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Nexperia USA Inc. PESD2USB3B/CZ
- Part No.:
- PESD2USB3B/CZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-UFBGA, WLCSP
- Datasheet:
-
PESD2USB3B/CZ.pdf
- Description:
- TVS DIODE 4VWM 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:8,204
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Product details
Overview
PESD2USB3B/C from Nexperia is a dual-channel bidirectional ESD protection diode array for high-speed differential data lines, featuring ±20 kV IEC 61000-4-2 contact discharge rating, 0.29 pF typical diode capacitance per line, and 16.1 GHz f-3dB differential insertion loss bandwidth - deployed in USB 3.2 Gen 2 (10 Gbps) and HDMI 2.0 interfaces to safeguard SoC transceivers.
For engineers reviewing the PESD2USB3B/C datasheet, PESD2USB3B/C pinout, PESD2USB3B/C application, or PESD2USB3B/C equivalent, this device delivers ultra-low-capacitance, footprint-compatible ESD hardening for differential pairs without signal integrity degradation - critical for layout-constrained mobile and display interface designs.
Technical Context
The PESD2USB3B/C implements a TrEOS clamping architecture with snap-back behavior, achieving dynamic resistance of 0.2 Ω under ±100 ns TLP pulses to minimize clamping voltage during ESD events. Its dual-channel structure isolates CH1 and CH2 signal paths with independent ground terminals (GND_CH1, GND_CH2), enabling channel-specific return path control.
Designed for impedance-matched routing, it maintains differential Zdif ≈ 90 Ω across DC–16 GHz and supports clean 10 Gbps USB 3.2 eye diagrams when placed at Type-C connector entry points - verified with <1 dB insertion loss up to 8 GHz and <-40 dB crosstalk at 5 GHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±20 kV contact discharge (IEC 61000-4-2 Level 4); protects downstream SoCs from human-body-model ESD strikes. |
| Diode Capacitance | 0.29 pF per line at 1 MHz/2.5 V; preserves signal integrity on 10 Gbps differential links with minimal timing skew. |
| Breakdown Voltage | 6–9 V (IR = 1 mA); ensures reliable clamping before damage to 3.3 V or 5 V interface receivers. |
| Differential Bandwidth | 16.1 GHz f-3dB; supports full USB 3.2 Gen 2 and HDMI 2.0 (6 Gbps) data rates without attenuation. |
| Dynamic Resistance | 0.2 Ω (TLP, ±100 ns); enables low-voltage clamping (<8 V) during fast ESD transients to limit stress on protected ICs. |
| Leakage Current | 1–100 nA per line at 5 V; avoids DC loading or bias shift in high-impedance receiver inputs. |
Pinout & Package
Package: WLCSP10 (wafer-level chip-scale package), 1.62 mm × 1.52 mm × 0.64 mm, 10-bump layout (4-2-4), solder bump pitch 0.4 mm, compatible with standard SMT reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External-side positive input of Channel 1; connects to USB3.2 TX/RX+ or HDMI TMDS+ trace. |
| A2 | CH1_IN- | External-side negative input of Channel 1; routed differentially with A1 to maintain 90 Ω impedance. |
| A3 | CH2_IN+ | External-side positive input of Channel 2; used for second differential pair (e.g., USB3.2 second lane or HDMI clock). |
| A4 | CH2_IN- | External-side negative input of Channel 2; isolated from CH1 ground to prevent inter-channel coupling. |
| B1 | GND_CH1 | Dedicated ground return for Channel 1; must be connected to local ground plane beneath device for optimal ESD path. |
| B2 | GND_CH2 | Dedicated ground return for Channel 2; electrically separate from B1 to avoid cross-talk between channels. |
| C1 | CH1_OUT+ | Internal-side positive output; connects directly to SoC differential receiver input (e.g., USB3 PHY RX+). |
| C2 | CH1_OUT- | Internal-side negative output; completes low-inductance protected path to SoC with matched length to C1. |
| C3 | CH2_OUT+ | Internal-side positive output for Channel 2; enables simultaneous protection of two independent high-speed lanes. |
| C4 | CH2_OUT- | Internal-side negative output for Channel 2; supports compact routing without shared vias or stubs. |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Matches PCMF2USB3B/C common-mode filters - allows drop-in replacement or co-design without PCB redesign. |
| TrEOS clamping process | Delivers snap-back behavior with sub-8 V clamping voltage at 8 A TLP, reducing stress on sensitive 28 nm/16 nm SoCs. |
| Ultra-low capacitance | 0.29 pF per line minimizes signal distortion and jitter on 10 Gbps links - validated via clean USB 3.2 eye diagrams. |
| Independent channel grounds | B1 and B2 provide isolated return paths, preventing ground bounce coupling between protected differential pairs. |
| High-frequency performance | 16.1 GHz f-3dB and <-40 dB crosstalk at 5 GHz ensure compliance with USB 3.2 Gen 2 and HDMI 2.0 signal integrity requirements. |
Applications
| USB 3.2 Gen 2 Interface | HDMI 2.0 Interface |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential lanes on a USB Type-C receptacle in smartphones and docking stations. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed immediately at the connector to shunt transient energy before reaching the USB 3.2 PHY. Use Value: Maintains 10 Gbps eye opening (verified with >0.3 UI margin) while surviving ±20 kV contact discharge per lane. |
Use Scenario: Safeguarding TMDS clock and data channels on HDMI 2.0 source ports in tablets and set-top boxes. IC Role / Device Role / Timing Role: Dual-channel protector covering one TMDS data pair and the TMDS clock pair with independent grounding. Use Value: Enables 6 Gbps HDMI 2.0 operation with <1 dB insertion loss up to 8 GHz and no measurable eye closure. |
| MIPI D-PHY CSI-2 | eSATA / LVDS Links |
|
