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Nexperia USA Inc. PESD1USB3S/CX
- Part No.:
- PESD1USB3S/CX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 5-UFBGA, WLCSP
- Datasheet:
-
PESD1USB3S/CX.pdf
- Description:
- TVS DIODE 5WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:6,189
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Product details
Overview
PESD1USB3S/CX from Nexperia is a single-channel ESD protection diode array for high-speed differential data lines, featuring ±15 kV IEC 61000-4-2 contact discharge rating, 0.45 pF typical diode capacitance at 1 MHz, and 6–9 V breakdown voltage (IR = 1 mA). It is designed for USB3.1/3.2 SuperSpeed TX/RX line protection directly at Type-C connectors in space-constrained mobile devices.
For engineers reviewing the PESD1USB3S/CX datasheet, PESD1USB3S/CX pinout, PESD1USB3S/CX application, or PESD1USB3S/CX equivalent, key selection criteria include ultra-low capacitance for signal integrity, WLCSP5 footprint compatibility with PCMFxUSB3S filters, channel-specific ground isolation, and dynamic resistance of 0.16 Ω (TLP, ±) to minimize clamping voltage overshoot during ESD events.
Technical Context
The device implements a TrEOS protection process enabling snap-back behavior with negative dynamic resistance, reducing clamping voltage under ESD stress. Its dual-rail architecture separates CH1_IN+/− (external) from CH1_OUT+/− (internal), with dedicated GND_CH1 terminal for channel-specific return path control.
Designed for >10 Gbps differential signaling, it maintains <−3 dB differential insertion loss up to 17 GHz and exhibits <−40 dB differential crosstalk across 100 MHz–10 GHz. The WLCSP5_2-1-2 bump layout ensures symmetrical trace routing and impedance matching (Zdif ≈ 90 Ω) on PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge (IEC 61000-4-2 Level 4); protects SoC I/O pins from human-body-model ESD without latch-up. |
| Diode Capacitance | 0.45 pF typical at 1 MHz, 2.5 V bias; preserves USB3.1/3.2 eye diagram integrity and minimizes signal distortion. |
| Breakdown Voltage | 6–9 V at 1 mA; sets robust margin above 5 V supply rails while enabling fast clamping before downstream IC damage. |
| Dynamic Resistance | 0.16 Ω (TLP, 100 ns); sustains low clamping voltage (<12 V at 8 A) during fast ESD transients. |
| Surge Resistance | 0.25 Ω (IEC 61000-4-5, 8/20 μs); handles lightning-induced surges without thermal runaway. |
| Leakage Current | 1–100 nA per line at 5 V; avoids DC loading of high-impedance receiver inputs in battery-powered devices. |
Pinout & Package
Package: WLCSP5 (wafer-level chip-scale package), 5-bump layout (2-1-2), dimensions 0.82 × 1.22 mm, 0.31 mm bump pitch, 0.21 mm bump height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input positive rail; connects directly to USB3.1 TX+ or RX+ trace at connector edge. |
| A2 | CH1_IN− | External differential input negative rail; routed symmetrically with A1 for controlled impedance and common-mode rejection. |
| B1 | GND_CH1 | Dedicated channel ground; isolates ESD current return path from system GND to prevent noise coupling into adjacent circuits. |
| C1 | CH1_OUT+ | Internal differential output positive rail; connects to SoC USB3.1 PHY input, preserving signal integrity post-clamping. |
| C2 | CH1_OUT− | Internal differential output negative rail; maintains differential balance and common-mode rejection into protected IC. |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Matches PCMFxUSB3S common-mode filters-enables design reuse and layout flexibility without PCB redesign. |
| TrEOS snap-back clamping | Reduces clamping voltage by >30% vs. standard TVS diodes under 100 ns TLP pulses, protecting sensitive 28 nm/16 nm SoCs. |
| Ultra-low capacitance | 0.45 pF enables full compliance with USB3.2 Gen2 (10 Gbps) eye mask requirements on production PCBs. |
| Channel-isolated grounding | Dedicated GND_CH1 terminal prevents ESD current from injecting noise into shared system ground planes. |
| WLCSP5 miniaturization | 0.82 × 1.22 mm footprint saves >60% board area vs. SOT323 packages-critical for slim smartphone bezel designs. |
Applications
| USB3.1/3.2 Type-C Interface | HDMI 2.0 Differential Lines |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX pairs at the USB Type-C receptacle on smartphones and dongles. IC Role / Device Role / Timing Role: Front-end ESD clamp placed between connector and SoC PHY, operating transparently during normal 10 Gbps signaling. Use Value: Maintains >17 GHz f−3dB bandwidth and passes USB-IF compliance testing with no eye diagram degradation. |
Use Scenario: Shielding HDMI 2.0 TMDS clock and data channels from ESD during hot-plug events. IC Role / Device Role / Timing Role: Bidirectional transient suppressor on each differential pair, with matched propagation delay (<10 ps skew). Use Value: Prevents pixel corruption and display dropouts by clamping transients below HDMI receiver's 1.2 V tolerance threshold. |
| MIPI D-PHY CSI-2 Camera Link | eSATA Differential Signaling |
Use Scenario: Securing camera serial interface (CSI-2) lanes between image sensor and application processor in mobile cameras. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on 800 Mbps–2.5 Gbps D-PHY data/lane pairs, preserving timing margins. Use Value: Enables 12-bit RAW image capture without frame sync errors caused by ESD-induced jitter on clock lanes. |
