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onsemi PACDN006SM
- Part No.:
- PACDN006SM
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
PACDN006SM.pdf
- Description:
- ESD PROTECTION ARRAY
- Quantity:
- Payment:
- Shipping:
Inventory:7,434
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Product details
Overview
PACDN006SM from onsemi is a 6-channel ESD protection diode array in an 8-pin SOIC package, rated for ±8 kV contact and ±15 kV air discharge per IEC 61000−4−2 and MIL−STD−883 HBM, with 3 pF typical input capacitance and 1.5 kΩ dynamic impedance, used to safeguard I/O ports in portable electronics and VGA interfaces.
For engineers reviewing the PACDN006SM datasheet, pinout, applications, or equivalent options, key selection criteria include channel count, clamp voltage under 15 kV HBM (VP + 13.0 V / VN − 13.0 V), supply voltage range (0–5.5 V), leakage current (±1.0 µA max), and SOIC-8 footprint compatibility with layout-critical bypass capacitor placement.
Technical Context
The PACDN006SM implements rail-clamp architecture using bidirectional diode pairs per channel, steering ESD transients to VP (positive supply) or VN (ground reference). It operates within −40°C to +85°C and requires a 0.22 µF ceramic bypass capacitor between VP and VN to suppress high-frequency energy and limit clamp voltage rise caused by PCB trace inductance.
Each of its six I/O channels exhibits low loading capacitance (3 pF typ at 1 MHz, VP = 5 V, VN = 0 V, VIN = 2.5 V) and low leakage (±1.0 µA max), enabling use in battery-powered systems. The device supports supply voltages up to 5.5 V and withstands absolute maximum VP–VN differential of 6.0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000−4−2) | ±8 kV contact discharge - meets Level 4 immunity for handheld interface ports |
| ESD Rating (HBM) | ±15 kV - exceeds MIL−STD−883 Method 3015 requirement for robust board-level handling |
| Input Capacitance | 3 pF typical - preserves signal integrity on high-speed video and USB 2.0 lines |
| Clamp Voltage (15 kV HBM) | VP + 13.0 V / VN − 13.0 V - defines maximum transient overvoltage seen by protected IC |
| Leakage Current | ±1.0 µA max - minimizes standby power loss in battery-operated devices |
| Supply Voltage Range | 0 to 5.5 V - compatible with 3.3 V and 5 V logic domains without level-shifting |
| Operating Temp | −40°C to +85°C - supports industrial and consumer ambient conditions |
Pinout & Package
Package: 8-pin SOIC (Case 751BD), surface-mount, RoHS-compliant lead-free finish, 3.9 mm × 4.9 mm body size, 1.27 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | I/O channel 1 - bidirectionally clamped between VP and VN |
| 2 | CH2 | I/O channel 2 - independent ESD path, no internal coupling to other channels |
| 3 | VN | Negative supply rail - must be connected directly to system ground plane |
| 4 | CH3 | I/O channel 3 - shares same VP/VN rails but electrically isolated channel |
| 5 | CH4 | I/O channel 4 - low-capacitance path for high-frequency signal lines |
| 6 | CH5 | I/O channel 5 - designed for placement adjacent to connector entry points |
| 7 | VP | Positive supply rail - requires local 0.22 µF ceramic bypass capacitor to VN |
| 8 | CH6 | I/O channel 6 - sixth independent protection path for multi-lane interfaces |
Key Features
| Feature | Design Value |
|---|---|
| Six independent ESD channels | Enables full-port protection (e.g., VGA RGB+HSYNC+VSYNC) without external routing complexity |
| ±8 kV IEC contact discharge rating | Meets international regulatory requirements for end-product CE/FCC certification |
| 3 pF typical input capacitance | Minimizes signal distortion on 25–100 MHz video and data lines |
| Low leakage (±1.0 µA max) | Extends battery life in PDAs and portable medical monitors |
| SOIC-8 footprint | Supports automated SMT assembly and rework with standard industry tooling |
Applications
| VGA Port Protection | USB 2.0 Interface Protection |
|---|---|
Use Scenario: Protecting analog RGB, HSYNC, and VSYNC signals on desktop and notebook PC video outputs from user-handling ESD events. IC Role / Device Role / Timing Role: Rail-clamp ESD suppressor placed at connector edge, shunting transients before they reach GPU or display controller I/O cells. Use Value: Prevents latch-up or gate oxide damage in video driver ICs while maintaining <3 pF loading to preserve rise/fall time integrity. | Use Scenario: Safeguarding D+ and D− differential pair plus VBUS and ID pins in portable USB host/peripheral designs. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor referenced to local 3.3 V/5 V rails, operating below USB 2.0 eye diagram jitter thresholds. Use Value: Enables pass/fail compliance with IEC 61000−4−2 Level 4 without degrading signal integrity or requiring additional termination. |
| Cellular Phone Keypad & Button Lines | Industrial HMI Touch Panel I/O |
Use Scenario: Protecting mechanical keypad scan lines and side-button inputs exposed to frequent human contact in GSM/UMTS handsets. IC Role / Device Role / Timing Role: Low-leakage (±1.0 µA max) clamp diode array tied to battery rail, minimizing standby current drain. Use Value: Extends talk/standby time while delivering ±15 kV HBM robustness required for drop-test and factory handling reliability. | Use Scenario: Shielding resistive touch overlay controller I/O (X+, X−, Y+, Y−) in factory-floor HMIs subject to operator glove contact and tool proximity. IC Role / Device Role / Timing Role: Six-channel ESD array matching 4-wire touch controller pin count, with VN/VP rails referenced to isolated 3.3 V LDO output. Use Value: Eliminates need for discrete diodes per line, reducing BOM count and PCB area while ensuring uniform clamping behavior across all axes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4201MR6T1G | 4-channel, SOT-23-6 package, 12 pF capacitance, ±12 kV HBM | Fewer channels, higher capacitance - suitable only for low-speed digital I/O, not video | Select when space-constrained layouts require smaller footprint and channel count is ≤4 |
