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Nexperia USA Inc. PESD1USB3B/CZ
- Part No.:
- PESD1USB3B/CZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 5-UFBGA, WLCSP
- Datasheet:
-
PESD1USB3B/CZ.pdf
- Description:
- TVS DIODE 4VWM 5WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,068
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Product details
Overview
PESD1USB3B/C from Nexperia is a single-channel bidirectional ESD protection diode array for high-speed differential data lines, featuring ±20 kV IEC 61000-4-2 contact discharge rating, 0.29 pF typical diode capacitance at 1 MHz, 6 V minimum breakdown voltage, and WLCSP5 (2-1-2) package. It protects USB 3.2 SuperSpeed TX/RX pairs directly at Type-C connectors while preserving signal integrity up to 16.1 GHz f-3dB.
For engineers reviewing the PESD1USB3B/C datasheet, PESD1USB3B/C pinout, PESD1USB3B/C application, or PESD1USB3B/C equivalent, key selection criteria include differential-mode insertion loss < −1 dB at 5 Gbps, dynamic resistance ≤ 0.2 Ω under TLP stress, GND-isolated channel architecture, and footprint compatibility with PCMF1USB3B/C common-mode filters.
Technical Context
The device implements a TrEOS clamping structure enabling snap-back behavior that reduces clamping voltage during ESD transients, with positive/negative dynamic resistance ≤ 0.2 Ω per line under 100 ns TLP testing. Its low-capacitance design ensures minimal signal distortion on differential pairs operating up to 10 Gbps.
It supports bidirectional protection without polarity constraints and requires no external biasing-each channel uses independent GND_CH1 reference with isolated input/output terminals (CH1_IN±/CH1_OUT±), enabling direct placement at high-speed connector interfaces while maintaining impedance continuity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±20 kV contact discharge per line (IEC 61000-4-2 Level 4); enables robust system-level immunity in handheld USB/HDMI ports |
| Diode Capacitance | 0.29 pF typical at 1 MHz/2.5 V; preserves 10 Gbps eye opening and minimizes jitter on SuperSpeed links |
| Breakdown Voltage | 6 V min at 1 mA; ensures safe operation above 5 V signaling rails while triggering before SoC damage thresholds |
| Dynamic Resistance | ≤ 0.2 Ω under ±100 ns TLP pulse; delivers low clamping voltage (< 8 V) during fast ESD events |
| f-3dB Bandwidth | 16.1 GHz typical; supports full USB 3.2 Gen 2 (10 Gbps) and HDMI 2.0 (6 Gbps) differential signaling |
| Leakage Current | 1 nA typical at 5 V reverse bias; prevents DC loading of high-impedance receiver inputs |
| Package | WLCSP5 (2-1-2), 0.42 × 0.64 mm, 0.4 mm pitch; enables ultra-compact placement adjacent to USB Type-C receptacles |
Pinout & Package
Package: Wafer-Level Chip-Scale Package (WLCSP5) with 5 solder bumps in 2-1-2 configuration, dimensions 0.42 mm × 0.64 mm, 0.4 mm bump pitch, compatible with standard SMT reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External-side positive terminal of differential pair; connects to USB3.2 TX+ or RX+ trace from connector |
| A2 | CH1_IN- | External-side negative terminal; routes to corresponding TX−/RX− line with matched length and impedance |
| B1 | GND_CH1 | Dedicated channel ground; must be connected to local ground plane near connector, not shared with other channels |
| C1 | CH1_OUT+ | Internal-side positive terminal; connects to SoC-side TX+/RX+ trace with minimal stub length |
| C2 | CH1_OUT- | Internal-side negative terminal; completes protected differential path to host/controller IC |
Key Features
| Feature | Design Value |
|---|---|
| TrEOS clamping architecture | Enables snap-back behavior reducing clamping voltage by >30% vs conventional TVS, protecting sensitive USB 3.2 PHYs |
| Footprint compatibility | Matches PCMF1USB3B/C filter layout-allows design reuse between ESD-only and combined ESD+CMF solutions |
| Ultra-low capacitance | 0.29 pF max per line eliminates need for post-layout tuning of differential impedance on 85–100 Ω traces |
| Independent channel grounding | GND_CH1 isolation prevents noise coupling between protected lanes and avoids ground bounce in multi-channel systems |
| High-speed bandwidth | 16.1 GHz f-3dB ensures < 0.1 UI jitter penalty at 10 Gbps, validated via USB 3.2 eye diagrams with/without device |
Applications
| USB 3.2 Gen 2 Interface | HDMI 2.0 Port Protection |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs in USB Type-C receptacles on ultrabooks and docking stations. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed immediately after connector, before any series impedance or routing stubs. Use Value: Maintains 10 Gbps signal fidelity (eye height > 0.8 UI) while suppressing ±20 kV contact discharges-verified in test boards with/without device. | Use Scenario: Shielding TMDS clock and data lanes on HDMI 2.0 source ports in set-top boxes and AV receivers. IC Role / Device Role / Timing Role: Differential-line protector on all three TMDS channels, with separate GND connections per channel to avoid crosstalk. Use Value: Enables 6 Gbps 1080p60 transmission with < 0.2 dB insertion loss at 3 GHz-confirmed via HDMI 2.0 eye diagrams at TP1/TP2 test points. |
| MIPI D-PHY CSI-2 Camera Link | Mobile Display Serial Interface |
