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onsemi PACDN006MR
- Part No.:
- PACDN006MR
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
PACDN006MR.pdf
- Description:
- TVS DIODE 5.5VWM 8-MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:8,192
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Product details
Overview
PACDN006MR from onsemi is a 6-channel ESD protection diode array designed for I/O line clamping in portable and consumer electronics. It delivers ±8 kV contact/±15 kV air IEC 61000−4−2 ESD protection, ±15 kV HBM rating, 3 pF typical input capacitance, and operates across −40°C to +85°C with VP–VN up to 5.5 V - ideal for VGA port and cellular phone interface protection.
For engineers reviewing the PACDN006MR datasheet, pinout, applications, or equivalent options, key selection criteria include channel count, clamp voltage (VP + 13.0 V / VN − 13.0 V), low leakage (<±1.0 µA), supply current (10 µA), and MSOP-8 footprint compatibility with high-density PCB layouts.
Technical Context
The PACDN006MR implements rail-to-rail bidirectional clamping using six independent diode pairs tied between each I/O channel and VP/VN rails. Each channel steers ESD transients to either the positive supply (VP) or negative supply (VN), requiring an external 0.22 µF ceramic bypass capacitor between VP and VN to suppress high-frequency energy and limit clamp voltage overshoot.
It operates under standard conditions of VP–VN = 0–5.5 V and TA = −40°C to +85°C, with absolute maximum ratings including 6.0 V supply differential and 20 mA forward DC current per diode (one conducting at a time). Clamp voltage is specified at ±13.0 V offset from VP/VN under 15 kV HBM stress.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000−4−2) | ±8 kV contact / ±15 kV air - meets Level 4 immunity for industrial and portable end-equipment |
| ESD Rating (HBM) | ±15 kV per channel - exceeds MIL-STD-883 Method 3015 requirements for board-level robustness |
| Input Capacitance | 3 pF typical @ 1 MHz - enables high-speed signal integrity for VGA, USB, and camera interfaces |
| Clamp Voltage | VP + 13.0 V / VN − 13.0 V @ 15 kV HBM - defines maximum transient overvoltage seen by protected ICs |
| Leakage Current | ±1.0 µA max @ ±0.1 V - ensures minimal power drain in battery-powered devices like PDAs and smartphones |
| Supply Voltage Range | 0–5.5 V VP–VN - supports 3.3 V and 5 V logic domains without level-shifting circuitry |
| Operating Temperature | −40°C to +85°C - qualified for commercial and extended-temperature consumer applications |
Pinout & Package
Package: 8-pin MSOP (Case 846AB), RoHS-compliant, lead-free, 3.00 mm × 3.00 mm × 1.10 mm body height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | I/O channel 1 - bidirectionally clamped between VP and VN rails |
| 2 | CH2 | I/O channel 2 - independent ESD path; no internal coupling to other channels |
| 3 | VN | Negative supply/ground reference - must be connected to system ground plane with low-inductance path |
| 4 | CH3 | I/O channel 3 - supports high-speed analog/digital lines with ≤3 pF loading |
| 5 | CH4 | I/O channel 4 - electrically isolated; shares only VP/VN rails with other channels |
| 6 | CH5 | I/O channel 5 - compatible with 0.22 µF VP–VN bypass capacitor placement per layout guidelines |
| 7 | VP | Positive supply rail - requires local 0.22 µF ceramic decoupling capacitor adjacent to pin |
| 8 | CH6 | I/O channel 6 - final channel in 6-channel array; identical electrical specs to CH1–CH5 |
Key Features
| Feature | Design Value |
|---|---|
| Six independent ESD channels | Enables single-package protection for multi-line interfaces (e.g., VGA RGB+HSYNC+VSYNC) |
| Low 3 pF input capacitance | Preserves signal rise/fall times on >100 Mbps digital and analog video lines |
| ±15 kV HBM / ±8 kV IEC contact rating | Meets stringent ESD immunity requirements for handheld CE products certified to IEC 61000-4-2 |
| Low leakage (±1.0 µA max) | Extends battery life in always-on mobile devices without compromising protection margin |
| MSOP-8 package (3.0 × 3.0 mm) | Reduces PCB area vs SOIC-8 by >50%, enabling compact front-panel and connector-side placement |
Applications
| VGA Port Protection | Smartphone I/O Protection |
|---|---|
Use Scenario: Protecting RGB, HSYNC, and VSYNC lines of VGA outputs in desktop and portable PCs against user-handling ESD events. IC Role / Device Role / Timing Role: Rail-clamp ESD suppressor placed directly at connector interface, referenced to system 5 V and GND rails. Use Value: 3 pF capacitance prevents video signal degradation; ±8 kV contact rating ensures compliance with IEC 61000−4−2 Level 4 testing. | Use Scenario: Safeguarding USB, audio jack, and SIM card interface lines in cellular handsets during manufacturing, assembly, and end-user handling. IC Role / Device Role / Timing Role: Low-capacitance transient voltage suppressor mounted adjacent to board edge connectors, clamping to internal 3.3 V and GND. Use Value: ±15 kV HBM rating protects sensitive baseband and PMIC I/O; 10 µA supply current minimizes standby power impact. |
| Digital Camera Interface | Notebook Computer Expansion Ports |
Use Scenario: Shielding high-speed camera sensor data lines (e.g., MIPI D-PHY) and control signals from ESD during lens attachment or SD card insertion. IC Role / Device Role / Timing Role: Six-channel ESD array deployed per interface group, with VP tied to camera module's 1.8 V or 2.8 V supply rail. Use Value: Independent channel architecture avoids crosstalk; low leakage preserves sensor bias stability during sleep modes. | Use Scenario: Hardening ExpressCard, PCMCIA, or legacy parallel/serial expansion ports on business notebooks against field ESD exposure. IC Role / Device Role / Timing Role: Front-end ESD guard for bidirectional data/control lines, with VP connected to 3.3 V or 5 V bus and VN to chassis ground. Use Value: Compact MSOP-8 footprint allows placement within tight connector keepouts; 6.0 V absolute max VP–VN supports mixed-voltage port designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4201MR6T1G | 4-channel array, 5.5 V max VP–VN, 3.5 pF typical CIN, same MSOP-8 package | Fewer channels; suitable for smaller I/O groups but requires two devices for 6-line protection | Select when protecting ≤4 lines or space-constrained dual-device layouts are acceptable |
| Diodes Inc. D3V3Z5-6 | 6-channel, 3.3 V clamp voltage, 12 pF CIN, SOT-26 package, no VP/VN supply pins | Capacitor-coupled architecture - lacks rail-clamp flexibility and higher capacitance limits speed | Prefer for cost-sensitive 3.3 V-only systems where 12 pF loading is tolerable |
Compared with NUP4201MR6T1G and D3V3Z5-6, the PACDN006MR uniquely combines six rail-clamp channels, 3 pF capacitance, and MSOP-8 footprint - enabling single-chip VGA or multi-signal protection without sacrificing signal integrity or board area.
