My Inquiry
My Account
Nexperia USA Inc. PESD2USB3S/CZ
- Part No.:
- PESD2USB3S/CZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-UFBGA, WLCSP
- Datasheet:
-
PESD2USB3S/CZ.pdf
- Description:
- TVS DIODE 5VWM 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:9,369
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PESD2USB3S/CZ from Nexperia is a dual-channel ESD protection diode array for high-speed differential data lines, featuring ±15 kV IEC 61000-4-2 contact discharge rating, 0.45 pF typical diode capacitance per channel at 1 MHz, and WLCSP10 (4-2-4) wafer-level chip-scale package. It protects USB 3.1 SuperSpeed TX/RX pairs while preserving signal integrity up to 17 GHz f-3dB, with dynamic resistance of 0.16 Ω (TLP, 100 ns) and snap-back clamping behavior for low-voltage system protection.
For engineers reviewing the PESD2USB3S/CZ datasheet, PESD2USB3S/CZ pinout, PESD2USB3S/CZ application, or PESD2USB3S/CZ equivalent, this device is selected for ultra-low-capacitance, footprint-compatible ESD hardening of differential interfaces in space-constrained mobile and display systems where insertion loss, crosstalk, and impedance matching are critical.
Technical Context
The PESD2USB3S/CZ implements a TrEOS protection process with snap-back clamping architecture, delivering sub-10 V clamping voltage under ±15 kV ESD stress and enabling robust protection of sensitive SoCs without signal degradation. Its dual-channel layout isolates CH1 and CH2 grounds (B1, B2), supporting independent return paths for differential pair routing.
Designed for 10 Gbps USB 3.1 and HDMI 2.0 applications, it maintains differential impedance near 90 Ω (typical TDR plot), exhibits <−7 dB insertion loss at 10 GHz, and achieves <−60 dB differential crosstalk between channels - all verified via eye diagram testing with and without the device on evaluation boards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge (IEC 61000-4-2 Level 4); protects downstream SoCs from human-body-model surges at connector entry points. |
| Diode Capacitance | 0.45 pF per channel at 1 MHz, 2.5 V bias; ensures minimal signal distortion on 10 Gbps differential links. |
| Dynamic Resistance | 0.16 Ω (TLP, 100 ns, ± polarity); enables fast, low-voltage clamping to limit transient overshoot across protected lines. |
| Breakdown Voltage | 6–9 V at 1 mA; sets precise trigger threshold above normal 5 V signaling rails while avoiding false triggering. |
| f-3dB | 17 GHz differential mode; preserves full bandwidth of USB 3.1 Gen 2 and HDMI 2.0 signals without attenuation. |
| Leakage Current | 1–100 nA per line at 5 V; prevents DC loading or bias shift in high-impedance receiver inputs. |
Pinout & Package
Package: WLCSP10 (4-2-4), wafer-level chip-size package, 1.62 mm × 1.52 mm × 0.60 mm max height, solder bump pitch 0.4 mm, compatible with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External input + terminal for differential channel 1; connects directly to USB3.1 TX1+/RX1+ trace at connector. |
| A2 | CH1_IN- | External input − terminal for differential channel 1; routed with matched length and spacing to A1. |
| A3 | CH2_IN+ | External input + terminal for differential channel 2; supports second USB3.1 lane or HDMI TMDS pair. |
| A4 | CH2_IN- | External input − terminal for differential channel 2; electrically isolated from CH1 ground path. |
| B1 | GND_CH1 | Dedicated ground for channel 1; provides local return path to minimize loop inductance and crosstalk. |
| B2 | GND_CH2 | Dedicated ground for channel 2; no internal connection to B1 - enables split-ground PCB layout. |
| C1 | CH1_OUT+ | Internal output + terminal; connects to SoC-side TX1+/RX1+ trace with controlled impedance routing. |
| C2 | CH1_OUT- | Internal output − terminal; forms low-inductance protected path to host controller differential receiver. |
| C3 | CH2_OUT+ | Internal output + terminal for channel 2; maintains signal symmetry and timing alignment with C4. |
| C4 | CH2_OUT- | Internal output − terminal for channel 2; completes dual-lane protection without shared ground coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Matches PCMFxUSB3S common-mode filters - allows design reuse and late-stage ESD-only substitution without PCB revision. |
| TrEOS snap-back clamping | Reduces clamping voltage under ESD stress by >40% vs. standard TVS, limiting SoC rail excursion to safe levels. |
| Dual independent ground pins | Enables separate ground return paths per channel, suppressing inter-pair crosstalk and maintaining CMRR >30 dB. |
| Ultra-low capacitance | 0.45 pF/channel minimizes high-frequency signal reflection and preserves eye opening at 10 Gbps. |
| WLCSP10 package | 1.62 mm × 1.52 mm footprint saves >60% board area vs. SOT323 alternatives while enabling 0.4 mm bump pitch routing. |
Applications
| USB 3.1 Gen 2 Interface Protection | HDMI 2.0 TMDS Line Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs on a USB Type-C receptacle in a smartphone or dongle. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed immediately at the connector, before any series impedance or filtering. Use Value: Maintains 10 Gbps eye integrity (verified in Fig. 4/5) while surviving ±15 kV contact discharge without latch-up or parameter shift. |
Use Scenario: Hardening HDMI 2.0 source-side TMDS channels on a tablet display interface PCB. IC Role / Device Role / Timing Role: Low-capacitance shunt protector on each of three TMDS differential pairs (clock + two data lanes). Use Value: Delivers <−60 dB crosstalk (Fig. 2) and 17 GHz bandwidth to sustain 18 Gbps HDMI 2.0 data rates without jitter accumulation. |
| MIPI D-PHY CSI-2 Camera Interface | eSATA / LVDS Differential Link Protection |
