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onsemi PACDN1404CG
- Part No.:
- PACDN1404CG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 6-WFBGA, WLCSP
- Datasheet:
-
PACDN1404CG.pdf
- Description:
- TVS DIODE 5.5VWM 8VC 6WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:8,373
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Product details
Overview
PACDN1404CG from onsemi is a 4-channel ESD protection diode array in a 6-bump WLCSP (1.80 × 1.15 mm, 0.65 mm pitch) for I/O port and keypad protection in portable electronics. It delivers ±25 kV IEC 61000−4−2 contact discharge protection, ±30 kV HBM ESD rating, 5.5 V reverse standoff voltage, 39–47 pF channel capacitance, and clamps transients to +12 V / −8 V at 8 kV ESD stress.
For engineers reviewing the PACDN1404CG datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance for high-speed interfaces, chip-scale footprint for space-constrained layouts, and verified ±25 kV system-level ESD robustness per IEC 61000−4−2 Level 4.
Technical Context
The PACDN1404CG integrates four bidirectional TVS diodes in a monolithic silicon structure, each configured as a low-capacitance clamp between I/O and ground. Its design targets fast transient response (<1 ns) and minimal signal distortion in high-frequency data lines such as USB 2.0, SD card, and touchscreen interfaces.
All four channels share a common GND terminal and operate independently under ESD stress-each pin rated for ±25 kV contact discharge per IEC 61000−4−2 with no interaction between channels during single-pin testing. The device uses solder bumps instead of wire bonds, enabling direct mounting on laminate PCBs without underfill.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000−4−2) | ±25 kV contact discharge - meets Level 4 immunity without external shielding or layout reinforcement |
| ESD Rating (HBM) | ±30 kV - exceeds MIL−STD−883D Method 3015, supporting robust handling in manufacturing |
| Reverse Standoff Voltage | 5.5 V - compatible with 3.3 V and 5 V logic rails without leakage-induced signal degradation |
| Clamping Voltage (8 kV ESD) | +12 V / −8 V - limits transient overvoltage to safe levels for downstream ICs like PMICs or touch controllers |
| Channel Capacitance | 39–47 pF @ 2.5 V, 1 MHz - enables use in 480 Mbps USB 2.0 and SDIO interfaces without signal integrity loss |
| Operating Temp Range | −40 °C to +85 °C - supports full industrial temperature operation in handheld and notebook environments |
| Package | WLCSP6 (1.80 × 1.15 mm, 0.65 mm pitch) - reduces board area by >70% vs. SOT-563 discrete solutions |
Pinout & Package
Package: 6-bump Wafer-Level Chip Scale Package (WLCSP6), RoHS-compliant, lead-free, case 567BD. Dimensions: 1.80 × 1.15 mm, 0.65 mm pitch, solder ball coplanarity ±20 µm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | I/O Channel 1 Anode | Input/output node for first protected line; connects to trace requiring ESD hardening (e.g., USB D+) |
| A2 | I/O Channel 2 Anode | Second protected signal line; electrically isolated from A1 during ESD events |
| A3 | I/O Channel 3 Anode | Third protected line; shares GND return path but clamps independently |
| B1 | I/O Channel 4 Anode | Fourth protected line; enables quad-port protection in single footprint |
| B2 | GND | Common cathode connection for all four diodes; must be low-inductance PCB tie to system ground plane |
| B3 | NC | No internal connection; unused bump - omitted from electrical routing and thermal relief |
Key Features
| Feature | Design Value |
|---|---|
| Four-channel ESD protection | Single-package solution for quad-line interfaces (e.g., USB 2.0 + ID pin, SDIO CMD/DAT0/DAT1), eliminating four discrete diodes and associated layout complexity |
| ±25 kV IEC 61000−4−2 contact discharge | Validated system-level immunity allows pass/fail compliance without additional board-level filtering or guard traces |
| Low 39–47 pF channel capacitance | Maintains signal rise/fall times <1 ns for 480 Mbps USB 2.0 eye diagrams; avoids jitter or bit errors in high-speed digital links |
| WLCSP6 footprint (1.80 × 1.15 mm) | Reduces PCB real estate by 75% vs. SOT-563 packages; enables placement directly adjacent to connectors or SoC I/O pads |
| Lead-free, RoHS-compliant construction | Compatible with Pb-free reflow profiles (peak 260°C); eliminates post-soldering lead contamination risk in consumer supply chains |
Applications
| USB 2.0 Interface Protection | Smartphone Keypad & Button Circuits |
|---|---|
Use Scenario: Protecting D+, D−, ID, and VBUS pins of micro-USB receptacles against repeated plug/unplug ESD events in handheld devices. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between connector and SoC PHY, clamping surges before they reach sensitive analog front-end circuitry. Use Value: Enables certified ±25 kV IEC 61000−4−2 compliance with zero added propagation delay or signal attenuation on 480 Mbps differential pairs. | Use Scenario: Shielding mechanical keypad matrix rows/columns and capacitive touch buttons from user-hand ESD in smartphones and wearables. IC Role / Device Role / Timing Role: Low-leakage (100 nA @ 3.3 V) clamp diode array tied to each key trace, referenced to shared ground plane. Use Value: Prevents false keypresses or reset events caused by ±8 kV contact discharges while maintaining <100 nA standby current draw. |
| Digital Camera Sensor Interfaces | Notebook SD Card Slots |
Use Scenario: Safeguarding MIPI CSI-2 clock/data lanes and focus/zoom control lines in compact camera modules exposed to field ESD. IC Role / Device Role / Timing Role: Four-channel ESD suppressor placed at sensor flex cable entry point, minimizing stub length to preserve 1 GHz bandwidth. Use Value: 47 pF max capacitance ensures <0.5 dB insertion loss at 1 GHz, preserving image sensor timing accuracy and SNR. | Use Scenario: Hardening SDIO CMD, DAT0–DAT3 lines in ultrabook card readers subjected to frequent card insertion/removal ESD. IC Role / Device Role / Timing Role: Quad-channel TVS array mounted within 2 mm of SD card edge connector, providing localized clamping before signals route to host controller. Use Value: Clamps 8 kV transients to ≤+12 V/≥−8 V, preventing latch-up or register corruption in SD host controllers operating at 3.3 V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NUP4202MR6T1G | 6-pin SOT-563 package; 5.5 V standoff; 30 pF typical capacitance; ±20 kV IEC 61000−4−2 contact rating | Larger footprint (2.2 × 1.35 mm); higher thermal resistance; requires solder mask defined pads | Preferred when board assembly uses legacy SMT lines calibrated for SOT-563, not WLCSP |
| TPD4E001DRYR | 4-channel, 1.6 × 1.6 mm X2SON package; 5 V standoff; 3.5 pF typical capacitance; ±15 kV IEC 61000−4−2 contact rating | Lower capacitance enables USB 3.0 compatibility; lower ESD rating limits use to non-exposed ports | Selected when ultra-low capacitance is critical and system-level ESD exposure is controlled (e.g., internal daughterboards) |
Compared with NUP4202MR6T1G and TPD4E001DRYR, the PACDN1404CG offers the highest IEC 61000−4−2 contact rating (±25 kV) in the smallest footprint (1.80 × 1.15 mm), making it optimal for exposed, space-constrained interfaces where maximum ESD margin is required without sacrificing signal integrity.
