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NXP Semiconductors NT2H1611G0DUDV

Part No.:
NT2H1611G0DUDV
Manufacturer:
NXP Semiconductors
Category:
RFID, RF Access, Monitoring ICs
Package:
Die
Datasheet:
AetrixNT2H1611G0DUDV.pdf
Description:
NFC FORUM TYPE 2 TAG COMPLIANT I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,838

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Product details

Overview

NT2H1611G0DUDV from NXP Semiconductors is an NFC Forum Type 2 Tag compliant contactless IC designed for embedded smart label and authentication applications. It delivers 888 bytes of user memory, 50 pF input capacitance, 13.56 MHz operating frequency, and ECC-based originality signature - enabling secure, compact NFC tags for electronic shelf labels and mobile companion use cases.

For engineers reviewing the NT2H1611G0DUDV datasheet, NT2H1611G0DUDV pinout, NT2H1611G0DUDV application, or NT2H1611G0DUDV equivalent, this page provides verified technical context, memory architecture details, RF interface behavior, locking mechanisms, and real-world deployment constraints specific to the NT2H1611G0DUDV variant.

Technical Context

The NT2H1611G0DUDV implements a full ISO/IEC 14443 Type A RF interface with 106 kbit/s data transfer, 16-bit CRC per block, odd parity, and bit coding for robust communication. Its Digital Control Unit manages anticollision, command interpretation (READ, FAST_READ, PWD_AUTH), and state transitions between IDLE, READY1/2, ACTIVE, AUTHENTICATED, and HALT.

This variant uses a 924-byte EEPROM organized in 231 pages of 4 bytes each, with 888 bytes user memory (pages 04h–E1h), static lock bytes at page 02h, dynamic lock bytes at page E2h, and pre-programmed 7-byte UID with BCC0/BCC1 checksums - all optimized for field-programmable read-only protection and NDEF message segmentation.

Key Specifications

Parameter Value and Actual Design Meaning
User Memory 888 bytes (222 pages × 4 bytes) - directly usable for NDEF messages, segmented across multiple applications
Input Capacitance 50 pF - enables compact antenna design and supports ultrathin tag integration (e.g., in magazines or gaming cards)
Operating Frequency 13.56 MHz - ensures interoperability with all NFC Forum–compliant readers and smartphones
Data Transfer Rate 106 kbit/s - standard Type A base rate; supports FAST_READ for single-command full-NDEF retrieval
EEPROM Endurance 100,000 write cycles - sufficient for repeated reprogramming in dynamic labeling or pairing workflows
Data Retention 10 years at 22 °C - guarantees long-term reliability in retail, logistics, and consumer-facing deployments
Security Features 7-byte UID, ECC originality signature, 32-bit password protection, and field-programmable page locking - prevents cloning and unauthorized writes

Pinout & Package

NT2H1611G0DUDV is supplied as a bare die in FFC Bump format: 8-inch wafer, 120 µm thickness, Au bumps, on film frame carrier with SECS-II electronic fail die marking. It has no conventional pins - connection is made via two antenna terminals (LA and LB) bonded directly to an external coil.

Pin/Terminal Circuit Role Design Meaning
LA Antenna connection LA Primary RF input terminal; connects to one end of the printed or etched loop antenna
LB Antenna connection LB Secondary RF input terminal; completes resonant LC circuit with LA and external antenna inductance

Key Features

Feature Design Value
FAST_READ command Retrieves full NDEF message in one RF transaction - reduces scan latency and improves throughput in high-volume production line tagging
Dynamic lock bytes at page E2h Enables granular, field-programmable read-only locking of 16-page blocks (e.g., pages 10h–1Fh, 20h–2Fh) - supports multi-zone memory security without factory reprogramming
UID ASCII mirror Automatically serializes NDEF messages with unique device ID - eliminates need for host-side UID injection in mass-labeling systems
NFC counter with ASCII mirror Increments on every READ command and auto-appends count to NDEF payload - enables usage tracking and anti-counterfeiting audit trails
True anticollision Supports simultaneous operation of multiple NT2H1611G0DUDV tags in one RF field - essential for dense shelf-label or asset-tracking deployments

Applications

Electronic Shelf Labels Product Authentication

Use Scenario: Dynamic price and promotion updates on retail store shelves using NFC-enabled handheld scanners or fixed readers.

