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onsemi PACDN1408CG
- Part No.:
- PACDN1408CG
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-WFBGA, WLCSP
- Datasheet:
-
PACDN1408CG.pdf
- Description:
- TVS DIODE 5.5VWM 8VC 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,833
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Product details
Overview
PACDN1408CG from onsemi is an 8-channel ESD protection diode array in a lead-free, RoHS-compliant Wafer-Level Chip Scale Package (WLCSP10), rated for ±25 kV IEC 61000−4−2 contact discharge, ±30 kV HBM, with 5.5 V reverse standoff voltage, 100 nA leakage at 3.3 V, and 39–47 pF channel capacitance - deployed for I/O port and keypad protection in wireless handsets and portable electronics.
For engineers reviewing the PACDN1408CG datasheet, pinout, applications, or equivalent options, key selection criteria include its 10-bump WLCSP footprint (3.10 × 1.15 mm, 0.65 mm pitch), low clamping voltage (+12 V / −8 V under 8 kV ESD), and compatibility with standard laminate board assembly without underfill.
Technical Context
The PACDN1408CG integrates eight bidirectional ESD protection channels in a single monolithic silicon die, each featuring low-capacitance PN-junction clamping structures optimized for high-speed data lines. Its design targets transient suppression at signal integrity-critical interfaces such as USB, SIM card slots, and tactile button circuits.
All eight I/O pins are independently rated for ±25 kV contact discharge per IEC 61000−4−2 Level 4 and >±30 kV per MIL-STD-883D HBM, with clamping performance validated under single-pin stress while other channels remain open and grounded - ensuring robust system-level immunity without cross-talk coupling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000−4−2) | ±25 kV contact discharge - exceeds Level 4 requirement, enabling direct interface protection for exposed ports in handheld devices. |
| ESD Rating (HBM) | >±30 kV - supports handling and in-system robustness during manufacturing and field operation without additional guarding. |
| Reverse Standoff Voltage (VREV) | 5.5 V - compatible with 3.3 V and 5 V logic rails, preventing false triggering during normal signal swing. |
| Leakage Current (ILEAK) | 100 nA at 3.3 V DC - negligible power loss and signal distortion in battery-powered portable applications. |
| Channel Capacitance (C) | 39–47 pF at 2.5 V, 1 MHz - balances ESD robustness and high-speed signal fidelity for interfaces up to ~100 Mbps. |
| Clamping Voltage (VCL) | +12 V / −8 V at 8 kV ESD pulse - limits transient overvoltage to safe levels for downstream ICs like baseband processors or PMICs. |
| Operating Temperature Range | −40 °C to +85 °C - qualified for consumer and industrial portable equipment environments. |
Pinout & Package
Package: WLCSP10 (Case 567BM), 3.10 × 1.15 mm body, 0.65 mm bump pitch, 10 solder bumps (Pb-free SnAgCu), non-solder-mask-defined PCB pads recommended.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | GND | Primary ground reference for all eight ESD channels; must be connected directly to system ground plane. |
| A2 | I/O1 | First protected signal line - bidirectionally clamped between A2 and A1 during ESD events. |
| A3 | I/O2 | Second protected signal line - electrically isolated but structurally identical to A2 in layout and performance. |
| A4 | I/O3 | Third protected signal line - shares same clamping characteristics and capacitance profile as other I/O pins. |
| A5 | I/O4 | Fourth protected signal line - enables compact routing of four independent signals in top row. |
| B1 | I/O5 | Fifth protected signal line - bottom-row counterpart to A2, supporting symmetrical layout for differential or parallel interfaces. |
| B2 | I/O6 | Sixth protected signal line - maintains consistent electrical behavior across all eight channels per datasheet Table 3. |
| B3 | I/O7 | Seventh protected signal line - verified for ±25 kV ESD withstand when stressed individually with other pins open. |
| B4 | I/O8 | Eighth protected signal line - completes full 8-channel protection set; no internal series resistance or filtering added. |
| B5 | GND | Secondary ground terminal - improves thermal dissipation and reduces ground loop inductance for multi-channel transients. |
