My Inquiry
My Account
onsemi PACDN042YB3-LF
- Part No.:
- PACDN042YB3-LF
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- SC-70, SOT-323
- Datasheet:
-
PACDN042YB3-LF.pdf
- Description:
- SURGE PROTECTORARRAYS
- Quantity:
- Payment:
- Shipping:
Inventory:5,800
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PACDN042YB3-LF from onsemi is a 3-pin SC-70 ESD protection diode array designed for low-capacitance, high-reliability transient suppression on signal lines. It delivers ±20 kV IEC 61000-4-2 contact ESD protection, 5.5 V reverse stand-off voltage, 30 pF capacitance at 2.5 VDC/1 MHz, and clamps to ≤6.8 V (positive) and ≥−0.8 V (negative) at 10 mA - ideal for USB 2.0 data line protection in portable electronics.
For engineers reviewing the PACDN042YB3-LF datasheet, pinout, applications, or equivalent options, key selection criteria include its SC-70-3 package footprint, dual-cathode/GND terminal configuration, low-leakage (<100 nA at 5 V), and compatibility with space-constrained high-speed interfaces requiring sub-10 pF–level parasitic impact.
Technical Context
This device implements a dual-channel unidirectional ESD protection architecture with shared GND anode and two independent cathodes - each channel protects one signal line against fast transients while maintaining minimal signal distortion. Its low 30 pF capacitance and <1.4 Ω dynamic resistance ensure integrity for 480 Mbps USB 2.0 differential pairs without measurable eye degradation.
The PACDN042YB3-LF operates across −40 °C to +85 °C and withstands ±30 kV HBM per MIL-STD-883D Method 3015, confirming robustness in handling human-body discharge events prior to system-level integration. All pins are rated for ±20 kV IEC 61000-4-2 contact discharge with GND pins grounded and other channels open.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±20 kV contact discharge - meets Level 4 immunity for exposed ports without external TVS staging |
| Reverse Stand-off Voltage (VRWM) | 5.5 V - ensures no conduction during normal 5 V USB signaling, preserving logic levels |
| Capacitance (CJ) | 30 pF at 2.5 VDC/1 MHz - low enough to avoid signal rise-time degradation on USB 2.0 D+/D− lines |
| Clamp Voltage (VC) | +6.8 V / −0.8 V at 10 mA - limits transient overshoot below IC absolute maximum ratings |
| Leakage Current (ILEAK) | <100 nA at 5.0 VDC - prevents DC loading or bias shift in high-impedance interface receivers |
| Operating Temperature | −40 °C to +85 °C - supports industrial-grade deployment in consumer and embedded host systems |
| Package Power Dissipation | 0.2 W (SC-70) - sufficient for single-pulse ESD energy absorption without thermal runaway |
Pinout & Package
SC-70-3 package (Case 419AB), 1.25 mm × 2.0 mm footprint, 0.65 mm pitch, 0.9 mm max height - optimized for automated placement and reflow in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode | Signal line input for Channel 1 - connects directly to protected node (e.g., USB D+) |
| 2 | GND | Anode common return - must be connected to low-inductance system ground plane |
| 3 | Cathode | Signal line input for Channel 2 - connects directly to second protected node (e.g., USB D−) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-channel unidirectional ESD protection | Independent cathodes enable simultaneous protection of two bidirectional signal lines (e.g., USB differential pair) without cross-talk |
| Low 30 pF junction capacitance | Maintains signal integrity up to 480 Mbps; avoids timing skew or attenuation in high-speed digital interfaces |
| ±20 kV IEC 61000-4-2 contact rating | Eliminates need for secondary board-level protection in handheld and docking applications |
| Pb-free and RoHS-compliant | Meets global environmental compliance requirements for consumer electronics manufacturing |
| SC-70-3 compact SMT package | Reduces PCB area by >35% vs. SOT-23-3; enables routing under connectors and tight port layouts |
Applications
| USB 2.0 Port Protection | Serial Interface Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of a USB 2.0 upstream/downstream port against user-handling ESD events during cable insertion or hot-plug. IC Role / Device Role / Timing Role: Low-capacitance transient voltage suppressor placed immediately adjacent to the USB connector, before any series impedance or EMI filter. Use Value: Prevents latch-up or gate oxide damage in USB transceivers while adding only 30 pF load - preserving full 480 Mbps bandwidth compliance. |
Use Scenario: Safeguarding RS-232 or UART TX/RX pins on microcontroller evaluation boards exposed to bench-level ESD during debug and firmware updates. IC Role / Device Role / Timing Role: Point-of-entry ESD clamp on each signal line, referenced to local ground, with leakage current below 100 nA to avoid false logic transitions. Use Value: Enables reliable field-programmable operation without requiring redesign of level-shifting or pull-up networks due to added parasitics. |
| Industrial Docking Station Ports | Consumer Audio Interface Protection |
Use Scenario: Securing proprietary high-speed docking interface pins (e.g., 10-pin flex connector) on tablet accessories subjected to repeated mating cycles and static-prone environments. IC Role / Device Role / Timing Role: Dual-channel discrete ESD suppressor mounted per signal pair, leveraging shared GND to minimize component count and layout complexity. Use Value: Achieves IEC 61000-4-2 Level 4 compliance with single-device solution - reducing BOM cost and test time vs. multi-diode arrays. |
Use Scenario: Shielding analog audio line inputs (e.g., 3.5 mm TRRS jack mic/line-in paths) in smartphones and wearables from electrostatic discharge during headphone insertion. IC Role / Device Role / Timing Role: Low-leakage, low-capacitance ESD clamp on each analog path, operating within ±5 V signal swing range without forward conduction. Use Value: Prevents audible pop/noise or ADC saturation caused by ESD-induced rail bounce, with no DC offset introduced into sensitive audio front-end stages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRSR | Single-channel, 0.5 pF typical capacitance, 5.5 V VRWM, SC-70-3 package | Lower capacitance but only one channel - requires two devices for differential pair protection | Preferred when ultra-low capacitance is critical and board area allows dual placement |
| ESD5Z3.3T5G | Single-channel, 3.3 V VRWM, 30 pF, SOD-523 package | Lower stand-off voltage limits use to 3.3 V systems; smaller 1.2 × 0.8 mm footprint | Appropriate for 3.3 V I/O rails where tighter voltage margin is acceptable and size is paramount |
Compared with TPD2E001DRSR and ESD5Z3.3T5G, the PACDN042YB3-LF uniquely provides dual-channel protection in a single SC-70-3 package at 5.5 V stand-off - reducing component count and layout overhead for USB and other 5 V differential interfaces without sacrificing ESD robustness or signal fidelity.
