311TTDUDZ tags in the same RF field - essential for retail shelf or logistics scanning. |
| UID ASCII mirror | Automatically serializes NDEF messages with unique device ID - eliminates need for external database lookups during NFC tap events. |
| NFC counter with ASCII mirror | Increments on each read command and embeds count into NDEF payload - supports usage tracking and anti-counterfeiting analytics. |
| 75 µm wafer thickness option | Enables embedding into ultra-thin media (e.g., magazines, gaming cards) without compromising RF performance or mechanical integrity. |
Applications
| Smart Advertisement | Product Authentication |
|---|---|
Use Scenario: NFC-enabled posters or packaging in out-of-home locations trigger mobile content delivery upon tap. IC Role / Device Role / Timing Role: NT2H1311TTDUDZ serves as passive, battery-free NDEF data carrier storing URL or deep-link payload. Use Value: 144-byte memory accommodates full HTTPS redirect URIs; 50 pF capacitance allows miniaturized antenna integration into thin paper substrates. |
Use Scenario: High-value consumer electronics use embedded NT2H1311TTDUDZ tags to verify genuine parts during service or repair. IC Role / Device Role / Timing Role: NT2H1311TTDUDZ stores ECC originality signature and immutable UID, validated by authorized diagnostic tools. Use Value: Factory-programmed 7-byte UID and tamper-resistant locking prevent cloning; password protection secures sensitive configuration data. |
| Electronic Shelf Labels | Mobile Companion Tags |
Use Scenario: Retail stores deploy NT2H1311TTDUDZ-equipped price labels updated wirelessly via handheld NFC encoders. IC Role / Device Role / Timing Role: NT2H1311TTDUDZ acts as writable memory node storing price, SKU, and promotion metadata in NDEF format. Use Value: 100,000 write cycles support daily price changes over multi-year deployment; FAST_READ enables rapid batch verification. |
Use Scenario: Bluetooth/Wi-Fi pairing initiated by tapping a smartphone on an NT2H1311TTDUDZ-tagged accessory. IC Role / Device Role / Timing Role: NT2H1311TTDUDZ stores handover configuration records (e.g., WPS or BLE OOB data) for secure wireless setup. Use Value: NFC Forum Type 2 compliance guarantees interoperability with Android/iOS; 106 kbit/s data rate ensures sub-100 ms pairing initiation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NFC tag IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NT2H1311G0DUD | Same 144-byte memory and 50 pF capacitance, but delivered on 120 µm wafer - thicker substrate limits minimum inlay thickness. | Suitable for rigid or semi-flexible inlays where mechanical robustness outweighs ultrathin form factor requirements. | Select NT2H1311G0DUD when higher die handling yield or thermal stability under lamination is prioritized over minimal profile. |
| NT2H1311G0DA8 | Identical electrical specs and memory map, packaged in MOA8 tape format with SOT500-4 footprint - same pinout and mounting compatibility. | Optimized for high-volume SMT assembly rather than wafer-level integration; requires no die attach or wire bonding. | Choose NT2H1311G0DA8 for automated pick-and-place production of finished NFC tags or modules. |
Compared with NT2H1311G0DUD and NT2H1311G0DA8, NT2H1311TTDUDZ offers identical core functionality but is specifically configured for thin-film inlay manufacturing with 75 µm wafer thickness - enabling direct embedding into paper, PET, or foil substrates without structural reinforcement.
Availability
NT2H1311TTDUDZ is available at Aetrix Electronics and suitable for smart advertisement, product authentication, and electronic shelf label applications requiring stable component supply, consistent wafer-thickness specification, and traceable NFC tag IC sourcing.
Supply support for NT2H1311TTDUDZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions, with core expertise in RFID, NFC, and secure element technologies for consumer, automotive, and industrial markets.
NT2H1311TTDUDZ belongs to the NTAG21x family - engineered for cost-sensitive, high-volume NFC tag applications demanding robust RF performance, factory-programmed security, and seamless integration into printable inlays and smart packaging.
FAQ
What is the exact user memory capacity of NT2H1311TTDUDZ?
The NT2H1311TTDUDZ provides 144 bytes of freely programmable user memory organized across 36 pages (4 bytes per page). This space is allocated after reserving 26 bytes for manufacturer data, capability container, and lock bits - sufficient for standard NDEF records including URIs, plain text, or small binary payloads.
Does NT2H1311TTDUDZ require external components for operation?
No, NT2H1311TTDUDZ operates autonomously when connected to a tuned antenna coil. It integrates a complete RF interface - including rectifier, voltage regulator, clock regenerator, and demodulator - eliminating the need for external capacitors, resistors, or power sources. Only LA and LB antenna terminals are used.
How does the security model of NT2H1311TTDUDZ prevent unauthorized access?
NT2H1311TTDUDZ implements layered security: a factory-programmed 7-byte UID, ECC-based originality signature for clone detection, 32-bit password protection for memory writes, and field-programmable page locking (static for first 16 pages, dynamic for remaining pages). All locking operations are irreversible and tearing-proof.
Can NT2H1311TTDUDZ be used in ultrathin applications like magazine inserts?
Yes - NT2H1311TTDUDZ is specified for 75 µm wafer thickness and 50 pF input capacitance, enabling reliable RF coupling in mechanically constrained environments. Its high input capacitance compensates for reduced antenna size, making it ideal for embedding into paper, thin PET films, or laminated cards without performance loss.
What NFC standards does NT2H1311TTDUDZ comply with?
NT2H1311TTDUDZ is fully compliant with NFC Forum Type 2 Tag specification and ISO/IEC 14443 Type A - ensuring interoperability with all certified NFC smartphones, point-of-sale terminals, and industrial readers. It supports 106 kbit/s data transfer and anticollision protocols defined in both standards.
NT2H1311TTDUDZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- RFID Reader/Transponder
- Frequency:
- 13.56MHz
- Standards:
- ISO 14443, NFC
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -25°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
NT2H1311TTDUDZ FAQ
1.How can I place an order for NT2H1311TTDUDZ through Aetrix?
Please submit a Request for Quotation (RFQ) for NT2H1311TTDUDZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NT2H1311TTDUDZ reliable?
The price and inventory of NT2H1311TTDUDZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NT2H1311TTDUDZ is usually 5 days.
3.What payment methods are accepted for NT2H1311TTDUDZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NT2H1311TTDUDZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NT2H1311TTDUDZ?
NT2H1311TTDUDZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NT2H1311TTDUDZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NT2H1311TTDUDZ?
For technical support, including NT2H1311TTDUDZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NT2H1311TTDUDZ requirements.
6.How does Aetrix verify that NT2H1311TTDUDZ is sourced from the original manufacturer or authorized distributors?
All NT2H1311TTDUDZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NT2H1311TTDUDZ meets industry standards.
7.What is the process for return or replacement of NT2H1311TTDUDZ?
All NT2H1311TTDUDZ units undergo pre-shipment inspection (PSI). If there is an issue with NT2H1311TTDUDZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NT2H1311TTDUDZ part is unused and in its original packaging.
Return procedure for NT2H1311TTDUDZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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