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Nexperia USA Inc. PESD1USB3S/CZ
- Part No.:
- PESD1USB3S/CZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 5-UFBGA, WLCSP
- Datasheet:
-
PESD1USB3S/CZ.pdf
- Description:
- TVS DIODE 5VWM 5WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:9,214
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Product details
Overview
PESD1USB3S/CZ from Nexperia is a single-channel ESD protection diode array designed for high-speed differential data lines including USB 3.1 SuperSpeed, HDMI 2.0, and MIPI D-PHY interfaces. It delivers ±15 kV IEC 61000-4-2 contact ESD protection per line, features 0.45 pF typical diode capacitance at 1 MHz, 6 V minimum breakdown voltage, and supports >17 GHz differential f-3dB bandwidth - enabling transparent signal integrity preservation in compact mobile and portable electronics.
For engineers reviewing the PESD1USB3S/CZ datasheet, PESD1USB3S/CZ pinout, PESD1USB3S/CZ application, or PESD1USB3S/CZ equivalent, this device is selected for ultra-low-capacitance, footprint-compatible ESD hardening of differential pairs where impedance matching, minimal insertion loss, and snap-back clamping behavior are critical to maintaining 10 Gbps eye diagrams and TMDS/LVDS signal fidelity.
Technical Context
The PESD1USB3S/CZ employs TrEOS process technology to achieve snap-back clamping with dynamic resistance as low as 0.16 Ω (TLP, 100 ns), reducing clamping voltage during ESD transients and protecting sensitive SoC I/Os. Its bidirectional architecture handles both positive and negative ESD pulses without polarity constraints.
Designed specifically for differential signaling, it maintains matched channel routing via symmetrical WLCSP5_2-1-2 bump layout (CH1_IN+/IN− → CH1_OUT+/OUT−), preserves differential impedance (~85–95 Ω) per TDR measurements, and avoids common-mode distortion by isolating GND_CH1 from internal signal paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge (IEC 61000-4-2 Level 4); protects downstream SoCs from human-body-model ESD events at connector entry points. |
| Diode Capacitance | 0.45 pF typical at 1 MHz / 2.5 V; ensures minimal signal loading on 10 Gbps USB3.1 and HDMI 2.0 differential lanes. |
| Breakdown Voltage | 6 V minimum at 1 mA; safely operates above 5 V supply rails while triggering before damage to 3.3 V or 1.8 V I/Os. |
| Differential Bandwidth | >17 GHz f-3dB; preserves high-frequency spectral content essential for clean 10 Gbps eye opening and jitter control. |
| Dynamic Resistance | 0.16 Ω (TLP, ±100 ns); enables rapid clamping with low residual voltage, limiting stress on protected IC pins during fast ESD transients. |
| Package | WLCSP5_2-1-2 (0.82 × 1.22 mm, 0.4 mm pitch); enables direct placement at USB-C/HDMI connectors with zero PCB trace stubs. |
Pinout & Package
WLCSP5_2-1-2 wafer-level chip-scale package: 5 solder bumps in 2-1-2 configuration, 0.4 mm pitch, 0.82 mm × 1.22 mm body size, 0.38 mm nominal thickness. Compatible with standard SMT reflow profiles and 0.1 mm stencil thickness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External-side positive input of differential pair; connects directly to USB3.1 TX/RX+ or HDMI TMDS+ trace at connector. |
| A2 | CH1_IN− | External-side negative input of differential pair; routed with matched length and impedance to A1 for common-mode rejection. |
| B1 | GND_CH1 | Dedicated channel ground terminal; provides local return path for ESD current, isolated from system GND to avoid noise coupling. |
| C1 | CH1_OUT+ | Internal-side positive output; connects to SoC-side differential trace with minimal stub length to preserve signal integrity. |
| C2 | CH1_OUT− | Internal-side negative output; maintains symmetry with C1 to ensure balanced differential signaling post-protection. |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Matches PCMFxUSB3S common-mode filters - allows design reuse across ESD-only and combined EMI+ESD protection layouts. |
| TrEOS snap-back clamping | Reduces clamping voltage under ESD stress via negative differential resistance, lowering peak voltage seen by SoC I/Os. |
| Ultra-low capacitance | 0.45 pF typical ensures <0.5 dB insertion loss up to 10 GHz, preserving eye height and jitter margin in 10 Gbps links. |
| High-speed differential support | 17 GHz f-3dB, 85–95 Ω differential impedance match, and <1 ps skew between CH1_IN+/IN− enable USB3.1 Gen2 compliance. |
Applications
| USB 3.1 Gen2 Interface Protection | HDMI 2.0 Differential Line Protection |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs in USB Type-C receptacles on smartphones and docking stations. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed immediately at connector, shunting ±15 kV transients before reaching USB controller PHY. Use Value: Maintains 10 Gbps eye diagram integrity (Fig. 4/5) with <0.1 dB loss at 5 GHz, preventing link training failures due to ESD-induced bit errors. |
Use Scenario: Hardening TMDS clock and data channels in portable monitors and VR headsets using HDMI 2.0 sources. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor on each differential TMDS lane, preserving 600 MHz pixel clock timing and reducing jitter-induced color banding. Use Value: Enables clean HDMI 2.0 eye diagrams (Fig. 6/7) with no measurable rise-time degradation or differential skew increase post-ESD event. |
| MIPI D-PHY CSI-2 Camera Interface | eSATA / LVDS High-Speed Links |
Use Scenario: ESD protection for camera module flex cables connecting to smartphone SoCs via MIPI CSI-2 v2.1 (1.5 Gbps/lane). IC Role / Device Role / Timing Role: Single-channel protector on each CSI-2 differential pair (CLK, DATA0–DATA3), placed at board edge near FPC connector. Use Value: Prevents ESD-induced frame drop or sensor reset by clamping transients below 6 V while adding <0.2 ps inter-pair skew. |
