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onsemi NUP4103FCT1
- Part No.:
- NUP4103FCT1
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 5-WFBGA, FCBGA
- Datasheet:
-
NUP4103FCT1.pdf
- Description:
- TVS DIODE 5.5VWM 5FLIPCHIP CSP
- Quantity:
- Payment:
- Shipping:
Inventory:9,351
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Product details
Overview
NUP4103FCT1 from ON Semiconductor is a unidirectional quad-channel ESD protection diode array in a 5-pin flip-chip CSP (Case 766AB), rated for 5.5 V reverse stand-off voltage, 6.0–8.0 V breakdown voltage, and 30 pF junction capacitance per channel at 2.5 V - designed to protect high-speed data lines in space-constrained portable electronics.
For engineers reviewing the NUP4103FCT1 datasheet, pinout, applications, or equivalent options, key selection criteria include IEC 61000-4-2 Level 4 compliance (±30 kV air/±30 kV contact), 100 nA leakage at 3.3 V, ultra-small 0.95 mm × 1.33 mm footprint, and compatibility with 0.5 mm pitch PCB layouts.
Technical Context
The NUP4103FCT1 integrates four independent unidirectional ESD clamping diodes in a single flip-chip package, each configured as an anode-to-rail (A1–A3) and cathode-to-rail (C1–C3) pair with common ground reference. It operates within −40 °C to +85 °C ambient and supports transient suppression up to ±16 kV HBM and ±1.6 kV MM.
Its low 30 pF capacitance enables use on USB 2.0, SDIO, and other high-speed interfaces without signal integrity degradation, while the 5.5 V VRWM ensures compatibility with 3.3 V logic systems. The device uses solder bumps (not wire bonds) and requires NSMD pads with 250 µm round copper pads and 350 µm solder mask opening.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Stand-Off Voltage | 5.5 V - maximum continuous operating voltage before clamping begins; matches 3.3 V I/O rails with margin |
| Breakdown Voltage | 6.0–8.0 V - clamping initiates reliably within this range at 1 mA test current |
| Junction Capacitance | 30 pF @ 2.5 V - preserves signal integrity on USB 2.0 and SDIO data lines |
| Leakage Current | 100 nA @ 3.3 V - minimizes standby power loss in battery-powered devices |
| ESD Rating (IEC 61000-4-2) | ±30 kV air / ±30 kV contact - meets Level 4 industrial immunity requirements |
| Package Dimensions | 0.95 mm × 1.33 mm × 0.27 mm - ultra-compact flip-chip CSP saves PCB area vs. SOT-553 or SC-88 |
Pinout & Package
Package: 5-pin flip-chip CSP (Case 766AB), 0.5 mm pitch, solder bump terminals, bottom-side termination only. Requires NSMD PCB pad design with 250 µm round copper pads and 350 µm solder mask opening.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Anode of Channel 1 | Connects to protected line 1; clamps positive transients to VCC |
| C1 | Cathode of Channel 1 | Connects to VCC rail; completes clamping path for Channel 1 |
| A3 | Anode of Channel 2 | Connects to protected line 2; clamps positive transients to VCC |
| C3 | Cathode of Channel 2 | Connects to VCC rail; completes clamping path for Channel 2 |
| B2 | Common Ground Reference | Internal connection point for all cathodes; must be tied to low-impedance system ground |
Key Features
| Feature | Design Value |
|---|---|
| Unidirectional Quad ESD Protection | Four independent clamping paths protect separate I/O lines without cross-talk or shared impedance |
| Ultra-Small Flip-Chip Packaging | 0.95 mm × 1.33 mm footprint reduces PCB area by >60% vs. discrete diode arrays in SOT-553 |
| IEC 61000-4-2 Level 4 Compliance | Guaranteed ±30 kV air/±30 kV contact ESD immunity - validated per standard test waveform |
| Low 100 nA Leakage at 3.3 V | Enables use on always-on sensor or RF front-end lines without measurable battery drain |
| 30 pF Junction Capacitance | Supports >480 Mbps data rates on USB 2.0 and SDIO without eye diagram closure |
Applications
| Smartphone Front Panel Interfaces | USB 2.0 OTG Data Lines |
|---|---|
Use Scenario: Protecting touch screen controller I²C lines and proximity sensor inputs from user-hand ESD events during daily handling. IC Role / Device Role / Timing Role: ESD transient clamp placed directly at connector or IC bond pad to limit voltage excursion below 5.5 V. Use Value: Prevents latch-up or permanent damage to 1.8 V/3.3 V interface ICs while maintaining <30 pF loading for signal fidelity. | Use Scenario: Safeguarding D+ and D− lines of micro-USB receptacles against repeated plug/unplug ESD stress. IC Role / Device Role / Timing Role: Low-capacitance bidirectional clamping (via unidirectional pair per line) on high-speed differential data paths. Use Value: Enables full-speed USB 2.0 operation (480 Mbps) with pass/fail ESD immunity per IEC 61000-4-2 Level 4. |
| SD Card Slot Signal Lines | Bluetooth/Wi-Fi Module Antenna Switch Control |
Use Scenario: Shielding SDIO command, clock, and data lines from ESD induced during card insertion/removal. IC Role / Device Role / Timing Role: Per-line clamping diode array placed adjacent to SD card connector to minimize trace inductance. Use Value: Maintains 25 MHz SDIO clock integrity with <1% jitter increase and prevents false command errors under ±8 kV HBM stress. | Use Scenario: Protecting GPIO control lines driving RF antenna switches in compact IoT modules. IC Role / Device Role / Timing Role: Low-leakage (100 nA) ESD clamp on 3.3 V control signals to avoid DC offset or false switching. Use Value: Eliminates field failures due to electrostatic discharge during module assembly or end-user handling without affecting RF switch timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E001DRYR | 4-channel unidirectional, 5.5 V VRWM, 30 pF, but uses 1.0 mm × 1.0 mm X2SON package with different pinout (A1/C1/A2/C2/GND) | Requires PCB layout revision due to 0.65 mm pitch and non-flip-chip mounting | Preferred when reflow compatibility with larger packages is required or flip-chip assembly capability is unavailable |
| ESD5Z3.3T5G | Single-channel, 3.3 V VRWM, 15 pF, SOD-523 package - not quad-channel or pin-compatible | Needs four discrete placements; increases board area and assembly cost | Only suitable for low-density designs where quad integration is unnecessary and space is not constrained |
Compared with TPD4E001DRYR and ESD5Z3.3T5G, the NUP4103FCT1 delivers superior PCB area efficiency and native flip-chip integration for ultra-thin portable designs, though it demands precise NSMD pad control and 0.5 mm pitch placement - making it optimal for high-volume smartphone and wearables production where miniaturization is critical.
