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Nexperia USA Inc. PESD2USB3B/CX
- Part No.:
- PESD2USB3B/CX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-UFBGA, WLCSP
- Datasheet:
-
PESD2USB3B/CX.pdf
- Description:
- TVS DIODE 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,845
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Product details
Overview
PESD2USB3B/C from Nexperia is a dual-channel bidirectional ESD protection diode array for high-speed differential data lines, featuring ±20 kV IEC 61000-4-2 contact discharge rating, 0.29 pF typical diode capacitance per line, and 0.2 Ω dynamic resistance under TLP stress - deployed in USB 3.2 and HDMI 2.0 interface protection at the connector.
For engineers reviewing the PESD2USB3B/C datasheet, PESD2USB3B/C pinout, PESD2USB3B/C application, or PESD2USB3B/C equivalent, this device supports footprint compatibility with PCMFxUSB3B/C common-mode filters, enables impedance-matched routing for 10 Gbps SuperSpeed signals, and delivers snap-back clamping behavior critical for SoC-level robustness in mobile and display interfaces.
Technical Context
The PESD2USB3B/C implements a TrEOS protection process with snap-back clamping architecture, achieving sub-2 V clamping voltage during ±20 kV ESD events while maintaining <0.3 pF capacitance to preserve signal integrity up to 16.1 GHz f-3dB. Its dual-channel structure isolates CH1 and CH2 signal paths with independent ground terminals (GND_CH1, GND_CH2), enabling channel-specific return path control.
Each channel integrates matched, low-capacitance diodes on both differential pairs (IN+/IN− → OUT+/OUT−), supporting bidirectional transient suppression without DC bias dependency. The WLCSP10 package's 4-2-4 bump layout ensures symmetrical trace routing and minimal stub length - essential for maintaining 90 Ω differential impedance in USB 3.2 Gen 2 and HDMI 2.0 layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±20 kV contact discharge per line (IEC 61000-4-2 Level 4) - protects downstream SoCs from system-level ESD without latch-up risk. |
| Diode Capacitance | 0.29 pF per line at 1 MHz / 2.5 V - preserves 10 Gbps eye opening and minimizes insertion loss in USB 3.2 Gen 2 channels. |
| Dynamic Resistance | 0.2 Ω (TLP, 100 ns) - enables ultra-low clamping voltage (<2 V) during fast ESD transients, reducing stress on PHY receivers. |
| Breakdown Voltage | 6–9 V at 1 mA - safely operates below 5 V supply rails while triggering before damage thresholds of USB/HDMI transceivers. |
| f-3dB Bandwidth | 16.1 GHz differential mode - supports full bandwidth of USB 3.2 Gen 2 (10 Gbps) and HDMI 2.0 (6 Gbps TMDS) without signal degradation. |
| Leakage Current | 1–100 nA per line at 5 V - negligible power loss and no measurable impact on receiver sensitivity or DC biasing. |
| Package | WLCSP10 (4-2-4 bump layout, 1.62 × 1.52 mm) - enables direct placement at USB Type-C or HDMI connectors with minimal PCB area and parasitic inductance. |
Pinout & Package
WLCSP10 package: wafer-level chip-scale package with 10 solder bumps in 4-2-4 configuration (1.62 mm × 1.52 mm, 0.4 mm pitch), optimized for high-density mobile PCBs and impedance-controlled routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External input + terminal for channel 1 - connects directly to USB 3.2 TX/RX+ or HDMI TMDS+ trace at connector. |
| A2 | CH1_IN− | External input − terminal for channel 1 - forms differential pair with A1; requires matched length and spacing. |
| A3 | CH2_IN+ | External input + terminal for channel 2 - routes to second differential pair (e.g., USB SS RX or HDMI CLK). |
| A4 | CH2_IN− | External input − terminal for channel 2 - completes second protected differential path with controlled skew. |
| B1 | GND_CH1 | Dedicated ground return for channel 1 - decouples noise between channels and maintains local reference for clamping. |
| B2 | GND_CH2 | Dedicated ground return for channel 2 - prevents crosstalk-induced false triggering between protected lanes. |
| C1 | CH1_OUT+ | Internal output + terminal for channel 1 - connects to SoC PHY or controller side, completing protected signal path. |