Use Scenario: Safeguarding external SATA or industrial LVDS display interfaces exposed to handling ESD in ruggedized tablets and medical displays. IC Role / Device Role / Timing Role: Robust front-end clamp for differential signaling standards requiring >8 kV system-level ESD immunity per IEC 61000-4-2. Use Value: Delivers verified ±15 kV contact protection without degrading 3 Gbps eSATA eye opening or LVDS common-mode rejection ratio (CMRR). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4S012RTER | 4-channel, 0.5 pF typical capacitance, ±12 kV ESD rating, SON-10 package (2.5 × 1.0 mm) | Targets multi-lane interfaces (e.g., full USB-C with CC/SBU); larger footprint, higher parasitic inductance than WLCSP5 | Select when protecting ≥2 differential pairs simultaneously and board space permits larger package. |
| ESD56201D05-2/TR | Single-channel, 0.35 pF capacitance, ±20 kV ESD rating, DFN1006-2L (1.0 × 0.6 mm) | Higher ESD rating but asymmetric pinout; lacks dedicated GND_CH1 terminal, increasing common-mode coupling risk | Prefer only if ±20 kV air discharge is mandatory and differential impedance control is secondary to peak-voltage suppression. |
Compared with TPD4S012RTER and ESD56201D05-2/TR, PESD1USB3S/CZ uniquely balances ultra-low capacitance, symmetric WLCSP5 routing, dedicated channel ground, and ±15 kV robustness - making it optimal for space-constrained, high-fidelity differential links where signal integrity and ESD reliability must coexist.
Availability
PESD1USB3S/CZ is available at Aetrix Electronics and suitable for smartphone USB-C ports, HDMI 2.0 dongles, and MIPI CSI-2 camera modules requiring stable component supply, consistent wafer-lot traceability, and long-term lifecycle support through 2030.
Supply support for PESD1USB3S/CZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, energy-efficient logic, discrete, and MOSFET devices, serving automotive, industrial, and consumer markets with scalable manufacturing and AEC-Q200 qualified products.
The PESDxUSB3S series was developed to address the need for ultra-low-capacitance, footprint-compatible ESD protection in next-generation high-speed mobile interfaces - specifically targeting USB3.1, HDMI 2.0, and MIPI D-PHY designs where traditional TVS diodes degrade signal fidelity.
FAQ
What is the maximum operating voltage for PESD1USB3S/CZ?
The absolute maximum input voltage is −0.5 V to +5 V per pin (Table 5). This allows safe operation across 3.3 V and 1.8 V I/O domains while ensuring breakdown occurs only above 6 V (min), providing sufficient margin against normal signal swings and power rail variations in USB/HDMI PHYs.
Does PESD1USB3S/CZ require an external bias or control signal?
No. The device is passive and requires no external power, bias, or enable signal. It operates solely via avalanche and snap-back conduction triggered by ESD overvoltage events, with leakage current limited to 100 nA per line at 5 V (Table 6), eliminating standby power impact on battery-powered systems.
Can PESD1USB3S/CZ be used on single-ended lines like USB2.0 D+/D−?
Yes - though optimized for differential use, its bidirectional clamping and low capacitance make it suitable for USB2.0 D+/D− protection. However, USB2.0-specific variants (e.g., PESD5V0S1BA) offer tighter capacitance tolerance and lower leakage; verify eye diagram compliance per USB-IF test plan when substituting.
How does the GND_CH1 pin differ from system ground in layout?
GND_CH1 is a dedicated, isolated ground terminal for ESD current return - not connected internally to other grounds. It must be routed to a local ground pour adjacent to the protected differential pair, separate from digital/analog system GND, to prevent ESD current injection into noise-sensitive reference planes and maintain common-mode rejection.
PESD1USB3S/CZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 5-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 8A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.45pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-WLCSP (0.77x1.17)
PESD1USB3S/CZ FAQ
1.How can I place an order for PESD1USB3S/CZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD1USB3S/CZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD1USB3S/CZ reliable?
The price and inventory of PESD1USB3S/CZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD1USB3S/CZ is usually 5 days.
3.What payment methods are accepted for PESD1USB3S/CZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD1USB3S/CZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD1USB3S/CZ?
PESD1USB3S/CZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD1USB3S/CZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD1USB3S/CZ?
For technical support, including PESD1USB3S/CZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD1USB3S/CZ requirements.
6.How does Aetrix verify that PESD1USB3S/CZ is sourced from the original manufacturer or authorized distributors?
All PESD1USB3S/CZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD1USB3S/CZ meets industry standards.
7.What is the process for return or replacement of PESD1USB3S/CZ?
All PESD1USB3S/CZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD1USB3S/CZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD1USB3S/CZ part is unused and in its original packaging.
Return procedure for PESD1USB3S/CZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD1USB3S/CZ Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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