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onsemi PACDN009MR
- Part No.:
- PACDN009MR
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
PACDN009MR.pdf
- Description:
- TVS DIODE 5.5V 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,980
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Product details
Overview
PACDN009MR from onsemi is a 5-channel ESD protection diode array in an 8-lead MSOP package, designed to clamp ±15 kV HBM and ±8 kV IEC 61000-4-2 contact discharge transients. It features 3 pF typical input capacitance, <±1.0 µA leakage current at ±0.1 V, and operates across −40°C to +85°C with VP–VN up to 5.5 V. It protects I/O lines in portable electronics such as cellular phones and notebook computers.
For engineers reviewing the PACDN009MR datasheet, pinout, applications, or equivalent options, key selection criteria include channel count, clamping voltage (VP + 13.0 V / VN − 13.0 V), low-capacitance interface compatibility, RoHS-compliant lead-free packaging, and supply rail coupling requirements for effective transient suppression.
Technical Context
The PACDN009MR implements rail-to-rail bidirectional clamping using five independent diode pairs-each steers ESD current to either VP (positive supply) or VN (ground reference). Its architecture requires external 0.22 µF ceramic bypass capacitance between VP and VN to absorb high-frequency ESD energy and minimize inductive voltage overshoot during fast transients.
All five channels share common VP and VN rails, with no internal connection between channels. Pin 2 is unconnected (N.C.), and operation is validated under standard IEC 61000-4-2 test conditions with 150 pF/330 Ω and MIL-STD-883 HBM with 100 pF/1.5 kΩ.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (HBM) | ±15 kV per channel - meets MIL-STD-883 Method 3015 for robust handling in manufacturing and end-user environments |
| ESD Rating (IEC 61000-4-2) | ±8 kV contact, ±15 kV air - certified for Level 4 system-level immunity compliance |
| Input Capacitance | 3 pF typical - enables use on high-speed interfaces (e.g., VGA, USB 2.0) without signal integrity degradation |
| Leakage Current | ±1.0 µA max at ±0.1 V - ensures minimal power drain in battery-powered portable devices |
| Clamp Voltage | VP + 13.0 V / VN − 13.0 V at 15 kV HBM - defines maximum protected-line overvoltage during worst-case ESD event |
| Supply Range | 0 to 5.5 V VP–VN - supports 3.3 V and 5 V logic systems without level-shifting circuitry |
| Operating Temp | −40°C to +85°C - qualified for industrial and consumer ambient operating conditions |
Pinout & Package
Package: 8-lead MSOP (Case 846AB), RoHS-compliant lead-free finish, 3.00 mm × 3.00 mm body, 0.65 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (CH1) | I/O Channel Input | Protected signal line; internally connected to diode pair routing to VP and VN rails |
| 2 (N.C.) | No Connect | Unbonded die pad; must remain floating - no PCB trace or copper pour connection |
| 3 (VN) | Negative Supply Rail | Ground reference node; must be low-inductance connection to system ground plane |
| 4 (CH2) | I/O Channel Input | Second protected signal line; electrically isolated from CH1 but shares VP/VN rails |
| 5 (CH3) | I/O Channel Input | Third protected signal line; identical clamping behavior and capacitance as CH1/CH2 |
| 6 (CH4) | I/O Channel Input | Fourth protected signal line; same electrical characteristics and layout rules apply |
| 7 (VP) | Positive Supply Rail | Bias rail for positive clamping; requires 0.22 µF ceramic capacitor directly to VN |
| 8 (CH5) | I/O Channel Input | Fifth protected signal line; fully independent channel with shared VP/VN infrastructure |
Key Features
| Feature | Design Value |
|---|---|
| 5-channel monolithic integration | Reduces board area vs. discrete diodes; eliminates inter-channel skew and layout mismatch |
| Rail-clamp topology | Enables low-clamp-voltage protection without external TVS or zener components |
| 3 pF typical input capacitance | Preserves signal rise/fall times on video and data lines up to ~500 MHz bandwidth |
| ±1.0 µA max leakage at ±0.1 V | Extends battery life in always-on portable devices with multi-day standby requirements |
| MSOP-8 footprint | Compatible with standard SMT assembly; allows automated optical inspection and reflow profiling |
Applications
| Cellular Phone Interface Protection | VGA Port Protection |
|---|---|
Use Scenario: Protecting SIM card slot, audio jack, and USB connector pins from user-handling ESD events in handheld mobile devices. IC Role / Device Role / Timing Role: ESD transient suppressor placed at board edge before signal conditioning ICs or baseband processor I/Os. Use Value: Prevents latch-up or permanent damage to 1.8 V/3.3 V I/O cells while maintaining <3 pF loading on high-speed analog/digital paths. | Use Scenario: Shielding red/green/blue sync and data lines of VGA output ports on desktop and notebook PCs against contact discharge. IC Role / Device Role / Timing Role: Low-capacitance rail-clamp array positioned immediately after connector footprint to minimize stub length. Use Value: Ensures signal fidelity up to 250 MHz pixel clock rates without adding jitter or attenuation due to parasitic capacitance. |
| Notebook Computer Expansion Ports | Digital Camera I/O Protection |
Use Scenario: Safeguarding ExpressCard or mini-PCIe hot-plug detect and sideband signals from electrostatic discharge during module insertion/removal. IC Role / Device Role / Timing Role: Point-of-entry ESD guard for auxiliary digital control lines sharing ground return with main bus. Use Value: Maintains functional integrity of 3.3 V tolerant GPIOs under repeated ±8 kV contact discharge stress without requiring redesign of power delivery network. | Use Scenario: Securing SD card interface, USB 2.0, and HDMI CEC lines in compact digital cameras exposed to frequent handling and environmental static. IC Role / Device Role / Timing Role: Integrated five-channel protector replacing multiple discrete diodes on space-constrained flex PCBs. Use Value: Achieves full IEC 61000-4-2 Level 4 compliance in <10 mm² area while reducing BOM count by four components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NUP4201MR6T1G | 4-channel, 3.3 V rated, 12 pF typical capacitance, ±12 kV HBM | Limited to lower-speed interfaces; higher capacitance restricts use on VGA/USB 2.0 | Select when fewer channels needed and cost sensitivity outweighs capacitance requirement |
| TPD4E001DRYR | 4-channel, 5.5 V rated, 3.5 pF typical capacitance, ±15 kV HBM, integrated 0.22 µF bypass cap | Includes embedded capacitor; eliminates one external component but increases package height | Choose when board space is constrained vertically and layout simplification is prioritized |
Compared with NUP4201MR6T1G and TPD4E001DRYR, the PACDN009MR offers five independent channels with lowest input capacitance (3 pF) and explicit support for 5.5 V operation-making it optimal for multi-line, high-speed, mixed-voltage I/O protection where minimal signal loading and rail flexibility are critical.
