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Nexperia USA Inc. PESD2USB30Z
- Part No.:
- PESD2USB30Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-UFBGA, WLCSP
- Datasheet:
-
PESD2USB30Z.pdf
- Description:
- TVS DIODE 5.5VWM 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:5,111
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Product details
Overview
PESD2USB30 from Nexperia is a dual-channel ESD protection diode array designed for high-speed differential data lines including USB 3.1, HDMI 2.0, and MIPI D-PHY interfaces. It delivers ±15 kV IEC 61000-4-2 contact discharge protection per line, features 0.45 pF typical diode capacitance at 1 MHz, 0.16 Ω dynamic resistance (TLP), and operates within –40 °C to +85 °C ambient temperature.
For engineers reviewing the PESD2USB30 datasheet, PESD2USB30 pinout, PESD2USB30 application, or PESD2USB30 equivalent, this device is selected for ultra-low-capacitance, footprint-compatible ESD hardening of SuperSpeed differential pairs where signal integrity up to 17 GHz f–3dB and minimal insertion loss are critical.
Technical Context
The PESD2USB30 employs a TREOS clamping structure with snap-back behavior to achieve low clamping voltage during ESD transients while maintaining sub-0.5 pF capacitance per channel. Its dual-channel architecture isolates two independent differential pairs, each with dedicated input/output terminals and separate ground connections (GND_CH1, GND_CH2).
It supports bidirectional ESD protection on both external (IN) and internal (OUT) sides of the protected interface, with breakdown voltage ≥6 V and reverse leakage ≤100 nA at 5 V. The WLCSP10 package (4-2-4 bump layout) enables direct placement at USB Type-C or HDMI connectors without trace-length mismatch.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge (IEC 61000-4-2 Level 4); ensures robust system-level immunity for handheld and portable devices. |
| Diode Capacitance | 0.45 pF @ 1 MHz, 2.5 V; preserves signal integrity for 10 Gbps USB 3.1 and 18 Gbps HDMI 2.0 links. |
| Dynamic Resistance | 0.16 Ω (TLP, ±100 ns); minimizes clamping voltage overshoot during fast ESD events. |
| f–3dB | 17 GHz; maintains full bandwidth for high-speed differential signaling without attenuation. |
| Breakdown Voltage | 6 V min @ 1 mA; provides safe margin above 5 V supply rails and logic thresholds. |
| Reverse Leakage | 100 nA max @ 5 V; prevents DC loading and signal distortion on active data lines. |
| Operating Temp | –40 °C to +85 °C; qualified for consumer and industrial portable electronics environments. |
Pinout & Package
Package: WLCSP10 (wafer-level chip-scale package), 1.62 mm × 1.52 mm × 0.60 mm, 10-bump layout (4-2-4), solder land pitch 0.4 mm, compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External positive input of Channel 1; connects directly to USB3.1 TX+/RX+ or HDMI TMDS+ trace. |
| A2 | CH1_IN− | External negative input of Channel 1; forms differential pair with A1 for noise rejection. |
| A3 | CH2_IN+ | External positive input of Channel 2; routes to second high-speed differential pair (e.g., USB3.1 second lane). |
| A4 | CH2_IN− | External negative input of Channel 2; completes second differential path with A3. |
| B1 | GND_CH1 | Dedicated ground return for Channel 1; decouples ESD current path from Channel 2 to prevent crosstalk. |
| B2 | GND_CH2 | Dedicated ground return for Channel 2; enables independent grounding for dual-lane protection. |
| C1 | CH1_OUT+ | Internal positive output of Channel 1; connects to SoC or controller side of protected interface. |
| C2 | CH1_OUT− | Internal negative output of Channel 1; maintains differential balance to downstream IC. |
| C3 | CH2_OUT+ | Internal positive output of Channel 2; routes protected signal to host-side PHY or switch. |
| C4 | CH2_OUT− | Internal negative output of Channel 2; completes low-inductance return path for second lane. |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Matches PCMFxUSB30 common-mode filters; allows drop-in replacement without PCB redesign. |
| TREOS clamping process | Enables <10 V clamping voltage under ±15 kV ESD stress, protecting sensitive SoCs and PHYs. |
| Ultra-low capacitance | 0.45 pF per line minimizes signal degradation and eye diagram closure at 10+ Gbps rates. |
| Dual independent channels | Separate GND pins (B1/B2) and isolated I/O paths prevent inter-channel coupling and crosstalk. |
| WLCSP10 package | 1.62 mm × 1.52 mm footprint saves >60% board area vs. SOT/DFN alternatives; ideal for thin mobile designs. |
Applications
| USB 3.1 Gen 2 Interface Protection | HDMI 2.0 Differential Pair Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX lanes in a USB Type-C dongle or laptop port against connector-based ESD events. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed between connector and USB 3.1 PHY, preserving differential impedance and timing skew. Use Value: Maintains 10 Gbps eye opening (as verified in Fig 4) while suppressing ±15 kV transients before they reach the controller. |
Use Scenario: Hardening HDMI 2.0 source outputs (e.g., tablet GPU) against ESD during cable insertion or handling. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor on TMDS+/- pairs, positioned adjacent to HDMI connector to minimize stub length. Use Value: Enables clean 18 Gbps eye diagrams (Fig 6) with <0.5 dB insertion loss up to 10 GHz, meeting HDMI compliance requirements. |
| MIPI D-PHY CSI-2 Camera Interface | eSATA / LVDS High-Speed Link Protection |
|