IC Role / Device Role / Timing Role: NT2H1611G0DUDV serves as the secure, rewritable NDEF storage node - hosting price, SKU, batch, and expiry data with ECC-verified authenticity.

Use Value: 888-byte memory accommodates multilingual product metadata and digital signatures; 50 pF input capacitance allows integration into ultra-thin, flexible label substrates without RF performance loss.

Use Scenario: Brand protection for luxury goods, pharmaceuticals, or electronics by embedding tamper-evident NFC tags into packaging or devices.

IC Role / Device Role / Timing Role: NT2H1611G0DUDV acts as a cryptographic anchor - storing manufacturer UID, ECC originality signature, and locked configuration data verifiable by consumer smartphones.

Use Value: Password-protected memory and irreversible lock bits prevent cloning or data overwrite; 10-year data retention ensures validity over product lifecycle.

Mobile Companion Tags Bluetooth/Wi-Fi Pairing

Use Scenario: Tap-to-launch actions on smartphones - e.g., opening branded apps, loading support URLs, or triggering IoT device setup flows.

IC Role / Device Role / Timing Role: NT2H1611G0DUDV stores compact NDEF records (URI, Smart Posters) with automatic UID mirroring for personalized user experiences.

Use Value: FAST_READ ensures sub-100 ms response time; 888-byte capacity supports rich payloads including fallback URLs, app store links, and analytics parameters.

Use Scenario: One-tap wireless provisioning of headsets, speakers, or smart home devices using NFC handover to Bluetooth or Wi-Fi.

IC Role / Device Role / Timing Role: NT2H1611G0DUDV holds handover configuration records (WPS, Bluetooth Secure Simple Pairing OOB) with read-only locking to prevent accidental overwrite.

Use Value: Field-programmable locking above page 0Fh secures sensitive pairing keys; 13.56 MHz compatibility ensures universal smartphone reader support.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NFC tag IC applications.

Alternative Part Technical Difference Application Difference Selection Advice
NT2H1611G0DUF Same 888-byte memory and 50 pF capacitance, but delivered on 75 µm-thick wafer - enables thinner, more flexible tag constructions Better suited for ultrathin media (e.g., magazine inserts, credit-card–format tags); slightly reduced mechanical robustness vs. 120 µm variant Select NT2H1611G0DUF when minimum profile thickness is critical; choose NT2H1611G0DUDV for enhanced handling durability in automated inlay production.
NT2H1611G0DA8 Identical memory and electrical specs, but packaged in MOA8 (SOT500-4) plastic leadless module with LA/LB terminals pre-routed to standardized footprint Eliminates die bonding and antenna tuning; targets rapid prototyping and low-volume PCB assembly rather than inlay manufacturing Choose NT2H1611G0DA8 for evaluation or small-batch board-level integration; NT2H1611G0DUDV remains optimal for high-volume RFID inlay production.

Compared with NT2H1611G0DUF and NT2H1611G0DA8, the NT2H1611G0DUDV offers the best balance of mechanical robustness (120 µm die thickness) and process compatibility for industrial inlay fabrication - while retaining identical memory, security, and RF performance.

Availability

NT2H1611G0DUDV is available at Aetrix Electronics and suitable for electronic shelf labels, product authentication systems, and mobile companion tag deployments requiring stable component supply, long-lifecycle support, and traceable sourcing for global OEM programs.

Supply support for NT2H1611G0DUDV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in secure connectivity solutions, specializing in RFID, NFC, automotive MCUs, and secure edge processors - with core expertise in contactless interface design and semiconductor security.

