NXP Semiconductors NT2H1511G0DUDV

Overview

NT2H1511G0DUDV from NXP Semiconductors is an NFC Forum Type 2 Tag compliant contactless IC designed for secure, low-power data exchange in smart labels and embedded tags. It delivers 504 bytes of user memory, 13.56 MHz operation, 106 kbit/s data rate, 50 pF input capacitance, and ECC-based originality signature - enabling robust product authentication and electronic shelf label applications.

For engineers reviewing the NT2H1511G0DUDV datasheet, NT2H1511G0DUDV pinout, NT2H1511G0DUDV application, or NT2H1511G0DUDV equivalent, this page provides verified technical context, memory architecture details, RF interface behavior, locking mechanisms, and real-world deployment constraints for NFC tag integration in retail, consumer electronics, and IoT companion devices.

Technical Context

The NT2H1511G0DUDV implements a complete ISO/IEC 14443 Type A RF interface with integrated rectifier, clock regenerator, POR, and voltage regulator - requiring no external components beyond an antenna coil. Its Digital Control Unit handles anticollision, command interpretation (READ, FAST_READ, WRITE, PWD_AUTH), and EEPROM interface management across 135 pages of 4-byte memory.

Memory organization includes 26 bytes reserved for manufacturer data and configuration, 4-byte capability container, static lock bits for pages 03h–0Fh, dynamic lock bytes at page 82h for pages 10h onward (16-page granularity), and 504 bytes of user R/W area. Security relies on factory-programmed 7-byte UID, one-time programmable CC bits, field-programmable page locking, 32-bit password protection, and ECC originality signature.

Key Specifications

Pinout & Package

NT2H1511G0DUDV is supplied as a bare die in FFC Bump format: 8-inch wafer, 120 µm thickness, Au bumps, film frame carrier, SECS-II electronic die marking. It has two terminals for direct antenna connection only - no conventional pins or package leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NFC tag IC applications.

Compared with NT2H1511G0DUDV, NT2H1511G0DUF offers thinner profile at the cost of mechanical robustness, while NT2H1511G0DA8 trades bare-die flexibility for turnkey manufacturability - making NT2H1511G0DUDV optimal for mid-thickness inlay production with controlled handling.

Availability

NT2H1511G0DUDV is available at Aetrix Electronics and suitable for electronic shelf labels, product authentication systems, and smart advertisement deployments requiring stable component supply, wafer-level traceability, and long-lifecycle support.

Supply support for NT2H1511G0DUDV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer markets, with core expertise in RFID, NFC, and secure element technologies.

The NTAG21x family, including NT2H1511G0DUDV, was engineered specifically for mass-market NFC tag applications - balancing cost-efficiency, standards compliance, security, and ease of integration into printed inlays and flexible substrates.

FAQ

What is the exact user memory capacity of NT2H1511G0DUDV?

NT2H1511G0DUDV provides 504 bytes of freely available user Read/Write memory, organized across 126 pages of 4 bytes each. This capacity is confirmed in Table 2 of the official NXP datasheet (Rev. 3.2) and corresponds to the NTAG215 variant. The memory excludes 26 bytes reserved for manufacturer data, lock bits, and the 4-byte capability container.

Does NT2H1511G0DUDV require external components for operation?

No, NT2H1511G0DUDV operates autonomously when connected to a tuned antenna coil - it integrates a full ISO/IEC 14443 Type A RF interface, rectifier, voltage regulator, and digital control unit. No external capacitors, resistors, or ICs are needed, simplifying inlay design and reducing bill-of-materials cost.

How is security implemented in NT2H1511G0DUDV?

NT2H1511G0DUDV implements layered security: factory-programmed 7-byte UID, ECC-based originality signature for clone detection, 32-bit password protection for memory access, field-programmable read-only locking per page or block, and one-time programmable bits in the capability container - all documented in Sections 1.3 and 8.5 of the NXP datasheet.

What antenna interface does NT2H1511G0DUDV use?

NT2H1511G0DUDV uses a two-terminal RF interface (LA and LB) designed for direct connection to a planar loop antenna. Its 50 pF input capacitance forms a resonant LC tank with the antenna inductance at 13.56 MHz - eliminating need for external matching capacitors and enabling compact, low-profile inlay designs.

Is NT2H1511G0DUDV compatible with NFC Forum Type 2 Tag specification?

Yes, NT2H1511G0DUDV is fully compliant with NFC Forum Type 2 Tag technical specification (Ref. 2) and ISO/IEC 14443 Type A (Ref. 1). It supports NDEF data structure configuration, anticollision, FAST_READ, and all mandatory command sets - verified in Section 1.4 and Figure 4 state diagram of the official datasheet.