NXP Semiconductors NT2H1611G0DUFV

Overview

NT2H1611G0DUFV from NXP Semiconductors is an NFC Forum Type 2 Tag compliant contactless IC designed for secure, low-power data exchange in smart labels and embedded tags. It delivers 888 bytes of user memory, 50 pF input capacitance, 13.56 MHz operating frequency, and ECC-based originality signature-enabling robust product authentication and electronic shelf label applications.

For engineers reviewing the NT2H1611G0DUFV datasheet, NT2H1611G0DUFV pinout, NT2H1611G0DUFV application, or NT2H1611G0DUFV equivalent, this page provides verified technical context, memory architecture details, RF interface behavior, security features, and real-world deployment constraints for mass-market NFC tag design.

Technical Context

The NT2H1611G0DUFV implements a full ISO/IEC 14443 Type A RF interface with 106 kbit/s data transfer, 16-bit CRC per block, parity bits, and bit coding for reliable communication. Its Digital Control Unit manages anticollision, command interpretation (READ, FAST_READ, PWD_AUTH, GET_VERSION), and state transitions across IDLE, READY1, READY2, ACTIVE, AUTHENTICATED, and HALT states.

This variant integrates 924-byte EEPROM organized in 231 pages (4 bytes/page), with 888 bytes user memory, 26 bytes reserved for manufacturer/config data, 4-byte capability container, and dynamic lock bytes at page E2h enabling per-16-page locking above page 10h. Input capacitance is fixed at 50 pF, optimized for compact antenna integration.

Key Specifications

Pinout & Package

NT2H1611G0DUFV is supplied as a bare die in FFC Bump format: 8-inch wafer, 75 µm thickness, Au bumps, film frame carrier, SECS-II electronic fail die marking. No external pins; connects exclusively via two antenna terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NFC tag IC applications.

Compared with NT2H1611G0DUFV, NT2H1511G0DUF trades memory capacity for lower unit cost in constrained-payload use cases, while NT2H1611G0DA8 replaces wafer-level integration with a ready-to-solder module-shifting design effort from RF optimization to board-level placement.

Availability

NT2H1611G0DUFV is available at Aetrix Electronics and suitable for electronic shelf labels, product authentication systems, smart advertisement inlays, and mobile companion tag deployments requiring stable component supply across high-volume consumer electronics manufacturing.

Supply support for NT2H1611G0DUFV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with deep expertise in RFID and NFC technology.

The NTAG21x family-including NT2H1611G0DUFV-is engineered specifically for mass-market NFC tag applications demanding high reliability, small form factor, and certified interoperability with NFC Forum and ISO/IEC 14443 standards.

FAQ

What is the exact user memory capacity of NT2H1611G0DUFV?

The NT2H1611G0DUFV provides 888 bytes of freely available user Read/Write memory, organized across 222 pages (4 bytes per page). This is derived from its total 924-byte EEPROM (231 pages), with 26 bytes reserved for manufacturer data and configuration, and 4 bytes allocated to the capability container.

Does NT2H1611G0DUFV require external components for operation?

No, NT2H1611G0DUFV operates autonomously when connected to a properly tuned loop antenna. It integrates a complete RF interface-including rectifier, clock regenerator, and voltage regulator-so no external capacitors, resistors, or ICs are needed for basic NFC communication or power harvesting.

How is memory protection implemented on NT2H1611G0DUFV?

NT2H1611G0DUFV uses dual-layer memory protection: static lock bits (pages 02h) for pages 03h–0Fh, and dynamic lock bytes at page E2h for pages 10h–E1h in 16-page blocks. Both are field-programmable and irreversible-once set, bits cannot be reset to 0, ensuring permanent read-only enforcement.

What security mechanisms validate authenticity of NT2H1611G0DUFV?

The NT2H1611G0DUFV includes ECC-based originality signature (read via READ_SIG command), factory-programmed 7-byte UID with cryptographic check bytes (BCC0/BCC1), and one-time programmable capability container bits-all verified against NXP's secure manufacturing root key to prevent counterfeit ICs.

Can NT2H1611G0DUFV be used in ultrathin applications like magazine inserts?

Yes-NT2H1611G0DUFV is supplied as a 75 µm thick bare die in FFC Bump format, explicitly designed for ultrathin tag construction. Its 50 pF input capacitance allows efficient coupling with miniature antennas, enabling embedding into paper, plastic films, or flexible substrates without compromising read range or reliability.