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Nexperia USA Inc. PESD1USB30Z
- Part No.:
- PESD1USB30Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 5-UFBGA, WLCSP
- Datasheet:
-
PESD1USB30Z.pdf
- Description:
- TVS DIODE 5.5VWM 5WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,893
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Product details
Overview
PESD1USB30 from Nexperia is a single-channel ESD protection diode array designed for high-speed differential data lines including USB 3.1 SuperSpeed, HDMI 2.0, and MIPI D-PHY interfaces. It delivers ±15 kV IEC 61000-4-2 contact discharge protection, features 0.45 pF typical diode capacitance at 1 MHz, 6–9 V breakdown voltage (IR = 1 mA), and 17 GHz f−3dB cut-off frequency - enabling minimal signal integrity impact in compact mobile and portable electronics.
For engineers reviewing the PESD1USB30 datasheet, PESD1USB30 pinout, PESD1USB30 application, or PESD1USB30 equivalent, this device supports critical high-bandwidth interface protection where low capacitance, ultra-small footprint, and system-level ESD robustness are mandatory design requirements.
Technical Context
The PESD1USB30 employs a TREOS clamping structure with snap-back behavior to achieve low dynamic resistance (0.16 Ω positive/negative TLP) and reduced clamping voltage during ESD transients. Its bidirectional ESD protection architecture operates across both polarities without DC bias dependency.
It is optimized for differential mode operation with matched channel paths, supports impedance-controlled routing via WLCSP5 package geometry, and maintains signal fidelity up to 10 Gbps as verified in USB3.1 and HDMI 2.0 eye diagram testing - all while occupying only 0.82 mm × 1.22 mm PCB area.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge per line (IEC 61000-4-2 Level 4); ensures survivability against real-world human-body model discharges. |
| Diode Capacitance | 0.45 pF at 1 MHz, 2.5 V; preserves signal integrity on 5–10 Gbps differential links with negligible insertion loss. |
| Breakdown Voltage | 6–9 V at IR = 1 mA; safely clamps transients above logic rail while avoiding false triggering during normal operation. |
| f−3dB Cut-off | 17 GHz; enables full support of USB3.1 Gen2 (10 Gbps), HDMI 2.0 (6 Gbps), and DisplayPort 1.4 signals without bandwidth limitation. |
| Dynamic Resistance | 0.16 Ω (TLP, 100 ns); minimizes clamping voltage overshoot during fast ESD pulses, protecting downstream SoCs. |
| Package | WLCSP5 (2-1-2 bump layout, 0.82 × 1.22 mm); matches PCMFxUSB30 footprint for drop-in replacement in space-constrained layouts. |
| Leakage Current | 1–100 nA at VI = 5 V; prevents signal degradation or power drain on high-impedance differential receivers. |
Pinout & Package
WLCSP5 package: wafer-level chip-scale package with 5 solder bumps in 2-1-2 configuration (0.82 mm × 1.22 mm, 0.4 mm pitch). Dimensions comply with JEDEC MO-254 standard. Requires 0.1 mm stencil thickness for reliable reflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input + line; connects directly to connector-side USB3.1/HDMI TX/RX pair. |
| A2 | CH1_IN− | External differential input − line; forms matched pair with A1 for balanced ESD current injection. |
| B1 | GND_CH1 | Channel-specific ground reference; decouples ESD return path from system ground plane to reduce coupling noise. |
| C1 | CH1_OUT+ | Internal differential output + line; routes protected signal to SoC or PHY IC with minimal trace length. |
| C2 | CH1_OUT− | Internal differential output − line; maintains differential symmetry and common-mode rejection post-protection. |
Key Features
| Feature | Design Value |
|---|---|
| TREOS clamping process | Enables snap-back behavior for sub-10 V clamping voltage under ±15 kV ESD stress, enhancing SoC-level robustness. |
| 0.45 pF channel capacitance | Minimizes signal distortion on 10 Gbps links - validated by clean USB3.1 and HDMI 2.0 eye diagrams with/without device. |
| Footprint compatibility | Shares identical WLCSP5 land pattern with PCMF1USB30 common-mode filters, enabling flexible BOM reuse and layout flexibility. |
| 17 GHz differential bandwidth | Supports full-rate operation of USB3.1 Gen2, HDMI 2.0, and MIPI D-PHY CSI/DSI without equalization or compensation. |
| WLCSP5 mechanical form factor | 0.82 × 1.22 mm outline with 0.4 mm bump pitch enables placement directly at Type-C or micro-B connectors with zero added trace length. |
Applications
| USB 3.1 SuperSpeed Interface | HDMI 2.0 Video Link |
|---|---|
Use Scenario: Protecting USB Type-C receptacle differential pairs (TX1+/−, RX1+/−) in smartphones and ultrabooks. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed between connector and USB 3.1 PHY, preserving differential impedance and timing skew. Use Value: Prevents permanent damage to USB controller during hot-plug events while maintaining <1% eye closure at 10 Gbps. |
Use Scenario: Shielding HDMI 2.0 source-side TMDS channels on tablet or docking station PCBs. IC Role / Device Role / Timing Role: High-fidelity ESD shunt on each TMDS differential pair, positioned immediately after connector to minimize stub length. Use Value: Sustains >95% signal amplitude at 6 GHz and eliminates jitter-induced pixel errors in 4K@60Hz displays. |
| MIPI D-PHY Camera Interface | Display Serial Interface (DSI) |
Use Scenario: Securing CSI-2 differential lanes between image sensor and application processor in mobile camera modules. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor on high-speed clock and data lanes, co-located with sensor flex connector. Use Value: Maintains <5 ps inter-pair skew and prevents frame corruption during electrostatic handling in assembly environments. |