Availability
PACDN009MR is available at Aetrix Electronics and suitable for cellular phone interface protection, VGA port protection, and notebook computer expansion ports requiring stable component supply, consistent RoHS-compliant sourcing, and long-term lifecycle availability.
Supply support for PACDN009MR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The PACDN009MR belongs to onsemi's ESD Protection Arrays product line, engineered specifically for high-density, low-capacitance transient suppression in portable and interface-rich consumer electronics.
FAQ
What is the maximum supply voltage rating for PACDN009MR?
The PACDN009MR has an absolute maximum supply voltage (VP – VN) rating of 6.0 V, with recommended operating range from 0 V to 5.5 V. This allows safe integration into both 3.3 V and 5 V systems. Exceeding 6.0 V risks permanent damage to internal diode junctions. The PACDN009MR must be used within these limits to ensure reliable ESD clamping performance and long-term reliability.
Does PACDN009MR require an external bypass capacitor, and if so, what value is recommended?
Yes, the PACDN009MR requires an external 0.22 µF ceramic capacitor between VP (Pin 7) and VN (Pin 3). This capacitor absorbs high-frequency ESD energy and minimizes inductive voltage overshoot during fast transients. The PACDN009MR datasheet specifies this value for compliance with IEC 61000-4-2 Level 4 (±8 kV contact discharge). Placement must be adjacent to the device with minimal trace length.
What is the function of Pin 2 (N.C.) on PACDN009MR, and how should it be handled on the PCB?
Pin 2 on the PACDN009MR is a no-connect terminal - it is not bonded to the die and serves no electrical function. It must remain unconnected on the PCB: no trace, no copper pour, and no solder mask opening. Connecting Pin 2 may introduce unintended parasitics or mechanical stress. The PACDN009MR's functionality and ESD performance are unaffected by correct N.C. handling.
How does PACDN009MR achieve ±15 kV ESD protection while maintaining only 3 pF input capacitance?
The PACDN009MR achieves high ESD robustness with low capacitance through optimized silicon geometry and shallow-junction diode design that maximizes breakdown uniformity without increasing junction area. Its 3 pF typical capacitance is measured at 1 MHz with 2.5 V bias, reflecting minimal parasitic contribution. The PACDN009MR delivers this performance without sacrificing clamping voltage or leakage - enabling simultaneous high-speed signal integrity and system-level ESD immunity.
Can PACDN009MR be used to protect USB 2.0 data lines, and what layout considerations apply?
Yes, the PACDN009MR is suitable for USB 2.0 D+ and D− line protection due to its 3 pF typical input capacitance and ±15 kV HBM rating. Layout requires symmetric placement with matched trace lengths, direct routing to the USB connector, and the 0.22 µF VP–VN capacitor placed within 2 mm of Pins 3 and 7. The PACDN009MR must be located before any series impedance or ESD-sensitive PHY to ensure effective transient shunting.
PACDN009MR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 5
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 13V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 3pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
PACDN009MR FAQ
1.How can I place an order for PACDN009MR through Aetrix?
Please submit a Request for Quotation (RFQ) for PACDN009MR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PACDN009MR reliable?
The price and inventory of PACDN009MR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PACDN009MR is usually 5 days.
3.What payment methods are accepted for PACDN009MR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PACDN009MR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PACDN009MR?
PACDN009MR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PACDN009MR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PACDN009MR?
For technical support, including PACDN009MR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PACDN009MR requirements.
6.How does Aetrix verify that PACDN009MR is sourced from the original manufacturer or authorized distributors?
All PACDN009MR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PACDN009MR meets industry standards.
7.What is the process for return or replacement of PACDN009MR?
All PACDN009MR units undergo pre-shipment inspection (PSI). If there is an issue with PACDN009MR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PACDN009MR part is unused and in its original packaging.
Return procedure for PACDN009MR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PACDN009MR Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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