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Nexperia USA Inc. PESD2USB3SZ
- Part No.:
- PESD2USB3SZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-UFBGA, WLCSP
- Datasheet:
-
PESD2USB3SZ.pdf
- Description:
- TVS DIODE 5.5VWM 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,608
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Product details
Overview
PESD2USB3SZ from Nexperia is a dual-channel ESD protection diode array for high-speed differential data lines, providing ±15 kV IEC 61000-4-2 contact discharge protection per line, 0.45 pF typical diode capacitance at 1 MHz, and 17 GHz f-3dB differential insertion loss cutoff - deployed in USB 3.1/3.2, HDMI 2.0, and MIPI D-PHY interfaces.
For engineers reviewing the PESD2USB3SZ datasheet, PESD2USB3SZ pinout, PESD2USB3SZ application, or PESD2USB3SZ equivalent, this device supports footprint-compatible replacement of PCMFxUSB3S common-mode filters, enables low-capacitance signal integrity preservation on SuperSpeed TX/RX pairs, and delivers snap-back clamping behavior with 0.16 Ω dynamic resistance under TLP stress.
Technical Context
The PESD2USB3SZ integrates two independent bidirectional ESD protection channels in a single WLCSP10 package, each featuring a TrEOS process-based clamping structure that exhibits snap-back behavior to reduce clamping voltage during ESD transients. Its differential architecture maintains impedance continuity with <85–115 Ω Zdif across 0–10 GHz.
It operates within –40 °C to +125 °C ambient temperature, supports 5 V DC input voltage, and achieves <100 nA reverse leakage per line at 5 V. The device is not intended for unlimited DC current sources due to snap-back state retention risk after breakdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge (IEC 61000-4-2 Level 4) per signal line - ensures robust system-level immunity for USB/HDMI connectors exposed to user handling. |
| Diode Capacitance | 0.45 pF typical at 1 MHz, 2.5 V - preserves signal integrity up to 10 Gbps by minimizing capacitive loading on differential pairs. |
| f-3dB Cutoff | 17 GHz differential mode - maintains full bandwidth for USB 3.2 Gen 2 (10 Gbps) and HDMI 2.0 (6 Gbps) without insertion loss degradation. |
| Dynamic Resistance | 0.16 Ω (TLP, 100 ns) - enables ultra-low clamping voltage during fast ESD events, protecting sensitive SoC PHYs. |
| Breakdown Voltage | 6–9 V (VBR, IR = 1 mA) - sets precise trigger threshold above normal signal swing (e.g., USB 3.1 common-mode ~1.2 V). |
| Leakage Current | 1–100 nA per line at 5 V - avoids DC bias shift or power drain in always-on high-speed links. |
Pinout & Package
Package: WLCSP10 (wafer-level chip-scale package), 1.62 mm × 1.52 mm × 0.60 mm max, 10-bump layout (4-2-4), solder land 0.25 mm diameter, stencil thickness recommended at 0.1 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input positive for channel 1 - connects directly to USB 3.1 TX+/RX+ or HDMI TMDS+ trace at connector. |
| A2 | CH1_IN- | External differential input negative for channel 1 - routed with matched length and impedance to A1 for common-mode rejection. |
| A3 | CH2_IN+ | External differential input positive for channel 2 - supports second high-speed pair (e.g., USB 3.1 second lane or HDMI clock channel). |
| A4 | CH2_IN- | External differential input negative for channel 2 - isolated from CH1 pins to prevent cross-talk between protected lanes. |
| B1 | GND_CH1 | Dedicated ground return for channel 1 - provides low-inductance path for ESD current, electrically separated from B2 to avoid coupling. |
| B2 | GND_CH2 | Dedicated ground return for channel 2 - enables independent grounding for multi-lane systems without shared impedance. |
| C1 | CH1_OUT+ | Internal differential output positive for channel 1 - connects to SoC-side trace with minimal stub length to preserve eye diagram integrity. |
| C2 | CH1_OUT- | Internal differential output negative for channel 1 - forms tightly coupled pair with C1 to maintain differential impedance. |
| C3 | CH2_OUT+ | Internal differential output positive for channel 2 - routed adjacent to C4 to minimize skew and ensure <0.1 ps/lane timing mismatch. |
| C4 | CH2_OUT- | Internal differential output negative for channel 2 - completes second protected differential path to host controller or PHY. |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Direct replacement for PCMF2USB3S common-mode filters - eliminates PCB redesign when switching between filtering + ESD and ESD-only protection. |
| TrEOS clamping process | Enables snap-back behavior with sub-10 V clamping voltage under ±15 kV ESD - protects 28 nm/16 nm SoCs without latch-up risk. |
| Ultra-low capacitance | 0.45 pF per line - reduces signal attenuation and jitter accumulation in 10 Gbps USB 3.2 Gen 2 links. |
| High-frequency bandwidth | 17 GHz f-3dB - ensures flat insertion loss response across full USB 3.2 and HDMI 2.0 spectral content. |
| Multi-channel isolation | Separate GND pins (B1/B2) and physically decoupled bump arrays - prevents ESD energy coupling between differential lanes. |
Applications
| USB 3.2 Gen 2 Interface | HDMI 2.0 Source Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs at the USB Type-C receptacle on a laptop motherboard. IC Role / Device Role / Timing Role: Bidirectional ESD shunt placed between connector and USB 3.2 controller PHY, preserving 10 Gbps eye opening. Use Value: Maintains <0.4 dB insertion loss at 5 GHz and passes USB-IF compliance testing with ±15 kV contact discharge applied to exposed pins. |
Use Scenario: Shielding TMDS clock and data channels on an HDMI 2.0 source board before the edge connector. IC Role / Device Role / Timing Role: Dual-channel ESD clamp on three differential pairs (clock + two data lanes), with separate ground returns per channel. Use Value: Prevents HDMI sink IC damage during hot-plug events while retaining >6 Gbps signal fidelity per lane per eye diagram validation. |