The NTAG21x family, including NT2H1611G0DUDV, was developed specifically for high-volume NFC tag applications in retail, consumer electronics, and brand protection - emphasizing small-footprint integration, field-programmable security, and NFC Forum compliance.

FAQ

What is the exact user memory size of NT2H1611G0DUDV, and how is it structured?

The NT2H1611G0DUDV provides 888 bytes of user Read/Write memory, organized across 222 pages of 4 bytes each (pages 04h to E1h). This memory is distinct from reserved areas: 26 bytes for manufacturer data and configuration, 4 bytes for the Capability Container, and dynamic lock bytes at page E2h. The structure supports NDEF message segmentation and multi-application use without overlap or conflict.

Does NT2H1611G0DUDV support password protection, and how is it implemented?

Yes, NT2H1611G0DUDV supports 32-bit password protection to prevent unauthorized memory operations. Password verification is required before accessing password-protected pages, and the IC enters the AUTHENTICATED state upon successful PWD_AUTH command execution. The password itself is stored in dedicated configuration pages and can be programmed during initialization - with optional limits on unsuccessful attempts to deter brute-force attacks.

How does the dynamic lock mechanism work on NT2H1611G0DUDV?

NT2H1611G0DUDV implements dynamic locking via three lock bytes located at page E2h, covering memory pages starting from 10h onward in 16-page blocks (e.g., pages 10h–1Fh, 20h–2Fh). Each lock bit controls read/write access to its assigned block; once set to logic 1, the lock is irreversible. This enables fine-grained, field-programmable protection of sensitive NDEF payloads without requiring factory reprogramming.

Is NT2H1611G0DUDV compatible with standard NFC smartphones and readers?

Yes, NT2H1611G0DUDV is fully compliant with NFC Forum Type 2 Tag and ISO/IEC 14443 Type A specifications. It operates at 13.56 MHz with 106 kbit/s data transfer and supports standard commands (READ, FAST_READ, PWD_AUTH, GET_VERSION) - ensuring interoperability with all certified NFC smartphones, point-of-sale terminals, and industrial readers without proprietary drivers or firmware.

What is the role of the 7-byte UID and ECC originality signature in NT2H1611G0DUDV?

The NT2H1611G0DUDV features a manufacturer-programmed 7-byte UID (with two BCC checksum bytes) and an ECC-based originality signature. The UID enables unique device identification and NDEF serialization; the ECC signature provides cryptographic proof of genuine NXP silicon - both are read-only, unalterable, and used by host systems to verify tag authenticity and prevent counterfeiting in high-value authentication workflows.

NT2H1611G0DUDV Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
Die
Packaging:
Tray
Product Status:
Active
Type:
RFID Reader
Frequency:
13.56MHz
Standards:
ISO 18092, ISO 21481
Interface:
I2C
Voltage - Supply:
-
Operating Temperature:
-25°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Wafer

NT2H1611G0DUDV FAQ

1.How can I place an order for NT2H1611G0DUDV through Aetrix?

Please submit a Request for Quotation (RFQ) for NT2H1611G0DUDV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NT2H1611G0DUDV reliable?

The price and inventory of NT2H1611G0DUDV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NT2H1611G0DUDV is usually 5 days.

3.What payment methods are accepted for NT2H1611G0DUDV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NT2H1611G0DUDV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NT2H1611G0DUDV?

NT2H1611G0DUDV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NT2H1611G0DUDV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NT2H1611G0DUDV?

For technical support, including NT2H1611G0DUDV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NT2H1611G0DUDV requirements.

6.How does Aetrix verify that NT2H1611G0DUDV is sourced from the original manufacturer or authorized distributors?

All NT2H1611G0DUDV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NT2H1611G0DUDV meets industry standards.

7.What is the process for return or replacement of NT2H1611G0DUDV?

All NT2H1611G0DUDV units undergo pre-shipment inspection (PSI). If there is an issue with NT2H1611G0DUDV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NT2H1611G0DUDV part is unused and in its original packaging.

Return procedure for NT2H1611G0DUDV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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