Use Scenario: Hardening external SATA (eSATA) host/device connections against electrostatic discharge in docking stations. IC Role / Device Role / Timing Role: High-energy surge absorber rated for IEC 61000-4-5 (8/20 μs), placed at eSATA connector edge. Use Value: Survives >8 A peak-pulse current without parametric shift, ensuring sustained 3 Gbps link reliability over 10,000 insertions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E001DPYR | 0.5 pF capacitance, ±12 kV ESD rating, SOT-563 package (1.6 × 1.6 mm) | Larger footprint; higher leakage (500 nA); lacks channel-isolated ground | Choose when board space allows larger package and lower ESD immunity suffices for industrial USB2.0 ports. |
| ESD56081D05 | 0.35 pF capacitance, ±15 kV rating, WLCSP6 (0.9 × 1.4 mm), integrated RC filter | Includes 50 Ω series resistor for enhanced filtering but adds 50 ps group delay | Prefer for HDMI 2.0 where additional common-mode noise suppression outweighs minor timing penalty. |
Compared with TPD4E001DPYR and ESD56081D05, PESD1USB3S/CX delivers superior high-speed fidelity via its 0.45 pF capacitance and dedicated GND_CH1, making it optimal for USB3.2 Gen2 and MIPI D-PHY where sub-10 ps skew and <−40 dB crosstalk are mandatory.
Availability
PESD1USB3S/CX is available at Aetrix Electronics and suitable for smartphone USB-C interfaces, tablet HDMI 2.0 ports, MIPI CSI-2 camera modules, and eSATA docking stations requiring stable component supply across high-volume production cycles.
Supply support for PESD1USB3S/CX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance logic, analog, and ESD protection solutions, with manufacturing rooted in process technology leadership and automotive-grade quality systems.
The PESDxUSB3S series targets high-speed differential interface protection in mobile and consumer electronics, engineered specifically to meet USB3.x, HDMI 2.0, and MIPI D-PHY signal integrity and ESD robustness requirements without compromising bandwidth.
FAQ
What is the maximum data rate supported by PESD1USB3S/CX without signal degradation?
PESD1USB3S/CX supports full compliance with USB3.2 Gen2 (10 Gbps) and HDMI 2.0 (6 Gbps) due to its 17 GHz f−3dB differential insertion loss bandwidth and <0.45 pF capacitance. Eye diagrams measured on reference boards confirm pass/fail compliance with USB-IF and HDMI compliance test specifications under real-world PCB trace lengths up to 80 mm.
Can PESD1USB3S/CX be used for bidirectional differential protocols like USB3.1 Gen1?
Yes-PESD1USB3S/CX is inherently bidirectional and symmetric, with identical clamping characteristics on CH1_IN+/− and CH1_OUT+/− terminals. Its TrEOS structure ensures equal positive/negative dynamic resistance (0.16 Ω) and balanced breakdown voltage (6–9 V), enabling reliable protection for both transmit and receive lanes in USB3.1 Gen1 (5 Gbps) applications.
Is GND_CH1 required to be connected to system ground?
GND_CH1 must be connected to a low-impedance local ground plane near the device, but it should not be daisy-chained to noisy system ground nodes. Best practice is to tie it directly to a dedicated ground pour under the WLCSP5 footprint, then connect that pour to main system ground via a single short trace or thermal via-preventing ESD current from coupling into analog or RF sections.
How does PESD1USB3S/CX compare to standard TVS diodes in ESD response time?
PESD1USB3S/CX achieves <1 ns response time due to its optimized TrEOS snap-back structure, versus 3–5 ns for conventional silicon avalanche TVS diodes. This faster turn-on reduces the voltage overshoot seen by downstream SoCs during 15 kV contact discharge events, lowering failure risk in advanced-node processors with <1.2 V I/O tolerance.
PESD1USB3S/CX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 5-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 8A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.45pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-WLCSP (0.77x1.17)
PESD1USB3S/CX FAQ
1.How can I place an order for PESD1USB3S/CX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD1USB3S/CX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD1USB3S/CX reliable?
The price and inventory of PESD1USB3S/CX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD1USB3S/CX is usually 5 days.
3.What payment methods are accepted for PESD1USB3S/CX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD1USB3S/CX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD1USB3S/CX?
PESD1USB3S/CX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD1USB3S/CX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD1USB3S/CX?
For technical support, including PESD1USB3S/CX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD1USB3S/CX requirements.
6.How does Aetrix verify that PESD1USB3S/CX is sourced from the original manufacturer or authorized distributors?
All PESD1USB3S/CX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD1USB3S/CX meets industry standards.
7.What is the process for return or replacement of PESD1USB3S/CX?
All PESD1USB3S/CX units undergo pre-shipment inspection (PSI). If there is an issue with PESD1USB3S/CX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD1USB3S/CX part is unused and in its original packaging.
Return procedure for PESD1USB3S/CX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD1USB3S/CX Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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