| MIPI D-PHY CSI-2 Camera Link | DisplayPort 1.4 Main Link |
|
Use Scenario: ESD hardening of camera module flex cable interface on smartphone mainboard. IC Role / Device Role / Timing Role: Two-channel protection on MIPI D-PHY data lanes (CLK+/CLK−, DATA+/DATA−), placed adjacent to image sensor connector. Use Value: Enables 2.5 Gbps per lane operation with <0.1 UI jitter increase and passes IEC 61000-4-2 Level 4 system-level testing. |
Use Scenario: Protecting DisplayPort 1.4 main link differential pairs on a docking station PCB. IC Role / Device Role / Timing Role: Dual-channel ESD guard on two of four DP lanes (e.g., Lane 0 + Lane 1), with dedicated ground vias per channel. Use Value: Sustains 8.1 Gbps per lane (HBR3) with <–35 dB crosstalk at 4 GHz and no measurable eye closure in compliance test fixtures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel high-speed differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2EUSB30DR | 0.5 pF capacitance, ±12 kV ESD rating, SOIC-8 package (3.0 mm × 3.0 mm) | Requires PCB real estate increase >10× and introduces 2× higher parasitic inductance due to wire-bond leads | Select when board space allows larger package and legacy SOIC assembly is preferred over WLCSP reflow. |
| ESD56201D05 | 0.35 pF capacitance, ±20 kV ESD rating, WLCSP10 but with non-identical pinout (GND pins shared) | Lacks independent GND pins → higher inter-channel coupling risk in multi-lane routing | Select only if system-level ESD margin exceeds ±15 kV and ground sharing is acceptable for target layout. |
Compared with TPD2EUSB30DR and ESD56201D05, PESD2USB3SZ offers optimal trade-off of ultra-low capacitance, dual independent grounds, and industry-standard WLCSP10 footprint - making it preferred for space-constrained, multi-gigabit designs requiring strict channel isolation and minimal signal distortion.
Availability
PESD2USB3SZ is available at Aetrix Electronics and suitable for USB 3.2 Gen 2 host ports, HDMI 2.0 source boards, and MIPI D-PHY camera modules requiring stable component supply across automotive infotainment, industrial tablet, and consumer mobile platforms.
Supply support for PESD2USB3SZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete, logic, and MOSFET solutions for high-volume applications.
The PESDxUSB3S series was developed specifically for ESD-hardened high-speed serial interfaces - targeting USB, HDMI, MIPI, and DisplayPort implementations where signal integrity and compact packaging are critical design constraints.
FAQ
Is PESD2USB3SZ compatible with USB Type-C connectors supporting both USB 3.2 and USB 2.0?
Yes - PESD2USB3SZ protects only the SuperSpeed differential lanes (TX/RX) and is fully compatible with USB Type-C layouts. It does not interfere with USB 2.0 D+/D− lines, which require separate ESD protection. Its 17 GHz bandwidth and 0.45 pF capacitance ensure no degradation of USB 3.2 Gen 2 (10 Gbps) eye diagrams, as validated in Nexperia's reference test boards.
What is the significance of separate GND pins (B1 and B2) in the WLCSP10 package?
Separate GND pins provide independent low-inductance return paths for each differential channel, preventing ESD current from one channel from coupling into another via shared ground impedance. This isolation is critical for maintaining signal integrity in multi-lane interfaces like HDMI 2.0 (three data lanes + clock) or dual-lane USB 3.2 implementations, and is confirmed in TDR measurements showing <0.5 Ω mutual ground impedance.
Can PESD2USB3SZ be used for HDMI 2.0 sink-side protection?
No - PESD2USB3SZ is optimized for source-side placement where ESD stress originates externally (e.g., cable plug insertion). Sink-side protection requires different clamping thresholds and transient response characteristics. Nexperia recommends PESD3USB3S for HDMI 2.0 sink applications needing three-channel coverage, or dedicated sink-optimized devices like PUSB3FR for asymmetric voltage handling.
Does the snap-back behavior of PESD2USB3SZ pose reliability risks during normal operation?
No - snap-back occurs only during ESD transients exceeding 6–9 V breakdown voltage and lasts <100 ns. Under normal 0–5 V signaling (e.g., USB 3.1 common-mode ~1.2 V), the device remains in high-impedance state with <100 nA leakage. The datasheet explicitly prohibits connection to unlimited DC sources - a design constraint, not an operational failure mode.
PESD2USB3SZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (1.57x1.17)
PESD2USB3SZ FAQ
1.How can I place an order for PESD2USB3SZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD2USB3SZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD2USB3SZ reliable?
The price and inventory of PESD2USB3SZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD2USB3SZ is usually 5 days.
3.What payment methods are accepted for PESD2USB3SZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD2USB3SZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD2USB3SZ?
PESD2USB3SZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD2USB3SZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD2USB3SZ?
For technical support, including PESD2USB3SZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD2USB3SZ requirements.
6.How does Aetrix verify that PESD2USB3SZ is sourced from the original manufacturer or authorized distributors?
All PESD2USB3SZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD2USB3SZ meets industry standards.
7.What is the process for return or replacement of PESD2USB3SZ?
All PESD2USB3SZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD2USB3SZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD2USB3SZ part is unused and in its original packaging.
Return procedure for PESD2USB3SZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD2USB3SZ Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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