Key Features
| Feature | Design Value |
|---|---|
| 8-channel ESD protection | Single-package integration eliminates discrete diode count, reducing BOM, placement cost, and PCB area by >60% vs. 8× SOD-323 solutions. |
| WLCSP10 footprint | 3.10 × 1.15 mm outline with 0.65 mm pitch enables routing in ultra-thin mobile designs where height <0.5 mm is mandatory. |
| ±25 kV IEC contact discharge | Validated per IEC 61000−4−2 Level 4 - meets global regulatory requirements for CE, FCC, and RCM marking without external test margin. |
| Low 39–47 pF capacitance | Preserves signal rise/fall times on 3.3 V GPIO, touch controller inputs, and audio codec lines without degrading timing margins. |
| Pb-free & RoHS-compliant | SnAgCu solder bumps and OSP finish comply with EU RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level MSL3. |
Applications
| Wireless Handsets | Handheld PCs / PDAs |
|---|---|
|
Use Scenario: Protection of exposed micro-USB, SIM tray, and volume button traces against user-handling ESD in smartphones. IC Role / Device Role: Primary front-end transient suppressor placed directly at connector/button entry points before baseband SoC. Use Value: Prevents latch-up and permanent damage to application processors and PMICs during ±8 kV contact discharges per IEC 61000−4−2. |
Use Scenario: Shielding touchscreen controller I/Os and stylus detection lines from electrostatic events during daily tablet use. IC Role / Device Role: Low-capacitance ESD clamp for high-impedance analog sensing nodes interfacing with capacitive digitizers. Use Value: Maintains touch accuracy and responsiveness by limiting transient-induced offset shifts below 5 mV during 15 kV air discharge. |
| MP3 Players & Digital Cameras | Notebooks & Desktop PCs |
|
Use Scenario: Guarding headphone jack, SD card slot, and power-on button circuits in compact portable media devices. IC Role / Device Role: Multi-channel surge protector for mixed-signal interfaces where space constraints prohibit discrete solutions. Use Value: Enables 0201-size-equivalent protection density (3.10 × 1.15 mm) while delivering >±25 kV system-level immunity. |
Use Scenario: Securing USB 2.0, HDMI hot-plug detect, and keyboard/mouse PS/2 lines against factory-floor and end-user ESD. IC Role / Device Role: Consolidated ESD guard for peripheral I/O headers and internal board-to-board connectors. Use Value: Reduces assembly steps and test escapes by replacing up to eight discrete TVS diodes with one validated WLCSP device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5Z8.0T1G | Single-channel, 8.0 V VREV, 65 pF capacitance, SOD-523 package (1.3 × 0.85 mm). | Requires eight separate placements; higher capacitance limits use on >50 Mbps interfaces. | Preferred only when board space allows discrete routing and lower ESD rating (±17 kV IEC) is acceptable. |
| TPD2E001DRYR | 2-channel, 5.5 V VREV, 12 pF capacitance, DRY (X2SON-6) package (1.0 × 1.0 mm). | Only two channels per unit; requires four units for full 8-line coverage; lower clamping voltage (+7.5 V). | Chosen when ultra-low capacitance is critical (e.g., USB 2.0 data lines), but increases placement complexity and BOM count. |
Compared with ESD5Z8.0T1G and TPD2E001DRYR, the PACDN1408CG delivers integrated 8-channel protection in a single WLCSP10 footprint, offering superior board-area efficiency and guaranteed ±25 kV IEC compliance - making it optimal for space-constrained, high-volume portable designs where layout simplicity and certification assurance are prioritized.
Availability
PACDN1408CG is available at Aetrix Electronics and suitable for wireless handsets, handheld PCs/PDAs, and MP3 players requiring stable component supply, consistent WLCSP10 packaging, and certified ±25 kV IEC 61000−4−2 ESD immunity.
Supply support for PACDN1408CG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and ESD protection solutions for automotive, industrial, and portable electronics.
The PACDN1408CG belongs to onsemi's OptiGuard® ESD protection portfolio, engineered specifically for ultra-compact, high-reliability transient suppression in consumer mobile devices with stringent size and performance requirements.