| Diodes Inc. D3V3Z5U-7 | 6-channel, SOT-23-6 package, 5.5 pF capacitance, ±8 kV IEC contact | Different package (SOT-23-6 vs SOIC-8), higher capacitance limits use on >10 MHz signals | Choose for cost-sensitive consumer designs where SOIC-8 reflow compatibility is not required |
Compared with NUP4201MR6T1G and D3V3Z5U-7, the PACDN006SM delivers lower capacitance (3 pF vs ≥5.5 pF) and SOIC-8 manufacturability, making it preferable for high-fidelity analog video and multi-lane digital interfaces where signal fidelity and assembly yield are critical.
Availability
PACDN006SM is available at Aetrix Electronics and suitable for VGA port protection, USB 2.0 interface hardening, and industrial HMI touch panel I/O requiring stable component supply across production lifecycles.
Supply support for PACDN006SM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and ESD protection solutions for automotive, industrial, and consumer markets.
The PACDN006SM belongs to onsemi's ESD protection array product line, engineered specifically for high-density, low-capacitance I/O port hardening in portable and interface-intensive electronics.
FAQ
What is the maximum supply voltage the PACDN006SM can handle?
The PACDN006SM supports an operating supply voltage range of 0 to 5.5 V between VP and VN pins. Its absolute maximum rating is 6.0 V, beyond which permanent damage may occur. For reliable operation in 5 V systems, ensure VP is tied to the nominal 5 V rail and VN to ground, with a 0.22 µF ceramic capacitor bridging them as specified in the PACDN006SM application circuit.
Does the PACDN006SM require external components to function properly?
Yes - the PACDN006SM requires a 0.22 µF ceramic bypass capacitor connected directly between VP and VN pins, placed as close as possible to the device. This capacitor absorbs high-frequency ESD energy and prevents excessive voltage overshoot due to PCB trace inductance. Without it, clamp voltage performance degrades significantly during IEC 61000−4−2 testing.
Can the PACDN006SM protect both analog and digital signals?
Yes - the PACDN006SM is designed for mixed-signal environments. Its 3 pF typical input capacitance ensures minimal impact on analog video bandwidth (e.g., VGA) and digital timing margins (e.g., USB 2.0 D+/D−). Each channel operates independently, allowing simultaneous protection of RGB, sync, and control lines without crosstalk or shared impedance effects.
What is the thermal performance of the PACDN006SM in continuous operation?
The PACDN006SM has a package power rating of 200 mW and operates over −40°C to +85°C. Under normal ESD suppression duty cycles (transient-only conduction), junction temperature rise is negligible. Continuous DC forward current is limited to 20 mA per diode (one at a time), and thermal resistance θJA for SOIC-8 is approximately 160°C/W - sufficient for ambient conditions without heatsinking.
How does the PACDN006SM compare to TVS diode arrays in terms of response time?
The PACDN006SM uses silicon diode clamping with sub-nanosecond response - faster than most polymer or ceramic TVS devices. Its rail-clamp topology activates immediately upon exceeding the diode forward voltage (~0.65 V), limiting transients before they propagate into protected ICs. Unlike avalanche-based TVS, it avoids snapback delay and exhibits predictable, repeatable clamping behavior across temperature and lifetime.
PACDN006SM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Discontinued at Digi-Key
- Type:
- Zener
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
PACDN006SM FAQ
1.How can I place an order for PACDN006SM through Aetrix?
Please submit a Request for Quotation (RFQ) for PACDN006SM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PACDN006SM reliable?
The price and inventory of PACDN006SM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PACDN006SM is usually 5 days.
3.What payment methods are accepted for PACDN006SM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PACDN006SM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PACDN006SM?
PACDN006SM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PACDN006SM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PACDN006SM?
For technical support, including PACDN006SM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PACDN006SM requirements.
6.How does Aetrix verify that PACDN006SM is sourced from the original manufacturer or authorized distributors?
All PACDN006SM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PACDN006SM meets industry standards.
7.What is the process for return or replacement of PACDN006SM?
All PACDN006SM units undergo pre-shipment inspection (PSI). If there is an issue with PACDN006SM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PACDN006SM part is unused and in its original packaging.
Return procedure for PACDN006SM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PACDN006SM Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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