Availability
PACDN1404CG is available at Aetrix Electronics and suitable for smartphone USB interfaces, notebook SD card slots, digital camera sensor links, and handheld PDA keypad circuits requiring stable component supply across high-volume production cycles.
Supply support for PACDN1404CG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, and consumer markets.
The PACDN1404CG belongs to onsemi's OptiGuard® ESD protection portfolio, engineered specifically for ultra-compact, high-immunity protection of high-speed digital interfaces in portable electronics.
FAQ
What is the maximum clamping voltage of the PACDN1404CG during an 8 kV ESD event?
The PACDN1404CG clamps positive transients to +12 V and negative transients to −8 V when subjected to an 8 kV ESD pulse per MIL−STD−883 Method 3015. This clamping performance is measured with one channel stressed while others remain open and GND pins tied to ground, ensuring downstream ICs see voltage excursions within safe operating limits. The PACDN1404CG maintains this behavior across its full −40 °C to +85 °C operating range.
Does the PACDN1404CG require underfill for reliable PCB attachment?
No, the PACDN1404CG does not require underfill. Its wafer-level chip-scale package uses large solder bumps designed for standard reflow attachment to laminate PCBs. The device's mechanical specifications-including coplanarity of ±20 µm and recommended non-solder-mask-defined pads-enable robust interconnect reliability without underfill, simplifying assembly and reducing process cost. This is confirmed in the official onsemi packaging specification for case 567BD.
What is the leakage current specification for the PACDN1404CG at 3.3 V DC?
The PACDN1404CG exhibits a maximum leakage current of 100 nA at 3.3 V DC, as specified in Table 3 of its datasheet. This low leakage ensures minimal impact on battery-powered systems, preserving standby current budgets in portable devices such as smartphones and PDAs. The value is measured at TA = 25 °C and applies to all four channels independently, supporting designs where signal integrity and power efficiency are both critical.
Can the PACDN1404CG be used for USB 2.0 high-speed (480 Mbps) data lines?
Yes, the PACDN1404CG is qualified for USB 2.0 high-speed applications. With a channel capacitance of 39–47 pF at 2.5 V and 1 MHz, it introduces negligible signal distortion on differential D+/D− pairs. Its fast clamping response (<1 ns) and low dynamic impedance ensure eye diagram compliance at 480 Mbps, and its ±25 kV IEC 61000−4−2 rating covers worst-case plug/unplug ESD events. The PACDN1404CG has been validated in reference designs for micro-USB receptacle protection.
What is the recommended PCB pad size for the PACDN1404CG WLCSP6 package?
The recommended PCB pad size for the PACDN1404CG is 0.240 mm diameter round, non-solder-mask-defined (NSMD) pads. Solder mask opening should be 0.290 mm round, and stencil aperture 0.300 mm round with 5% tapered walls. These dimensions are specified in the onsemi application note for case 567BD and ensure optimal solder joint formation, coplanarity accommodation, and void minimization during Pb-free reflow (peak 260 °C). Deviation may compromise mechanical reliability.
PACDN1404CG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 6-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Min)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 8V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WLCSP (1.8x1.15)
PACDN1404CG FAQ
1.How can I place an order for PACDN1404CG through Aetrix?
Please submit a Request for Quotation (RFQ) for PACDN1404CG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PACDN1404CG reliable?
The price and inventory of PACDN1404CG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PACDN1404CG is usually 5 days.
3.What payment methods are accepted for PACDN1404CG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PACDN1404CG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PACDN1404CG?
PACDN1404CG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PACDN1404CG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PACDN1404CG?
For technical support, including PACDN1404CG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PACDN1404CG requirements.
6.How does Aetrix verify that PACDN1404CG is sourced from the original manufacturer or authorized distributors?
All PACDN1404CG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PACDN1404CG meets industry standards.
7.What is the process for return or replacement of PACDN1404CG?
All PACDN1404CG units undergo pre-shipment inspection (PSI). If there is an issue with PACDN1404CG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PACDN1404CG part is unused and in its original packaging.
Return procedure for PACDN1404CG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PACDN1404CG Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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