Availability
NUP4103FCT1 is available at Aetrix Electronics and suitable for smartphone front-panel interfaces, USB 2.0 OTG ports, and SDIO-based memory expansion requiring stable component supply across high-mix consumer electronics manufacturing.
Supply support for NUP4103FCT1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
ON Semiconductor (now onsemi) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, cloud, and consumer markets.
The NUP4103FCT1 belongs to onsemi's ESD protection portfolio targeting ultra-compact, high-speed interface protection - engineered specifically for space-limited mobile and wearable platforms demanding IEC-compliant transient immunity without sacrificing signal bandwidth.
FAQ
What is the maximum operating temperature for the NUP4103FCT1?
The NUP4103FCT1 has an operating ambient temperature range of −40 °C to +85 °C and a maximum junction temperature rating of 150 °C. Its thermal performance depends on PCB copper area and airflow; derating is recommended above 70 °C ambient when subjected to repeated ESD events. The NUP4103FCT1 maintains specified electrical characteristics within this range when mounted per onsemi's NSMD pad recommendations.
Does the NUP4103FCT1 support bidirectional ESD protection?
No, the NUP4103FCT1 is a unidirectional ESD protection device - each channel clamps positive transients to VCC only. For bidirectional protection, two NUP4103FCT1 devices would be needed per line (anode-to-ground and cathode-to-VCC), or a dedicated bidirectional array like the NUP4201MR6T1 should be selected. The NUP4103FCT1's pinout and internal structure do not support symmetric clamping.
Can the NUP4103FCT1 be used on 5 V logic interfaces?
No - the NUP4103FCT1 has a 5.5 V reverse stand-off voltage (VRWM), meaning it begins clamping near 6 V. Using it on 5 V systems risks premature conduction and signal distortion. It is strictly intended for 3.3 V or lower I/O rails. For 5 V interfaces, consider the NUP4105FCT1 (VRWM = 12 V) or similar higher-voltage variants. The NUP4103FCT1's design assumes 3.3 V nominal operation.
What is the recommended PCB pad design for the NUP4103FCT1?
onsemi specifies NSMD (non-solder-mask-defined) round copper pads of 250 µm diameter ±0 µm tolerance, with a 350 µm ±25 µm solder mask opening and 125 µm stencil thickness. Trace width must not exceed 150 µm. Deviations increase risk of solder bridging or insufficient wetting. These dimensions ensure reliable reflow of the 0.5 mm pitch flip-chip bumps and are validated in the NUP4103FCT1's packaging specification document.
Is the NUP4103FCT1 RoHS compliant and lead-free?
Yes - the "G" suffix in NUP4103FCT1G denotes Pb-free construction, and the NUP4103FCT1 is manufactured to RoHS Directive 2011/65/EU requirements. The device uses matte tin finish on solder bumps and complies with JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1). Full compliance documentation, including substance declarations, is available via onsemi's product change notices and material declarations portal.
NUP4103FCT1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 5-WFBGA, FCBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-FlipChip CSP (1.33x0.96)
NUP4103FCT1 FAQ
1.How can I place an order for NUP4103FCT1 through Aetrix?
Please submit a Request for Quotation (RFQ) for NUP4103FCT1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NUP4103FCT1 reliable?
The price and inventory of NUP4103FCT1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NUP4103FCT1 is usually 5 days.
3.What payment methods are accepted for NUP4103FCT1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NUP4103FCT1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NUP4103FCT1?
NUP4103FCT1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NUP4103FCT1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NUP4103FCT1?
For technical support, including NUP4103FCT1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NUP4103FCT1 requirements.
6.How does Aetrix verify that NUP4103FCT1 is sourced from the original manufacturer or authorized distributors?
All NUP4103FCT1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NUP4103FCT1 meets industry standards.
7.What is the process for return or replacement of NUP4103FCT1?
All NUP4103FCT1 units undergo pre-shipment inspection (PSI). If there is an issue with NUP4103FCT1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NUP4103FCT1 part is unused and in its original packaging.
Return procedure for NUP4103FCT1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NUP4103FCT1 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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