NXP Semiconductors NT2H1611G0DUDZ

Overview

NT2H1611G0DUDZ from NXP Semiconductors is an NFC Forum Type 2 Tag compliant contactless IC designed for embedded smart label and authentication applications. It delivers 888 bytes of user memory, 50 pF input capacitance, 13.56 MHz operating frequency, and ECC-based originality signature - enabling secure, compact electronic shelf labels and mobile companion tags.

For engineers reviewing the NT2H1611G0DUDZ datasheet, NT2H1611G0DUDZ pinout, NT2H1611G0DUDZ application, or NT2H1611G0DUDZ equivalent, key selection criteria include NFC Forum T2T compliance, field-programmable page locking, password-protected memory access, fast read command support, and 10-year EEPROM data retention.

Technical Context

The NT2H1611G0DUDZ implements a fully ISO/IEC 14443 Type A–compliant RF interface with 106 kbit/s data transfer, integrated rectifier and clock regenerator, and Power-On Reset circuitry. Its digital control unit handles anticollision, command interpretation, and EEPROM interface management without external components.

Memory organization comprises 231 pages of 4-byte EEPROM (924 total bytes), with 888 bytes allocated as user-read/write space, 26 bytes reserved for manufacturer/config data, and dedicated static/dynamic lock byte structures enabling granular, irreversible page-level write protection across all memory regions.

Key Specifications

Pinout & Package

NT2H1611G0DUDZ is supplied in FFC Bump wafer format: 8-inch wafer, 120 µm die thickness, Au bumps, film frame carrier, SECS-II electronic fail die marking. This bare-die configuration requires direct wire bonding to antenna substrate.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NFC tag IC applications.

Compared with NT2H1611G0DUDZ, NT2H1611G0DUF offers thinner form factor for flexible media integration, while NT2H1611G0DA8 replaces wafer-level assembly with surface-mount readiness - both retain identical memory, security, and RF specifications but differ in mechanical implementation and production workflow compatibility.

Availability

NT2H1611G0DUDZ is available at Aetrix Electronics and suitable for electronic shelf labels, product authentication systems, and mobile companion tag deployments requiring stable component supply, long-lifecycle support, and wafer-level NFC IC sourcing.

Supply support for NT2H1611G0DUDZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

NT2H1611G0DUDZ belongs to the NTAG21x family - engineered specifically for mass-market NFC tagging, emphasizing small-footprint antenna compatibility, field-programmable security, and seamless smartphone interoperability in retail, authentication, and IoT edge use cases.

FAQ

What is the exact user memory capacity of NT2H1611G0DUDZ?

NT2H1611G0DUDZ provides 888 bytes of freely available user Read/Write memory, organized across 222 pages of 4 bytes each. This capacity is confirmed in NXP's official ordering information table and corresponds to the NTAG216 variant. The memory supports NDEF message formatting, dynamic lock bit configuration, and password-protected sectors - all accessible via standard NFC-A commands.

Does NT2H1611G0DUDZ require external components for operation?

No, NT2H1611G0DUDZ operates autonomously when connected to a tuned loop antenna - no external capacitors, resistors, or regulators are needed. Its integrated RF interface includes rectifier, voltage regulator, clock regenerator, and Power-On Reset circuitry. Antenna design must comply with ISO/IEC 14443-2 requirements, but all signal conditioning and power harvesting occur internally within the NT2H1611G0DUDZ die.

How is memory protection implemented on NT2H1611G0DUDZ?

NT2H1611G0DUDZ implements three-tier memory protection: (1) Static lock bits (page 02h) for pages 03h–0Fh, (2) Dynamic lock bits (page E2h) for pages 10h–E1h in 16-page blocks, and (3) 32-bit password verification for protected memory regions. All lock bits are irreversible once set; the ECC-based originality signature further prevents physical cloning of the NT2H1611G0DUDZ IC.

What package form does NT2H1611G0DUDZ ship in?

NT2H1611G0DUDZ ships as a bare die in FFC Bump format: 8-inch wafer, 120 µm thickness, gold bumps, film frame carrier, and SECS-II electronic fail die marking. It is not pre-packaged - end users bond the die directly to custom antenna substrates. This differs from MOA8-packaged variants like NT2H1611G0DA8, which arrive in SOT500-4 tape-and-reel format.

Is NT2H1611G0DUDZ NFC Forum Type 2 Tag certified?

Yes, NT2H1611G0DUDZ is fully compliant with NFC Forum Type 2 Tag specification (v2.0) and ISO/IEC 14443 Type A. Certification is inherent to the NTAG216 silicon platform and verified through NXP's conformance testing. The IC supports mandatory commands (READ, WRITE, FAST_READ), NDEF mapping, and anticollision per NFC Forum requirements - no additional qualification is required for system-level NFC certification.