Availability
PACDN006MR is available at Aetrix Electronics and suitable for VGA port protection, smartphone I/O hardening, and notebook expansion interface applications requiring stable component supply, RoHS compliance, and long-term lifecycle support.
Supply support for PACDN006MR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The PACDN006MR belongs to onsemi's ESD Protection Arrays product line, engineered specifically for high-density, low-capacitance I/O line protection in portable and consumer electronics with strict EMI and form-factor constraints.
FAQ
What is the maximum supply voltage range supported by the PACDN006MR?
The PACDN006MR supports an operating supply voltage range of 0 V to 5.5 V between VP and VN pins, with an absolute maximum rating of 6.0 V. This allows direct integration into both 3.3 V and 5 V logic domains without external voltage translation. The device remains functional across its full −40°C to +85°C temperature range within this supply window, and all electrical characteristics-including clamp voltage and leakage-are specified under these conditions. Exceeding 6.0 V risks permanent damage per Absolute Maximum Ratings.
Does the PACDN006MR require an external bypass capacitor, and if so, what value is recommended?
Yes, the PACDN006MR requires an external 0.22 µF ceramic capacitor connected between the VP and VN pins. This capacitor is essential to absorb high-frequency ESD energy and minimize voltage overshoot during transients-without it, parasitic inductance can cause clamp voltage to exceed VP + 13.0 V or VN − 13.0 V. The datasheet specifies that a 0.22 µF chip capacitor placed as close as possible to the PACDN006MR's VP pin achieves reliable IEC 61000−4−2 Level 4 (±8 kV) protection. Larger values do not improve performance and may degrade response time.
How many independent ESD protection channels does the PACDN006MR provide, and how are they configured?
The PACDN006MR provides six fully independent ESD protection channels (CH1 through CH6), each implemented as a pair of back-to-back diodes connected between the respective I/O pin and the shared VP and VN supply rails. There is no internal coupling between channels-each operates autonomously, allowing simultaneous protection of multiple signal lines such as VGA RGB, HSYNC, VSYNC, or USB D+/D−. Pin 3 (VN) and Pin 7 (VP) serve as common reference rails for all six channels, and proper low-inductance PCB routing to these pins is critical for effective clamping.
What is the typical input capacitance of the PACDN006MR, and why is it important for high-speed interfaces?
The PACDN006MR has a typical input capacitance of 3 pF per channel at 1 MHz, with a maximum of 5 pF. This low value is critical for preserving signal integrity on high-speed interfaces such as VGA, USB 2.0, and camera data buses-where excessive capacitance causes rise-time degradation, jitter, and bit errors. At 3 pF, the PACDN006MR introduces negligible loading on 100+ Mbps signals, enabling clean transmission without equalization or retiming. Its capacitance remains stable across input voltage (0–2.5 V), ensuring consistent performance in analog and digital applications alike.
Is the PACDN006MR RoHS compliant and lead-free, and what package variant does the 'MR' suffix indicate?
Yes, the PACDN006MR is RoHS compliant and features lead-free termination. The 'MR' suffix explicitly denotes the 8-pin MSOP package (Case 846AB), which measures 3.00 mm × 3.00 mm with a 1.10 mm maximum height. This miniature package offers a 50% board-area reduction versus the SOIC-8 variant (PACDN006SM), making it ideal for space-constrained applications like smartphones and ultrabooks. All onsemi PACDN006MR units shipped meet JEDEC J-STD-020 moisture sensitivity level 1 and are qualified for reflow soldering per IPC/JEDEC J-STD-020 standards.
PACDN006MR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
PACDN006MR FAQ
1.How can I place an order for PACDN006MR through Aetrix?
Please submit a Request for Quotation (RFQ) for PACDN006MR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PACDN006MR reliable?
The price and inventory of PACDN006MR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PACDN006MR is usually 5 days.
3.What payment methods are accepted for PACDN006MR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PACDN006MR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PACDN006MR?
PACDN006MR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PACDN006MR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PACDN006MR?
For technical support, including PACDN006MR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PACDN006MR requirements.
6.How does Aetrix verify that PACDN006MR is sourced from the original manufacturer or authorized distributors?
All PACDN006MR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PACDN006MR meets industry standards.
7.What is the process for return or replacement of PACDN006MR?
All PACDN006MR units undergo pre-shipment inspection (PSI). If there is an issue with PACDN006MR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PACDN006MR part is unused and in its original packaging.
Return procedure for PACDN006MR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PACDN006MR Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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