Use Scenario: Securing high-speed camera sensor interface (CSI-2) on smartphone mainboards against ESD during assembly and end-user handling. IC Role / Device Role / Timing Role: Per-lane ESD guard on differential clock and data lanes between image sensor and application processor. Use Value: 0.29 pF capacitance prevents timing skew across D-PHY lanes, supporting 2.5 Gbps per lane without violating MIPI jitter specs. | Use Scenario: Protecting Display Serial Interface (DSI) lanes between AP and OLED display panel in foldable tablets. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on each DSI data pair, placed within 3 mm of display flex connector. Use Value: Preserves DSI HS-mode signal rise/fall times (< 150 ps) and maintains 1.5 Gbps link stability-validated with 1000+ ESD strikes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential-line ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PCMF1USB3B/C | Integrates common-mode filter + ESD protection in same WLCSP5 footprint; higher insertion loss (−1.8 dB @ 5 GHz) | Required where EMI filtering is mandated alongside ESD protection (e.g., FCC/CE radiated emissions compliance) | Select when board space prohibits discrete filter + ESD solution and CM noise suppression is critical |
| ESD5V3U2U | 0.5 pF capacitance; ±15 kV ESD rating; SOT323 package (1.7 × 1.25 mm) | Suitable for lower-speed interfaces (USB 2.0, LVDS) where 10 Gbps bandwidth is unnecessary | Choose for cost-sensitive designs with relaxed speed requirements and larger PCB real estate |
Compared with PCMF1USB3B/C, PESD1USB3B/C offers superior high-frequency transparency but no common-mode rejection; versus ESD5V3U2U, it delivers 3× lower capacitance and 33% higher ESD rating in 60% smaller area-making it optimal for next-gen USB/HDMI physical layer protection.
Availability
PESD1USB3B/C is available at Aetrix Electronics and suitable for USB 3.2 Gen 2 interface protection, HDMI 2.0 port hardening, and MIPI D-PHY camera/display links requiring stable component supply across high-volume consumer electronics production.
Supply support for PESD1USB3B/C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a leading semiconductor manufacturer specializing in high-performance, energy-efficient logic, analog, and ESD protection devices, headquartered in Nijmegen, Netherlands.
The PESDxUSB3B/C series belongs to Nexperia's TrEOS ESD protection product line, engineered specifically for preserving signal integrity on ultra-high-speed differential interfaces including USB 3.x, HDMI, and MIPI while delivering industry-leading ±20 kV system-level ESD robustness.
FAQ
What is the maximum recommended trace length between PESD1USB3B/C and the USB Type-C connector?
The device must be placed within 3 mm of the connector's differential pins to minimize unprotected stub length. Longer traces increase inductance, degrading ESD response time and causing reflections above 5 GHz-verified via TDR measurements showing Zdif deviation < ±5 Ω only when mounted per Fig. 18 layout guidelines.
Can PESD1USB3B/C be used on single-ended lines like USB 2.0 D+/D−?
No-it is optimized exclusively for differential signaling. Single-ended use violates its internal symmetry and raises clamping voltage beyond 12 V due to unbalanced current paths. For USB 2.0, Nexperia recommends PESD5V0S1BA or similar single-line ESD arrays with matched capacitance.
Does PESD1USB3B/C require a dedicated ground plane or can it share the main system GND?
GND_CH1 must connect to a localized, low-inductance ground pour adjacent to the protected differential pair-not the main system ground. Shared grounding introduces noise coupling and elevates clamping voltage by up to 40% during multi-pin ESD events, as confirmed in IEC 61000-4-2 system-level tests.
How does the TrEOS snap-back mechanism affect DC biasing of protected lines?
The snap-back behavior only activates during transient overvoltage (>6 V). Under normal 0–5 V signaling, leakage remains ≤1 nA. However, sustained DC >6 V will latch the device in low-resistance state-so avoid connecting battery rails or unregulated supplies directly to CH1_IN± terminals.
PESD1USB3B/CZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 5-UFBGA, WLCSP
- Series:
- PESDxUSB3B/C
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 4V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 9.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.29pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-WLCSP (0.77x1.17)
PESD1USB3B/CZ FAQ
1.How can I place an order for PESD1USB3B/CZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD1USB3B/CZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD1USB3B/CZ reliable?
The price and inventory of PESD1USB3B/CZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD1USB3B/CZ is usually 5 days.
3.What payment methods are accepted for PESD1USB3B/CZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD1USB3B/CZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD1USB3B/CZ?
PESD1USB3B/CZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD1USB3B/CZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD1USB3B/CZ?
For technical support, including PESD1USB3B/CZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD1USB3B/CZ requirements.
6.How does Aetrix verify that PESD1USB3B/CZ is sourced from the original manufacturer or authorized distributors?
All PESD1USB3B/CZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD1USB3B/CZ meets industry standards.
7.What is the process for return or replacement of PESD1USB3B/CZ?
All PESD1USB3B/CZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD1USB3B/CZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD1USB3B/CZ part is unused and in its original packaging.
Return procedure for PESD1USB3B/CZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD1USB3B/CZ Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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