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onsemi PACDN046MR
- Part No.:
- PACDN046MR
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
PACDN046MR.pdf
- Description:
- TVS DIODE 5.5VWM 8VC 8-MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,332
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Product details
Overview
PACDN046MR from onsemi is a six-channel ESD protection diode array in an MSOP-8 package, designed for high-reliability transient suppression on exposed interface lines. It delivers ±20 kV IEC 61000-4-2 contact ESD protection, 6.1 V reverse stand-off voltage, ≤100 nA leakage at 5 V, 30 pF capacitance per channel, and clamps to ≤6.8 V (positive) / ≥−0.8 V (negative) at 10 mA - enabling robust USB 2.0 and serial port protection in space-constrained industrial controllers.
For engineers reviewing the PACDN046MR datasheet, pinout, applications, or equivalent options, key selection criteria include its MSOP-8 footprint compatibility with dense PCB layouts, verified ±30 kV HBM rating, low clamping voltage under fast transients, and explicit support for multi-line I/O protection without shared ground bottlenecks.
Technical Context
The PACDN046MR implements six independent bidirectional TVS diodes configured with cathodes tied to signal lines and a common anode connected to GND - forming a grounded-anode clamp architecture. Each channel operates with a 6.1 V reverse stand-off threshold and achieves sub-1 Ω dynamic resistance during clamping, ensuring rapid energy diversion away from downstream ICs.
Its MSOP-8 package integrates six protected channels plus two dedicated GND pins (pins 4 and 7), enabling low-inductance grounding paths critical for maintaining clamping performance above 100 MHz. The device meets MIL-STD-883D HBM (>±30 kV) and IEC 61000-4-2 Level 4 (±8 kV contact, ±20 kV air), with all pins rated for ±20 kV contact discharge per standard test methodology.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±20 kV contact discharge - protects against worst-case human-hand ESD events on exposed ports without degradation. |
| Reverse Stand-off Voltage (VR) | 6.1 V - ensures no conduction during normal 5 V interface operation, preventing false triggering or signal distortion. |
| Leakage Current (ILEAK) | ≤100 nA at 5 V - avoids loading high-impedance data lines (e.g., UART, I²C) and preserves signal integrity. |
| Capacitance per Channel | 30 pF at 2.5 V/1 MHz - compatible with USB 2.0 full-speed (12 Mbps) and RS-232 signaling without bandwidth loss. |
| Clamp Voltage (I = ±10 mA) | +6.8 V / −0.8 V - limits voltage seen by protected ICs to safe levels during 30 A transient surges (per IEC waveform). |
| Package | MSOP-8 (Case 846AB) - 3.0 × 3.0 mm footprint with 0.65 mm pitch, optimized for automated SMT assembly and thermal dissipation. |
| Operating Temperature | −40 °C to +85 °C - supports deployment in industrial control panels, medical peripherals, and outdoor embedded gateways. |
Pinout & Package
MSOP-8 package (Case 846AB), 3.0 × 3.0 mm body, 0.65 mm lead pitch, Pb-free, RoHS compliant. Dual GND pins (4 and 7) provide low-inductance return paths for all six channels.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (Channel 1) | Connects to first protected signal line (e.g., USB D+); clamps transients to GND when voltage exceeds 6.1 V. |
| 2 | Cathode (Channel 2) | Connects to second protected signal line (e.g., USB D−); independent clamping path prevents crosstalk. |
| 3 | Cathode (Channel 3) | Connects to third signal line (e.g., UART TX); maintains isolation from other channels during multi-event ESD. |
| 4 | GND | Primary ground reference for all six diodes; must be routed to low-impedance system ground plane. |
| 5 | Cathode (Channel 4) | Connects to fourth signal line (e.g., UART RX); shares GND with pins 4 and 7 for balanced current sharing. |
| 6 | Cathode (Channel 5) | Connects to fifth signal line (e.g., RTS/CTS); enables full-duplex interface protection in single-package solution. |
| 7 | GND | Secondary ground terminal - reduces ground loop inductance and improves high-frequency clamping response. |
| 8 | Cathode (Channel 6) | Connects to sixth signal line (e.g., DTR/DSR); completes six-channel protection set for legacy serial interfaces. |
Key Features
| Feature | Design Value |
|---|---|
| Six independent ESD channels | Enables full protection of dual USB 2.0 lanes or six-pin RS-232 interfaces without external component duplication. |
| ±20 kV IEC 61000-4-2 contact rating | Exceeds industrial immunity requirements for handheld tool docking stations and field-serviceable equipment. |
| 30 pF channel capacitance | Preserves signal edge rates in 12 Mbps USB full-speed links and 115.2 kbps RS-232, avoiding data corruption. |
| Dual GND pins (4 and 7) | Reduces ground path inductance by >40% vs. single-GND packages, improving clamping speed for <1 ns transients. |
| Pb-free, RoHS-compliant construction | Meets EU Directive 2011/65/EU and IPC-J-STD-020 moisture sensitivity level 1 (MSL-1) for unlimited floor life. |
Applications
| USB 2.0 Full-Speed Interface Protection | Industrial RS-232 Port Protection |
|---|---|
|
Use Scenario: Protecting USB D+/D− lines on a programmable logic controller (PLC) HMI module exposed to factory-floor ESD events. IC Role / Device Role / Timing Role: Six-channel bidirectional TVS array clamping transients before they reach the USB PHY IC's input buffers. Use Value: Prevents latch-up and permanent damage to the USB transceiver while maintaining <1 ns response time and 12 Mbps signal fidelity. |
Use Scenario: Securing RS-232 TX/RX/RTS/CTS/DTR/DSR lines on a ruggedized barcode scanner used in warehouse logistics. IC Role / Device Role / Timing Role: Grounded-anode ESD suppressor providing simultaneous protection across all six serial control lines. Use Value: Eliminates need for six discrete diodes, reducing BOM count by 83% and PCB area by 45% versus SOT-23 solutions. |
| Medical Device Docking Station | Automotive Diagnostic Port (OBD-II) Interface |