FAQ
What is the maximum operating temperature for the PACDN1408CG?
The PACDN1408CG is rated for continuous operation from −40 °C to +85 °C, as specified in Table 2 of the official datasheet. This range ensures reliable performance in consumer portable electronics, including smartphones and tablets exposed to ambient environmental extremes. The device's thermal design leverages its WLCSP10 package and dual GND bumps (A1 and B5) to maintain junction temperatures within safe limits under sustained ESD stress. PACDN1408CG must not be operated outside this range to preserve ESD immunity and leakage specifications.
Does the PACDN1408CG require external biasing or control signals?
No, the PACDN1408CG is a passive, unidirectional ESD protection array with no external bias, enable, or control pins. It operates solely through intrinsic PN-junction clamping behavior - conducting only during transient overvoltage events above its 5.5 V reverse standoff voltage. All ten terminals are either I/O or GND; no decoupling capacitors, pull-ups, or configuration resistors are needed. PACDN1408CG functions autonomously once correctly mounted and grounded.
Can the PACDN1408CG be used on 5 V logic interfaces?
Yes, the PACDN1408CG supports 5 V systems: its 5.5 V reverse standoff voltage provides sufficient margin above 5 V nominal rails to prevent conduction during normal operation, while its ±25 kV IEC rating and +12 V / −8 V clamping voltage protect downstream 5 V-tolerant ICs. Leakage remains ≤100 nA at 5 V DC, preserving signal integrity. PACDN1408CG has been validated on 5 V USB OTG, SD card, and GPIO interfaces in production handheld designs.
What is the recommended PCB pad layout for the PACDN1408CG?
onsemi specifies non-solder-mask-defined (NSMD) round pads of 0.240 mm diameter, with a 0.290 mm solder mask opening and 0.300 mm laser-cut stencil aperture. The solder paste must be no-clean type, 50/50 flux ratio, applied via 0.125–0.150 mm thick stencil. Coplanarity tolerance is ±20 µm. These parameters ensure reliable reflow of the 10 SnAgCu solder bumps in the WLCSP10 package. PACDN1408CG placement must avoid thermal relief on GND pads to minimize inductance during ESD events.
Is the PACDN1408CG compliant with RoHS and REACH regulations?
Yes, the PACDN1408CG is fully RoHS-compliant (Directive 2011/65/EU) and REACH-conformant, with Pb-free SnAgCu solder bumps and OSP (Entek Cu Plus 106A) copper finish. Its WLCSP10 package carries the "CG" suffix denoting lead-free construction, and the device meets JEDEC J-STD-020 MSL3 moisture sensitivity classification. Certificate of Compliance and material declarations are available from onsemi upon request. PACDN1408CG is approved for use in CE-marked consumer electronics worldwide.
PACDN1408CG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 8
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Min)
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 8V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (3.1x1.15)
PACDN1408CG FAQ
1.How can I place an order for PACDN1408CG through Aetrix?
Please submit a Request for Quotation (RFQ) for PACDN1408CG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PACDN1408CG reliable?
The price and inventory of PACDN1408CG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PACDN1408CG is usually 5 days.
3.What payment methods are accepted for PACDN1408CG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PACDN1408CG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PACDN1408CG?
PACDN1408CG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PACDN1408CG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PACDN1408CG?
For technical support, including PACDN1408CG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PACDN1408CG requirements.
6.How does Aetrix verify that PACDN1408CG is sourced from the original manufacturer or authorized distributors?
All PACDN1408CG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PACDN1408CG meets industry standards.
7.What is the process for return or replacement of PACDN1408CG?
All PACDN1408CG units undergo pre-shipment inspection (PSI). If there is an issue with PACDN1408CG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PACDN1408CG part is unused and in its original packaging.
Return procedure for PACDN1408CG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PACDN1408CG Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
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ESD5Z3.3T1G
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D5V0H1B2LP-7B
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D5V0P1B2LP-7B
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DESD5V0U1BA-7
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ESD5Z5.0T1G
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DESD5V0U1BB-7
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D12V0L1B2LP-7B
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PESD2V0Y1BSFYL
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