Use Scenario: Securing camera serial interface (CSI-2) differential lanes in smartphone rear camera modules exposed to handling ESD. IC Role / Device Role / Timing Role: Dual-channel ESD guard on D+ and D− clock/data lanes, with matched trace routing enabled by symmetric WLCSP10 pinout. Use Value: Prevents image corruption or sensor lockup by clamping transients below 8 V while adding <0.02 UI jitter to 2.5 Gbps D-PHY signals. |
Use Scenario: Protecting external SATA or LVDS display links in industrial tablets where cables are frequently mated/unmated. IC Role / Device Role / Timing Role: High-bandwidth ESD shunt on differential signal pairs, leveraging 17 GHz f–3dB to avoid signal edge rounding. Use Value: Supports reliable 6 Gbps eSATA and 1.5 Gbps LVDS operation with no measurable rise-time degradation (<5% increase). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2EUSB30 (Texas Instruments) | 0.5 pF capacitance, ±12 kV ESD rating, 0.25 Ω dynamic resistance; uses DFN-8 package (2.0 mm × 2.0 mm). | Higher capacitance and larger footprint reduce suitability for ultra-thin USB-C designs; better thermal dissipation for sustained surge events. | Select when board space permits larger package and ±12 kV suffices; avoid if 17 GHz bandwidth or WLCSP integration is required. |
| ESD56201D05 (ON Semiconductor) | 0.35 pF capacitance, ±15 kV rating, 0.18 Ω dynamic resistance; single-channel, requires two units for dual-lane protection. | Doubles component count and layout complexity; lacks integrated dual-channel ground separation (GND_CH1/GND_CH2). | Choose only if lower capacitance is prioritized over layout efficiency and crosstalk isolation; not recommended for space-constrained USB3.1 designs. |
Compared with TPD2EUSB30 and ESD56201D05, PESD2USB30 uniquely combines dual-channel integration, WLCSP10 miniaturization, 0.45 pF capacitance, and ±15 kV rating-enabling single-component, high-fidelity protection for next-generation differential interfaces without compromising signal integrity or PCB real estate.
Availability
PESD2USB30 is available at Aetrix Electronics and suitable for USB 3.1 Gen 2 interface protection, HDMI 2.0 source hardening, and MIPI D-PHY camera module designs requiring stable component supply across high-volume consumer electronics production.
Supply support for PESD2USB30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET components optimized for efficiency-critical applications.
The PESDxUSB30 series belongs to Nexperia's high-speed ESD protection product line, engineered specifically to safeguard differential data interfaces in smartphones, tablets, and portable multimedia devices against system-level ESD threats.
FAQ
What is the maximum data rate supported by PESD2USB30 without signal degradation?
PESD2USB30 supports differential signaling up to 10 Gbps (USB 3.1 Gen 2) and 18 Gbps (HDMI 2.0) with verified eye diagram integrity. Its 17 GHz f–3dB, 0.45 pF capacitance, and <0.5 dB insertion loss at 10 GHz ensure negligible rise-time degradation and jitter accumulation on compliant high-speed traces.
Can PESD2USB30 be used for single-ended signal protection?
No. PESD2USB30 is strictly designed for differential pair protection with matched CHx_IN+/IN− and CHx_OUT+/OUT− terminals. Its internal structure and low capacitance optimization assume balanced signaling; using it on single-ended lines would unbalance termination, degrade ESD performance, and violate specified operating conditions.
How does the TREOS clamping process improve system-level ESD robustness?
TREOS (Transient Robust ESD Output Structure) uses a controlled snap-back mechanism to reduce clamping voltage to <10 V during ±15 kV ESD events. This limits stress on downstream SoCs and PHYs far below their absolute maximum ratings, enabling pass-rate compliance in IEC 61000-4-2 system-level testing without additional board-level filtering.
Is PESD2USB30 automotive-qualified?
No. PESD2USB30 is not AEC-Q200 qualified and is intended for consumer and industrial portable electronics. It lacks extended temperature range (–40 °C to +105 °C), enhanced reliability screening, and automotive-specific qualification testing required for automotive infotainment or ADAS interfaces.
PESD2USB30Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 8A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (1.57x1.17)
PESD2USB30Z FAQ
1.How can I place an order for PESD2USB30Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD2USB30Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD2USB30Z reliable?
The price and inventory of PESD2USB30Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD2USB30Z is usually 5 days.
3.What payment methods are accepted for PESD2USB30Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD2USB30Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD2USB30Z?
PESD2USB30Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD2USB30Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD2USB30Z?
For technical support, including PESD2USB30Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD2USB30Z requirements.
6.How does Aetrix verify that PESD2USB30Z is sourced from the original manufacturer or authorized distributors?
All PESD2USB30Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD2USB30Z meets industry standards.
7.What is the process for return or replacement of PESD2USB30Z?
All PESD2USB30Z units undergo pre-shipment inspection (PSI). If there is an issue with PESD2USB30Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD2USB30Z part is unused and in its original packaging.
Return procedure for PESD2USB30Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD2USB30Z Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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