NXP Semiconductors NT2H1311TTDUFZ

Overview

NT2H1311TTDUFZ from NXP Semiconductors is an NFC Forum Type 2 Tag compliant contactless IC designed for mass-market smart labeling and authentication applications. It delivers 144 bytes of user memory, 50 pF input capacitance, 13.56 MHz operating frequency, and supports FAST_READ command execution - enabling rapid NDEF message scanning in retail shelf labels and mobile companion tags.

For engineers reviewing the NT2H1311TTDUFZ datasheet, NT2H1311TTDUFZ pinout, NT2H1311TTDUFZ application, or NT2H1311TTDUFZ equivalent, key selection criteria include its ultrathin 75 µm die thickness, field-programmable page locking, ECC-based originality signature, and ISO/IEC 14443 Type A compliance for interoperability with NFC-enabled smartphones and readers.

Technical Context

The NT2H1311TTDUFZ implements a fully integrated RF interface per ISO/IEC 14443-3A, including rectifier, clock regenerator, and Power-On Reset, eliminating need for external components. Its digital control unit handles anticollision, command interpretation (READ, FAST_READ, WRITE, PWD_AUTH), and EEPROM interface management for 45-page (4-byte/page) memory organization.

Memory includes 7-byte UID (cascade level 2), pre-programmed capability container, static lock bytes (pages 03h–0Fh), dynamic lock bytes (page 28h), and 144 bytes of user R/W area. Security features comprise one-time programmable bits, 32-bit password protection, and ECC-based originality signature verification - all implemented in hardware without host processor dependency.

Key Specifications

Pinout & Package

NT2H1311TTDUFZ is supplied as a bare die in FFC Bump format: 75 µm thickness, Au bumps, on film frame carrier. It has two terminals for direct connection to an external antenna coil.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NFC tag IC applications.

Compared with NT2H1311G0DUF, NT2H1311TTDUFZ shares identical core functionality but targets tape-and-reel delivery with distinct traceability marking; versus NT2H1311G0DA8, it trades SMT compatibility for ultra-thin inlay integration - making NT2H1311TTDUFZ optimal for label, sticker, and flexible substrate use cases.

Availability

NT2H1311TTDUFZ is available at Aetrix Electronics and suitable for electronic shelf labels, smart advertisement inlays, and product authentication tags requiring stable component supply across high-volume consumer electronics manufacturing.

Supply support for NT2H1311TTDUFZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications - with over two decades of NFC technology leadership.

The NTAG21x family, including NT2H1311TTDUFZ, was engineered specifically for cost-sensitive, high-volume NFC tagging - balancing security, memory efficiency, and mechanical integration flexibility for mass-market smart labeling.

FAQ

What is the primary function of NT2H1311TTDUFZ in an NFC system?

The NT2H1311TTDUFZ functions as a passive NFC Forum Type 2 Tag IC that stores and transmits NDEF data upon RF field activation. It harvests energy from the reader's 13.56 MHz field to power its internal EEPROM and digital control unit - enabling zero-power, battery-free operation in smart labels and authentication tags. NT2H1311TTDUFZ does not require external voltage or clock sources.

Does NT2H1311TTDUFZ support password protection and memory locking?

Yes, NT2H1311TTDUFZ supports both field-programmable read-only locking per page (for first 16 pages) and 32-bit password protection to restrict write access to designated memory regions. Lock bits are irreversible once set, and password verification enables access to protected pages only after successful authentication - critical for secure product authentication workflows using NT2H1311TTDUFZ.

How does the 50 pF input capacitance of NT2H1311TTDUFZ affect antenna design?

The fixed 50 pF input capacitance of NT2H1311TTDUFZ simplifies antenna tuning by defining a precise capacitive load for the external loop coil. Designers select inductance to achieve resonance at 13.56 MHz (L ≈ 1/(ω²C)), enabling predictable read range and consistent performance across varied substrate materials - especially valuable when embedding NT2H1311TTDUFZ into thin-film or paper-based inlays.

Can NT2H1311TTDUFZ be used for Bluetooth or Wi-Fi pairing handover?

Yes, NT2H1311TTDUFZ is explicitly qualified for Bluetooth and Wi-Fi pairing handover via NDEF records. Its 144-byte user memory accommodates standard Connection Handover records (e.g., Bluetooth OOB or Wi-Fi Simple Config), and the UID ASCII mirror allows automatic binding of device-specific identifiers - making NT2H1311TTDUFZ suitable for mobile companion tag implementations requiring seamless wireless setup.

What is the significance of the 75 µm thickness specification for NT2H1311TTDUFZ?

The 75 µm die thickness of NT2H1311TTDUFZ enables mechanical integration into ultra-thin substrates - including magazine inserts, flexible plastic films, and laminated packaging - without compromising RF performance. This dimension directly supports use cases requiring minimal profile, such as NFC-enabled business cards or wearable authentication patches, where thicker alternatives would cause delamination or visibility issues.