Availability
PACDN042YB3-LF is available at Aetrix Electronics and suitable for USB 2.0 port protection, serial interface hardening, and industrial docking station designs requiring stable component supply and long-term manufacturability.
Supply support for PACDN042YB3-LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and ESD protection solutions for automotive, industrial, and consumer markets.
The PACDN042YB3-LF belongs to onsemi's PACDN family of low-capacitance ESD arrays - engineered specifically for high-speed digital interface protection where signal integrity, small footprint, and certified IEC 61000-4-2 immunity are jointly required.
FAQ
What is the exact pin configuration of PACDN042YB3-LF?
The PACDN042YB3-LF uses an SC-70-3 package with Pin 1 = Cathode (Channel 1), Pin 2 = GND (common anode), and Pin 3 = Cathode (Channel 2). This dual-cathode configuration allows independent protection of two signal lines sharing a single ground reference - confirmed in the official onsemi datasheet Figure 2 and Table 1.
Does PACDN042YB3-LF support bidirectional signal lines like USB D+ and D−?
Yes, PACDN042YB3-LF supports bidirectional signal lines via its unidirectional dual-diode architecture: each cathode connects to a signal line, and the shared GND pin serves as the common anode reference. During positive transients, current flows from cathode to GND; during negative transients, the diode blocks until clamping occurs - enabling full protection for USB 2.0 differential pairs without polarity constraints.
What is the maximum operating temperature range for PACDN042YB3-LF?
The PACDN042YB3-LF is specified for continuous operation from −40 °C to +85 °C, as stated in Table 3 (Standard Operating Conditions) of the onsemi datasheet. This range covers commercial and industrial ambient conditions typical for portable electronics, docking stations, and embedded host controllers where the PACDN042YB3-LF is deployed.
How does PACDN042YB3-LF compare to SOT-23-3 variants like PACDN042Y3R?
The PACDN042YB3-LF is the SC-70-3 packaged variant, whereas PACDN042Y3R uses SOT-23-3. Both share identical electrical specs (VRWM = 5.5 V, C = 30 pF, ±20 kV ESD), but PACDN042YB3-LF offers a 35% smaller footprint (1.25 × 2.0 mm vs. 2.9 × 1.3 mm) and lower profile - making it preferable for space-constrained layouts where the SC-70-3 thermal and mechanical characteristics meet design requirements.
Is PACDN042YB3-LF compliant with RoHS and lead-free assembly standards?
Yes, PACDN042YB3-LF is explicitly marked Pb-Free and RoHS-compliant per the onsemi datasheet Features section and Ordering Information table. It supports standard lead-free reflow profiles (J-STD-020) and carries the "G" or microdot marking per onsemi's generic marking diagram - ensuring compatibility with modern electronics manufacturing processes.
PACDN042YB3-LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- SC-70, SOT-323
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Discontinued at Digi-Key
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 6.1V (Min)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 8V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- USB
- Capacitance @ Frequency:
- 30pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-70-3
PACDN042YB3-LF FAQ
1.How can I place an order for PACDN042YB3-LF through Aetrix?
Please submit a Request for Quotation (RFQ) for PACDN042YB3-LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PACDN042YB3-LF reliable?
The price and inventory of PACDN042YB3-LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PACDN042YB3-LF is usually 5 days.
3.What payment methods are accepted for PACDN042YB3-LF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PACDN042YB3-LF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PACDN042YB3-LF?
PACDN042YB3-LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PACDN042YB3-LF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PACDN042YB3-LF?
For technical support, including PACDN042YB3-LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PACDN042YB3-LF requirements.
6.How does Aetrix verify that PACDN042YB3-LF is sourced from the original manufacturer or authorized distributors?
All PACDN042YB3-LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PACDN042YB3-LF meets industry standards.
7.What is the process for return or replacement of PACDN042YB3-LF?
All PACDN042YB3-LF units undergo pre-shipment inspection (PSI). If there is an issue with PACDN042YB3-LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PACDN042YB3-LF part is unused and in its original packaging.
Return procedure for PACDN042YB3-LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PACDN042YB3-LF Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
