Nexperia USA Inc. PESD2USB3S/CX

Overview

PESD2USB3S/CX from Nexperia is a dual-channel ESD protection diode array for high-speed differential data lines, featuring ±15 kV IEC 61000-4-2 contact discharge protection per line, 0.45 pF typical diode capacitance at 1 MHz, and 17 GHz f_-3dB cut-off frequency. It is designed for USB 3.1/3.2 and HDMI 2.0 interfaces in compact mobile devices requiring minimal signal distortion and footprint compatibility with PCMFxUSB3S filters.

For engineers reviewing the PESD2USB3S/CX datasheet, PESD2USB3S/CX pinout, PESD2USB3S/CX application, or PESD2USB3S/CX equivalent, this device supports high-fidelity differential signaling in space-constrained layouts while maintaining sub-1 Ω dynamic resistance during ESD transients and preserving signal integrity up to 10 Gbps.

Technical Context

The PESD2USB3S/CX implements a TrEOS clamping architecture with snap-back behavior, delivering low clamping voltage (<10 V at 8 A TLP) and negative dynamic resistance under ESD stress. Its dual-channel layout isolates CH1 and CH2 signal paths with independent ground terminals (B1, B2), enabling channel-specific impedance control and minimizing crosstalk.

It operates across –40 °C to +125 °C ambient temperature, supports 5 V DC input voltage, and maintains <100 nA reverse leakage per line at 5 V. The device exhibits symmetric positive/negative transient dynamic resistance (0.16 Ω typ.) and differential insertion loss <–1 dB up to 10 GHz, validated via TDR and eye diagram testing on USB3.1 and HDMI 2.0 reference boards.

Key Specifications

Pinout & Package

Package: WLCSP10 wafer-level chip-scale package (1.62 mm × 1.52 mm, 0.6 mm max height), 10 solder bumps arranged in 4-2-4 configuration with A1–A4 top row, B1–B2 middle row, C1–C4 bottom row.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel differential ESD protection applications.

Compared with TPD2EUSB30DRYR and SP1006-02UTG, PESD2USB3S/CX uniquely delivers dual-channel protection in a single WLCSP10 die with industry-leading 0.45 pF capacitance and 17 GHz bandwidth-enabling smaller PCB area, lower BOM count, and superior high-speed signal integrity for next-gen mobile interfaces.

Availability

PESD2USB3S/CX is available at Aetrix Electronics and suitable for USB 3.2 Gen 2, HDMI 2.0, and MIPI D-PHY CSI-2 applications requiring stable component supply, high-volume production readiness, and long-term lifecycle assurance.

Supply support for PESD2USB3S/CX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, energy-efficient logic, discrete, and MOSFET solutions, serving automotive, industrial, and consumer markets with ASIL-certified reliability.

The PESDxUSB3S series targets high-speed interface protection in space-constrained portable electronics, delivering ESD robustness without compromising signal fidelity-designed specifically for USB, HDMI, and MIPI differential standards.

FAQ

What is the maximum recommended trace length between PESD2USB3S/CX and the USB-C connector?

Trace length from A1/A2 and A3/A4 pins to the connector should not exceed 3 mm to minimize stub inductance and preserve signal integrity at 10 Gbps. Shorter traces (<1.5 mm) are preferred for HDMI 2.0 applications where eye opening margin is tighter. Keep differential pairs tightly coupled and avoid vias in the protected path.

Does PESD2USB3S/CX require external biasing or control signals?

No. PESD2USB3S/CX is a passive, bidirectional ESD protection device with no enable pin, supply rail, or bias requirement. It operates transparently in-circuit-conducting only during ESD transients-and introduces no DC loading or timing delay during normal operation.

Can PESD2USB3S/CX be used for USB2.0 D+/D– lines?

Yes, but it is over-specified for USB2.0's 480 Mbps bandwidth. Its 17 GHz f_-3dB and 0.45 pF capacitance provide excellent protection, though a lower-cost single-channel solution like PESD1USB3S may be more economical for USB2.0-only designs.

How does the TrEOS clamping process improve system-level ESD performance?

TrEOS enables snap-back behavior with negative dynamic resistance, lowering clamping voltage to ~6 V at 8 A TLP current-30–40% lower than conventional diodes. This reduces stress on downstream SoC I/O cells and eliminates the need for additional series impedance, simplifying layout and improving pass rates in IEC 61000-4-2 system-level testing.