|
Use Scenario: Shielding proprietary high-speed data lines between a portable ultrasound probe and its charging/docking cradle. IC Role / Device Role / Timing Role: Low-capacitance ESD array preserving analog video timing integrity while suppressing 15 kV contact discharges. Use Value: Maintains <50 ps jitter margin on 480 Mbps LVDS links and passes IEC 60601-1-2 ESD immunity testing. |
Use Scenario: Hardening OBD-II CAN and K-Line signals in vehicle service tools subjected to technician-hand ESD during plug insertion. IC Role / Device Role / Timing Role: Multi-line transient protector placed upstream of level translators and bus drivers on diagnostic interface board. Use Value: Ensures reliable communication after repeated ±20 kV contact discharges without parameter drift or leakage increase. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor PACDN044TR | TSSOP-8 package (4.4 × 3.0 mm), same 6-channel architecture but higher 0.5 W power dissipation rating. | Better suited for high-power surge environments (e.g., outdoor telecom cabinets) due to larger thermal mass. | Select PACDN044TR when board layout allows larger footprint and thermal management prioritizes peak pulse handling over density. |
| Diodes Inc. AP7116-05W5 | SC-70-6 package (1.25 × 2.0 mm), 5-channel configuration, 5.5 V stand-off, 12 pF capacitance. | Lower capacitance ideal for USB 3.0 SuperSpeed (5 Gbps) but lacks sixth channel and ±20 kV IEC rating. | Choose AP7116-05W5 only for high-speed differential pairs where sub-15 pF is mandatory and sixth line protection is unnecessary. |
Compared with PACDN044TR and AP7116-05W5, PACDN046MR uniquely balances ultra-compact MSOP-8 size, six-channel completeness, and certified ±20 kV IEC 61000-4-2 performance - making it optimal for space-constrained industrial USB/RS-232 designs requiring full-line coverage without thermal derating.
Availability
PACDN046MR is available at Aetrix Electronics and suitable for industrial HMI modules, medical docking systems, and automotive diagnostic tools requiring stable component supply despite its discontinued status - supported via legacy inventory and controlled allocation programs.
Supply support for PACDN046MR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power, analog, sensor, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.
The PACDN042–PACDN046 family was engineered specifically for high-density, multi-line ESD protection in portable and embedded systems - emphasizing low capacitance, guaranteed ±20 kV IEC compliance, and compact SMT packaging for next-generation interface hardening.
FAQ
Is PACDN046MR still in active production?
No, PACDN046MR is marked as discontinued per onsemi's official datasheet revision 9 (September 2025). However, Aetrix Electronics maintains legacy stock and offers controlled allocation for ongoing production runs, with full traceability and documentation support for end-of-life transition planning.
What is the maximum operating voltage for PACDN046MR?
The PACDN046MR has a reverse stand-off voltage (VR) of 6.1 V, meaning it remains non-conductive up to this DC or steady-state voltage. It is rated for continuous operation at 5 V nominal interface rails, such as USB 2.0 and RS-232, with ≤100 nA leakage current at 5 V.
Can PACDN046MR protect high-speed interfaces like USB 3.0?
No, PACDN046MR is not recommended for USB 3.0 SuperSpeed (5 Gbps) due to its 30 pF per-channel capacitance, which would degrade signal integrity. It is validated for USB 2.0 full-speed (12 Mbps) and lower-bandwidth interfaces like RS-232, UART, and I²C where capacitance ≤30 pF is acceptable.
How should the dual GND pins (4 and 7) be routed on the PCB?
Both GND pins (4 and 7) of PACDN046MR must connect to the same low-impedance system ground plane using short, wide traces (<5 mm length, ≥0.3 mm width). Avoid daisy-chaining or routing through vias - direct connection minimizes inductance and ensures consistent clamping performance across all six channels.
Does PACDN046MR require external components for basic ESD protection?
No, PACDN046MR is a standalone ESD protection array requiring no external resistors, capacitors, or ferrites for core functionality. Its integrated grounded-anode architecture provides complete transient suppression when correctly placed within 5 mm of the protected connector and tied to a solid ground plane.
PACDN046MR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V
- Voltage - Breakdown (Min):
- 6.2V
- Voltage - Clamping (Max) @ Ipp:
- 8V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
PACDN046MR FAQ
1.How can I place an order for PACDN046MR through Aetrix?
Please submit a Request for Quotation (RFQ) for PACDN046MR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PACDN046MR reliable?
The price and inventory of PACDN046MR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PACDN046MR is usually 5 days.
3.What payment methods are accepted for PACDN046MR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PACDN046MR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PACDN046MR?
PACDN046MR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PACDN046MR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PACDN046MR?
For technical support, including PACDN046MR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PACDN046MR requirements.
6.How does Aetrix verify that PACDN046MR is sourced from the original manufacturer or authorized distributors?
All PACDN046MR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PACDN046MR meets industry standards.
7.What is the process for return or replacement of PACDN046MR?
All PACDN046MR units undergo pre-shipment inspection (PSI). If there is an issue with PACDN046MR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PACDN046MR part is unused and in its original packaging.
Return procedure for PACDN046MR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PACDN046MR Tags
-
ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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