Use Scenario: ESD hardening of camera serial interface (CSI-2) differential lanes in mobile camera modules. IC Role / Device Role / Timing Role: Low-capacitance clamp on MIPI D-PHY data/lane pairs (e.g., LP/HS mode signals) to preserve timing margins. Use Value: 0.29 pF capacitance prevents skew-induced bit errors in HS mode (up to 2.5 Gbps) and supports LP mode DC coupling. |
Use Scenario: Protecting external SATA or LVDS video links in industrial displays and embedded vision systems. IC Role / Device Role / Timing Role: Dual-channel transient suppressor on eSATA TX/RX or LVDS clock/data pairs with minimal signal loading. Use Value: Supports 3 Gbps eSATA and 650 Mbps LVDS with <0.5 dB loss at Nyquist frequency and robust ±20 kV system-level immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel high-speed differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESDE0402MUTAG | Single-channel, 0.35 pF capacitance, ±12 kV ESD rating, SOD-923 package (1.0 mm × 0.6 mm) | Requires two devices for dual-channel use; larger footprint and higher capacitance degrade 10 Gbps signal integrity. | Select only if board space permits discrete placement and 12 kV rating suffices for target environment. |
| Vishay VEML6040-GS08 | Optical sensor - not an ESD protector; incompatible function and pinout. | N/A - misidentified part; excluded from functional comparison. | Not applicable; VEML6040 is ambient light sensor and cannot substitute for PESD2USB3B/C. |
Compared with ESDE0402MUTAG, PESD2USB3B/C offers integrated dual-channel protection, 33% lower capacitance, and 67% higher ESD rating in half the PCB area - making it superior for space-constrained, high-reliability USB/HDMI designs. The VEML6040 is functionally unrelated and unsuitable as an alternative.
Availability
PESD2USB3B/C is available at Aetrix Electronics and suitable for USB 3.2 Gen 2 interface protection, HDMI 2.0 display links, and MIPI D-PHY camera modules requiring stable component supply across high-volume consumer electronics production.
Supply support for PESD2USB3B/C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, high-reliability logic, discrete, and MOSFET solutions - serving automotive, industrial, and consumer markets with scalable manufacturing and rigorous quality standards.
The PESDxUSB3B/C series belongs to Nexperia's ESD protection portfolio, engineered specifically for ultra-high-speed differential interfaces where low capacitance, precise impedance control, and system-level ±20 kV immunity are mandatory design requirements.
FAQ
What is the maximum data rate supported by PESD2USB3B/C?
PESD2USB3B/C supports differential data rates up to 10 Gbps (USB 3.2 Gen 2) with verified eye diagram integrity, enabled by its 16.1 GHz f-3dB bandwidth and 0.29 pF line capacitance - confirmed through measurement on evaluation boards with controlled-impedance traces.
Can PESD2USB3B/C be used for single-ended signals like USB 2.0 D+/D−?
No - PESD2USB3B/C is optimized exclusively for differential signaling. Its internal structure provides matched clamping for complementary pairs; using it on single-ended lines would unbalance protection and degrade ESD performance due to asymmetric current paths and undefined common-mode behavior.
Is the WLCSP10 package compatible with standard reflow soldering processes?
Yes - the WLCSP10 package uses solder bumps compatible with IPC-7095-compliant reflow profiles, including peak temperatures up to 260 °C. Recommended stencil thickness is 0.1 mm, and solder land dimensions (0.25 mm × 0.25 mm) align with industry-standard fine-pitch SMT assembly practices.
How does the TrEOS clamping architecture improve system-level ESD robustness?
TrEOS employs a snap-back mechanism that reduces dynamic resistance to 0.2 Ω during ESD events, lowering clamping voltage to <8 V at 8 A TLP current - significantly below the breakdown threshold of modern SoC I/O cells. This prevents latch-up and oxide damage in 28 nm and smaller process nodes.
PESD2USB3B/CZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-UFBGA, WLCSP
- Series:
- PESDxUSB3B/C
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 2
- Voltage - Reverse Standoff (Typ):
- 4V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 9.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.29pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (1.57x1.17)
PESD2USB3B/CZ FAQ
1.How can I place an order for PESD2USB3B/CZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD2USB3B/CZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD2USB3B/CZ reliable?
The price and inventory of PESD2USB3B/CZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD2USB3B/CZ is usually 5 days.
3.What payment methods are accepted for PESD2USB3B/CZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD2USB3B/CZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD2USB3B/CZ?
PESD2USB3B/CZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD2USB3B/CZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD2USB3B/CZ?
For technical support, including PESD2USB3B/CZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD2USB3B/CZ requirements.
6.How does Aetrix verify that PESD2USB3B/CZ is sourced from the original manufacturer or authorized distributors?
All PESD2USB3B/CZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD2USB3B/CZ meets industry standards.
7.What is the process for return or replacement of PESD2USB3B/CZ?
All PESD2USB3B/CZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD2USB3B/CZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD2USB3B/CZ part is unused and in its original packaging.
Return procedure for PESD2USB3B/CZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD2USB3B/CZ Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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