Use Scenario: ESD hardening of DSI lanes driving OLED panels in foldable phones and AR glasses. IC Role / Device Role / Timing Role: Differential ESD guard on LP/HS mode-switched lanes, placed adjacent to display connector to avoid impedance discontinuity. Use Value: Enables reliable 2.5 Gbps burst-mode transmission with no visible screen artifacts after repeated ±15 kV contact discharge. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential-line ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PCMF1USB30 | Integrated common-mode filter + ESD protection; higher insertion loss (−1.2 dB @ 5 GHz) vs. PESD1USB30's −0.3 dB. | Used when common-mode noise suppression is required alongside ESD protection; not suitable for pure ESD-only layouts. | Select when board space allows dual-function filtering and ESD, but avoid if minimizing signal attenuation is primary. |
| TPD2EUSB30 | 0.5 pF capacitance, ±12 kV ESD rating, 12-pin UQFN; larger footprint (1.6 × 1.6 mm) and lower bandwidth (12 GHz f−3dB). | Targeted at industrial USB hubs and docking stations where thermal margin and package robustness outweigh size constraints. | Choose for legacy designs using UQFN reflow processes or where ±12 kV suffices and 17 GHz bandwidth is not required. |
Compared with PCMF1USB30 and TPD2EUSB30, the PESD1USB30 offers the smallest footprint, highest bandwidth, and strongest ESD rating - making it optimal for next-generation mobile devices where PCB area, signal fidelity, and system-level reliability are tightly coupled.
Availability
PESD1USB30 is available at Aetrix Electronics and suitable for smartphone, tablet PC, and USB3.1 peripheral designs requiring stable component supply, consistent wafer-lot traceability, and long-term lifecycle continuity.
Supply support for PESD1USB30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, energy-efficient components for automotive, industrial, and consumer electronics.
The PESDxUSB30 series belongs to Nexperia's ESD protection portfolio, engineered specifically for high-speed differential interfaces where ultra-low capacitance and system-level robustness are non-negotiable.
FAQ
What is the maximum recommended trace length between PESD1USB30 and the protected connector?
Trace length must be ≤1.5 mm from connector pads to PESD1USB30 A1/A2 pins to maintain controlled 90 Ω differential impedance and prevent stub-induced reflections. Longer traces degrade eye diagram integrity above 5 Gbps and increase ESD coupling risk to adjacent nets.
Can PESD1USB30 be used on USB 2.0 lines?
Yes - its ±15 kV ESD rating and 0.45 pF capacitance are fully compatible with USB 2.0 full-speed (12 Mbps) and high-speed (480 Mbps) differential pairs. However, its 17 GHz bandwidth exceeds USB 2.0 needs, so cost-sensitive designs may prefer lower-spec alternatives.
Does PESD1USB30 require external bias or control signals?
No - it is a passive, bidirectional ESD protection device with no enable pin, supply voltage, or configuration interface. It operates automatically across ±5 V signal swing and requires no PCB routing for bias networks or pull-ups.
How does the TREOS process improve ESD performance over standard diode clamps?
TREOS uses a tailored silicon structure that triggers snap-back at lower voltage, reducing dynamic resistance to 0.16 Ω and clamping voltage to <10 V during ±15 kV transients - significantly lowering stress on sensitive SoC I/O cells compared to conventional 15–20 Ω clamps.
PESD1USB30Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 5-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 8A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-WLCSP (0.77x1.17)
PESD1USB30Z FAQ
1.How can I place an order for PESD1USB30Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD1USB30Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD1USB30Z reliable?
The price and inventory of PESD1USB30Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD1USB30Z is usually 5 days.
3.What payment methods are accepted for PESD1USB30Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD1USB30Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD1USB30Z?
PESD1USB30Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD1USB30Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD1USB30Z?
For technical support, including PESD1USB30Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD1USB30Z requirements.
6.How does Aetrix verify that PESD1USB30Z is sourced from the original manufacturer or authorized distributors?
All PESD1USB30Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD1USB30Z meets industry standards.
7.What is the process for return or replacement of PESD1USB30Z?
All PESD1USB30Z units undergo pre-shipment inspection (PSI). If there is an issue with PESD1USB30Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD1USB30Z part is unused and in its original packaging.
Return procedure for PESD1USB30Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD1USB30Z Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
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Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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Diodes Incorporated
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onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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Diodes Incorporated
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