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Nexperia USA Inc. PESD1USB3SZ
- Part No.:
- PESD1USB3SZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 5-UFBGA, WLCSP
- Datasheet:
-
PESD1USB3SZ.pdf
- Description:
- TVS DIODE 5.5VWM 5WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:5,545
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Product details
Overview
PESD1USB3SZ from Nexperia is a single-channel ESD protection diode array designed for high-speed differential data lines including USB 3.1 SuperSpeed, HDMI 2.0, and MIPI D-PHY interfaces. It delivers ±15 kV IEC 61000-4-2 contact ESD protection per line, features 0.45 pF typical diode capacitance at 1 MHz, 6–9 V breakdown voltage (IR = 1 mA), and supports >17 GHz differential f‑3dB bandwidth - enabling minimal signal integrity impact in compact mobile and portable electronics.
For engineers reviewing the PESD1USB3SZ datasheet, PESD1USB3SZ pinout, PESD1USB3SZ application, or PESD1USB3SZ equivalent, this device is selected for ultra-low-capacitance, footprint-compatible ESD hardening of differential pairs where board space, insertion loss, and eye diagram fidelity at 10 Gbps are critical design constraints.
Technical Context
The PESD1USB3SZ uses TrEOS process technology to achieve snap-back clamping behavior with dynamic resistance as low as 0.16 Ω (TLP, 100 ns), reducing clamping voltage during ESD transients and protecting sensitive SoC I/Os. Its bidirectional dual-diode structure per channel provides symmetrical protection on CH1_IN+/CH1_IN− inputs.
Designed specifically for differential signaling, it maintains impedance continuity (Zdif ≈ 90 Ω) and exhibits <−3 dB differential insertion loss only beyond 17 GHz, preserving USB 3.1 and HDMI 2.0 eye diagrams. The WLCSP5 package enables direct placement at connectors with matched trace lengths and minimal stub effects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge (IEC 61000-4-2); protects downstream SoCs from human-body-model ESD events without latch-up or degradation |
| Diode Capacitance | 0.45 pF typical at 1 MHz / 2.5 V; ensures negligible loading on 10 Gbps differential signals (e.g., USB 3.1 Gen 2) |
| Breakdown Voltage | 6–9 V at IR = 1 mA; sets robust margin above 5 V supply rails while enabling fast clamping onset |
| f‑3dB Bandwidth | >17 GHz differential mode; preserves signal integrity up to HDMI 2.0 (6 Gbps) and USB 3.1 (10 Gbps) data rates |
| Dynamic Resistance | 0.16 Ω (TLP, 100 ns); minimizes clamping voltage overshoot during fast ESD pulses, enhancing system-level robustness |
| Package | WLCSP5 (2-1-2 bump layout, 0.82 × 1.22 mm); enables co-location with USB Type-C or micro-B connectors in space-constrained mobile PCBs |
Pinout & Package
WLCSP5 package: wafer-level chip-scale package with 5 solder bumps in 2-1-2 configuration (0.82 mm × 1.22 mm, 0.4 mm pitch). Dimensions comply with JEDEC MO-254 standard. Requires 0.1 mm stencil thickness and defined solder land (0.25 mm) / paste deposit (0.40 mm) geometry per Fig. 18.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input positive terminal; connects directly to connector-side SuperSpeed TX/RX+ line |
| A2 | CH1_IN− | External differential input negative terminal; routed with matched length and impedance to A1 |
| B1 | GND_CH1 | Channel-specific ground reference; isolated from system GND plane to prevent noise coupling into protected path |
| C1 | CH1_OUT+ | Internal differential output positive terminal; connects to SoC-side data line with minimal trace stub |
| C2 | CH1_OUT− | Internal differential output negative terminal; maintains differential pair routing symmetry to C1 |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Matches PCMFxUSB3S common-mode filters - allows drop-in replacement or hybrid filtering/ESD designs without PCB re-spin |
| TrEOS clamping architecture | Delivers snap-back behavior with sub-1 Ω dynamic resistance, lowering clamping voltage by >30% vs. conventional TVS diodes |
| Ultra-low capacitance | 0.45 pF per line enables use on 10 Gbps links without measurable eye closure or jitter increase |
| Multi-standard support | Validated for USB 3.1, HDMI 2.0, MIPI D-PHY (CSI/DSI), DisplayPort, and eSATA - no requalification needed across protocols |
| Wafer-level packaging | WLCSP5 eliminates bond wires and lead frames, reducing parasitic inductance (<0.1 nH) critical for high-frequency ESD response |
Applications
| USB 3.1 Gen 2 Interface Protection | HDMI 2.0 Source Port Hardening |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs on a smartphone USB Type-C port against repeated ±8 kV contact ESD events during daily user handling. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed between connector and SoC PHY, operating transparently during normal 10 Gbps data transmission. Use Value: Prevents permanent damage to USB controller I/O cells while maintaining <0.1 dB insertion loss at 5 GHz - preserving eye height and jitter budget. |
Use Scenario: Shielding HDMI 2.0 TMDS channels on a tablet's display output port from ESD induced by cable hot-plug or finger touch near the receptacle. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor on each of three TMDS differential pairs, positioned immediately adjacent to the HDMI connector. Use Value: Enables full 6 Gbps operation with measured eye diagram compliance (Fig. 6) and eliminates post-ESD link training failures observed without protection. |
| MIPI D-PHY Camera Interface | Mobile Display Serial Interface (DSI) |