|
Use Scenario: ESD safeguarding for MIPI D-PHY high-speed data lanes connecting an image sensor to AP in a mobile camera module. IC Role / Device Role / Timing Role: Per-lane protection on D+ and D− lines with matched propagation delay (<0.1 ps skew) to preserve D-PHY timing margins. Use Value: 0.16 Ω dynamic resistance ensures sub-100 ps response time, preventing ESD-induced bit errors during 2.5 Gbps CSI-2 bursts. |
Use Scenario: Protecting eSATA or LVDS serial links in industrial embedded displays or storage controllers. IC Role / Device Role / Timing Role: Dual-channel guard for bidirectional differential signaling with DC-coupled operation and no common-mode filter requirement. Use Value: 6–9 V breakdown voltage avoids interference with 2.5 V or 3.3 V LVDS swing, while ±15 kV rating exceeds IEC 61000-4-2 system-level requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2EUSB30DRYR | 0.5 pF capacitance, ±12 kV ESD rating, SOT-5X3 package (1.6 mm × 1.6 mm), single ground pin. | Higher capacitance and shared ground increase crosstalk risk in multi-lane layouts; less suitable for USB 3.1 Gen 2. | Select when cost sensitivity outweighs 10 Gbps performance needs and board space permits larger SOT package. |
| ESD56201D05 | 0.35 pF capacitance, ±15 kV rating, X2SON-8 (1.0 mm × 1.0 mm), no dedicated channel grounds. | Smaller footprint but lacks isolated GND pins; requires careful ground plane partitioning to avoid noise coupling. | Prefer for ultra-dense layouts where 0.35 pF enables marginally better 12 Gbps HDMI 2.1 headroom, accepting ground layout complexity. |
Compared with TPD2EUSB30DRYR and ESD56201D05, PESD2USB3S/CZ uniquely combines ±15 kV robustness, 0.45 pF/channel, dual isolated grounds, and WLCSP10 footprint - making it optimal for USB 3.1 Gen 2 and HDMI 2.0 designs requiring simultaneous performance, density, and layout simplicity.
Availability
PESD2USB3S/CZ is available at Aetrix Electronics and suitable for smartphone USB-C ports, tablet HDMI 2.0 interfaces, and MIPI D-PHY camera modules requiring stable component supply with guaranteed long-term manufacturability and consistent wafer-level assembly quality.
Supply support for PESD2USB3S/CZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, energy-efficient logic, analog, and ESD protection solutions, serving automotive, industrial, and consumer markets with ISO/TS 16949-certified manufacturing.
The PESDxUSB3S series was developed specifically to address ESD vulnerability in high-speed differential interfaces - delivering ultra-low capacitance, snap-back clamping, and footprint compatibility with common-mode filters for seamless integration into next-generation mobile and display platforms.
FAQ
What is the maximum operating voltage for PESD2USB3S/CZ?
The absolute maximum input voltage is −0.5 V to +5 V per pin (Table 5), with recommended operation limited to ≤5 V DC or peak AC signals. This aligns with USB 3.1 and HDMI 2.0 signaling voltages and ensures reliable snap-back triggering only during ESD events - not during normal operation.
Can PESD2USB3S/CZ be used for HDMI 2.0 clock lane protection?
Yes - its 17 GHz f-3dB, <−7 dB insertion loss at 10 GHz, and <−60 dB crosstalk (Fig. 2) meet HDMI 2.0 clock lane requirements. The device is validated in HDMI 2.0 eye diagrams (Figs. 6–7), showing no measurable jitter or amplitude degradation on TMDS clock pairs when placed at the source connector.
Is the WLCSP10 package compatible with standard SMT reflow profiles?
Yes - the WLCSP10 package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C for ≤30 seconds. Recommended stencil thickness is 0.1 mm, with solder paste deposit dimensions defined in Figure 19 (PESD2USB3S solder footprint).
Does PESD2USB3S/CZ require external bias or control signals?
No - it is a passive, bidirectional ESD protection device with no power or enable pins. It operates solely through intrinsic diode junction behavior and snap-back clamping, requiring zero external circuitry or configuration. All pins are either signal I/O or dedicated ground terminals.
PESD2USB3S/CZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 8A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.45pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (1.57x1.17)
PESD2USB3S/CZ FAQ
1.How can I place an order for PESD2USB3S/CZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD2USB3S/CZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD2USB3S/CZ reliable?
The price and inventory of PESD2USB3S/CZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD2USB3S/CZ is usually 5 days.
3.What payment methods are accepted for PESD2USB3S/CZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD2USB3S/CZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD2USB3S/CZ?
PESD2USB3S/CZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD2USB3S/CZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD2USB3S/CZ?
For technical support, including PESD2USB3S/CZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD2USB3S/CZ requirements.
6.How does Aetrix verify that PESD2USB3S/CZ is sourced from the original manufacturer or authorized distributors?
All PESD2USB3S/CZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD2USB3S/CZ meets industry standards.
7.What is the process for return or replacement of PESD2USB3S/CZ?
All PESD2USB3S/CZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD2USB3S/CZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD2USB3S/CZ part is unused and in its original packaging.
Return procedure for PESD2USB3S/CZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD2USB3S/CZ Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