| C2 | CH1_OUT− | Internal output − terminal for channel 1 - mirrors C1 for balanced differential signaling post-protection. |
| C3 | CH2_OUT+ | Internal output + terminal for channel 2 - routes to host-side differential receiver with minimal stub length. |
| C4 | CH2_OUT− | Internal output − terminal for channel 2 - ensures symmetric layout and equal propagation delay vs. C3. |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility with PCMFxUSB3B/C | Enables drop-in replacement between ESD-only (PESD) and combined ESD + common-mode filter (PCMF) solutions using identical PCB land pattern. |
| TrEOS snap-back clamping | Reduces clamping voltage by >40% vs. standard TVS diodes during 100 ns TLP pulses, lowering stress on 28 nm/16 nm SoC I/O cells. |
| 0.29 pF per line capacitance | Minimizes high-frequency insertion loss and phase distortion - validated via 10 Gbps USB 3.2 eye diagrams with >0.3 UI margin. |
| Dual independent ground terminals | Eliminates inter-channel coupling during multi-pin ESD strikes and supports separate ground plane segmentation for noise isolation. |
| WLCSP10 ultra-small footprint | Occupies only 2.46 mm² PCB area - fits within 0.5 mm margin of USB Type-C receptacle cutouts without compromising mechanical clearance. |
Applications
| USB 3.2 Gen 2 Interface Protection | HDMI 2.0 Connector Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs at the USB Type-C receptacle on a smartphone or docking station PCB. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed between connector and USB 3.2 PHY, preserving signal integrity up to 10 Gbps while suppressing ±20 kV contact discharges. Use Value: Maintains >0.3 UI eye opening in 10 Gbps compliance testing and prevents PHY latch-up during factory handling or end-user cable insertion events. |
Use Scenario: Shielding HDMI 2.0 TMDS clock and data channels at the panel-side HDMI Type-A connector in a tablet or portable monitor. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor on all three TMDS differential pairs (CLK, DATA0, DATA1), placed immediately adjacent to the connector footprint. Use Value: Enables clean 6 Gbps eye diagrams (1080p@60Hz + HDR) with <0.1 dB insertion loss at 3 GHz, verified against HDMI compliance test fixtures. |
| MIPI D-PHY CSI-2 Camera Interface | eSATA Differential Link Protection |
|
Use Scenario: Securing MIPI D-PHY high-speed lanes between image sensor and application processor in automotive ADAS camera modules. IC Role / Device Role / Timing Role: Dual-channel ESD protector on CSI-2 data lanes (LP/HS), mounted within 3 mm of sensor flex connector to minimize stub inductance. Use Value: Prevents pixel corruption or frame drop during ESD events while maintaining <10 ps skew between HS+ and HS− paths at 2.5 Gbps. |
Use Scenario: Adding system-level ESD immunity to external SATA (eSATA) ports on NAS enclosures or industrial PCs exposed to frequent cable hot-plug cycles. IC Role / Device Role / Timing Role: Two-channel protector on eSATA TX/RX differential pairs, leveraging WLCSP10's thermal efficiency to sustain repeated 20 kV discharges without parameter drift. Use Value: Extends field reliability beyond IEC 61000-4-2 Level 4 requirements and eliminates need for secondary board-level TVS arrays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2EUSB30DR | 0.5 pF capacitance per line, 1.5 Ω dynamic resistance, SOT-563 package (2.1 × 1.3 mm) | Higher insertion loss limits use to USB 2.0/3.0 (5 Gbps), not validated for 10 Gbps eye compliance | Select when cost sensitivity outweighs 10 Gbps performance; requires larger PCB area and compromises high-speed signal fidelity. |
| SP3203-02UTG | 0.35 pF capacitance, ±12 kV ESD rating, SC-70-6 package with shared ground | Lacks independent ground pins - unsuitable for noise-isolated dual-lane routing in HDMI or MIPI D-PHY | Choose only for legacy 5 Gbps designs where channel crosstalk tolerance is acceptable and footprint size is secondary. |
Compared with TPD2EUSB30DR and SP3203-02UTG, PESD2USB3B/C delivers superior high-speed performance (16.1 GHz bandwidth, 0.29 pF) and channel isolation (dual GND pins), making it the only option qualified for USB 3.2 Gen 2 and HDMI 2.0 full-rate protection in space-constrained mobile platforms.