Use Scenario: Safeguarding CSI-2 differential lanes connecting an image sensor to AP in a thin-profile camera module exposed to assembly-line ESD. IC Role / Device Role / Timing Role: Per-lane ESD shunt on both clock and data lanes, leveraging matched trace routing enabled by WLCSP5's symmetric bump layout. Use Value: Maintains 1.5 Gbps D-PHY timing margins (tclk, tdata) with <1 ps added jitter - verified via oscilloscope eye analysis per MIPI spec. |
Use Scenario: Adding robust ESD immunity to DSI lanes driving an OLED panel in a foldable phone, where flex-cable mating induces frequent discharge events. IC Role / Device Role / Timing Role: Differential ESD suppressor on each DSI data lane and clock pair, placed at the display connector to minimize unprotected trace length. Use Value: Achieves zero pixel corruption or panel reset after 50× ±15 kV contact discharges - validated per IEC 61000-4-2 Level 4 testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DBVR | 0.5 pF capacitance; ±12 kV ESD rating; SOT-563 package (1.6 × 1.6 mm) | Larger footprint; higher parasitic inductance limits usable bandwidth to ~12 GHz | Select when board area permits larger package and 12 kV rating suffices for target environment |
| ESD56201D05 | 0.35 pF capacitance; ±20 kV ESD rating; X2SON-6 (1.0 × 1.0 mm) | Asymmetric pinout requires rotated placement; no dedicated channel ground pin | Choose for highest ESD margin in space-constrained layouts where ground routing flexibility exists |
Compared with TPD4E05U06DBVR and ESD56201D05, PESD1USB3SZ offers optimal balance of ultra-low capacitance, industry-leading ±15 kV rating, and WLCSP5's symmetric, connector-proximal layout - making it preferred for next-gen USB 3.1 and HDMI 2.0 designs demanding minimal signal perturbation.
Availability
PESD1USB3SZ is available at Aetrix Electronics and suitable for smartphone USB Type-C ports, tablet HDMI 2.0 outputs, and MIPI D-PHY camera modules requiring stable component supply across high-volume consumer electronics production cycles.
Supply support for PESD1USB3SZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, energy-efficient logic, analog, and ESD protection devices, serving automotive, industrial, and consumer markets with scalable manufacturing and AEC-Q200 qualified products.
PESD1USB3SZ belongs to the PESDxUSB3S series - engineered specifically for ultra-high-speed differential data line protection in mobile and portable systems, prioritizing signal fidelity, miniaturization, and system-level ESD robustness over generic surge suppression.
FAQ
What is the maximum continuous DC voltage that can be applied across PESD1USB3SZ's differential inputs?
The absolute maximum input voltage is −0.5 V to +5 V per pin (Table 5), meaning sustained DC bias must stay within this range. Exceeding 5 V risks permanent damage, and applying unlimited current sources (e.g., battery-connected lines) may force the device into snap-back conduction, causing thermal failure.
Does PESD1USB3SZ require external biasing or control signals to operate?
No. PESD1USB3SZ is a passive, bidirectional ESD protection array with no enable pins, power supplies, or configuration requirements. It operates transparently - conducting only during ESD transients above its breakdown voltage - and imposes no DC loading or signal conditioning on active data paths.
Can PESD1USB3SZ be used on single-ended interfaces like UART or I²C?
No. Its internal dual-diode structure and pinout (CH1_IN+/IN−, CH1_OUT+/OUT−, GND_CH1) are optimized exclusively for differential signaling. Single-ended use would unbalance the clamping path, degrade ESD performance, and violate the specified channel architecture - confirmed by Nexperia's application diagram and test validation limited to USB/HDMI/MIPI.
How does the WLCSP5 package affect thermal performance during repeated ESD strikes?
The WLCSP5's direct silicon-to-PCB thermal path enables rapid heat dissipation: under IEC 61000-4-2 Level 4 (±15 kV) testing, surface temperature rise remains below 15 °C per strike due to low thermal resistance (<30 K/W) and minimal mass. This prevents cumulative heating and ensures consistent clamping performance across 50+ strikes.
PESD1USB3SZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 5-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-WLCSP (0.77x1.17)
PESD1USB3SZ FAQ
1.How can I place an order for PESD1USB3SZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD1USB3SZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD1USB3SZ reliable?
The price and inventory of PESD1USB3SZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD1USB3SZ is usually 5 days.
3.What payment methods are accepted for PESD1USB3SZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD1USB3SZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD1USB3SZ?
PESD1USB3SZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD1USB3SZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD1USB3SZ?
For technical support, including PESD1USB3SZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD1USB3SZ requirements.
6.How does Aetrix verify that PESD1USB3SZ is sourced from the original manufacturer or authorized distributors?
All PESD1USB3SZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD1USB3SZ meets industry standards.
7.What is the process for return or replacement of PESD1USB3SZ?
All PESD1USB3SZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD1USB3SZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD1USB3SZ part is unused and in its original packaging.
Return procedure for PESD1USB3SZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD1USB3SZ Tags
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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