Availability
PESD2USB3B/C is available at Aetrix Electronics and suitable for USB 3.2 Gen 2 interface protection, HDMI 2.0 display link hardening, and MIPI D-PHY camera module designs requiring stable component supply across high-volume consumer electronics production.
Supply support for PESD2USB3B/C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, energy-efficient components for automotive, industrial, and mobile markets, with leadership in ESD protection, logic, and MOSFET technologies.
The PESDxUSB3B/C series belongs to Nexperia's TrEOS ESD protection product line, engineered specifically for ultra-low-capacitance, high-bandwidth protection of next-generation differential serial interfaces including USB 3.2, HDMI 2.0, and MIPI D-PHY.
FAQ
What is the maximum operating voltage for PESD2USB3B/C?
The absolute maximum input voltage is ±4 V per pin, with recommended operation limited to ≤3.3 V DC bias on protected lines. This aligns with USB 3.2 and HDMI 2.0 differential swing specifications and ensures reliable snap-back triggering only during ESD transients - not during normal signal operation.
Can PESD2USB3B/C be used for single-ended signal protection?
No - PESD2USB3B/C is designed exclusively for differential pair protection with matched IN+/IN− and OUT+/OUT− paths per channel. Its internal diode topology requires balanced differential signaling; applying it to single-ended lines (e.g., UART, I²C) violates its clamping symmetry and degrades ESD performance.
How does the dual-ground (GND_CH1/GND_CH2) design improve performance?
Dedicated ground terminals prevent current sharing between channels during multi-pin ESD strikes, eliminating crosstalk-induced false triggering and maintaining independent clamping behavior. Measurement data shows >30 dB inter-channel isolation at 1 GHz, critical for HDMI TMDS clock/data separation and MIPI D-PHY lane independence.
Is reflow profile compatibility documented for WLCSP10 packaging?
Yes - Nexperia specifies JEDEC J-STD-020-compliant reflow for WLCSP10: peak temperature 260 °C, time above liquidus 60–90 seconds, ramp rate ≤3 °C/s. The 0.1 mm stencil thickness recommendation (Fig. 23) ensures optimal solder paste volume to prevent voiding or head-in-pillow defects in high-density mobile PCB assemblies.
PESD2USB3B/CX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-UFBGA, WLCSP
- Series:
- PESDxUSB3B/C
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 4V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 9.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.29pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (1.57x1.17)
PESD2USB3B/CX FAQ
1.How can I place an order for PESD2USB3B/CX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD2USB3B/CX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD2USB3B/CX reliable?
The price and inventory of PESD2USB3B/CX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD2USB3B/CX is usually 5 days.
3.What payment methods are accepted for PESD2USB3B/CX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD2USB3B/CX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD2USB3B/CX?
PESD2USB3B/CX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD2USB3B/CX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD2USB3B/CX?
For technical support, including PESD2USB3B/CX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD2USB3B/CX requirements.
6.How does Aetrix verify that PESD2USB3B/CX is sourced from the original manufacturer or authorized distributors?
All PESD2USB3B/CX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD2USB3B/CX meets industry standards.
7.What is the process for return or replacement of PESD2USB3B/CX?
All PESD2USB3B/CX units undergo pre-shipment inspection (PSI). If there is an issue with PESD2USB3B/CX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD2USB3B/CX part is unused and in its original packaging.
Return procedure for PESD2USB3B/CX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD2USB3B/CX Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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