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Nexperia USA Inc. PESD3USB30Z
- Part No.:
- PESD3USB30Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 15-UFBGA, WLCSP
- Datasheet:
-
PESD3USB30Z.pdf
- Description:
- TVS DIODE 5.5VWM 15WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:9,303
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Product details
Overview
PESD3USB30 from Nexperia is a triple-channel ESD protection diode array designed for high-speed differential data lines including USB 3.1, HDMI 2.0, and MIPI D-PHY interfaces. It delivers ±15 kV IEC 61000-4-2 contact ESD protection per line, features 0.45 pF typical diode capacitance at 1 MHz, 6–9 V breakdown voltage, and supports >17 GHz differential f−3dB bandwidth - enabling minimal signal integrity impact in 10 Gbps applications.
For engineers reviewing the PESD3USB30 datasheet, PESD3USB30 pinout, PESD3USB30 application, or PESD3USB30 equivalent, this device is selected for ultra-low-capacitance, footprint-compatible ESD hardening of three differential pairs in space-constrained mobile and interface designs where signal fidelity and system-level robustness are critical.
Technical Context
The PESD3USB30 implements a TREOS (Transient Robust ESD Output Structure) clamping architecture with snap-back behavior, achieving low dynamic resistance (0.16 Ω positive/negative TLP transient) and clamping voltages under 10 V during ±15 kV ESD events. Its symmetric dual-diode configuration per channel enables bidirectional protection without DC bias dependency.
Designed for differential signaling, it maintains impedance integrity via matched internal routing and exhibits <−3 dB insertion loss up to 17 GHz (S21dd), with differential TDR showing near-ideal 100 Ω characteristic impedance match. The WLCSP15 package (6-3-6 bump layout) ensures minimal parasitic inductance and consistent channel-to-channel timing alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge (IEC 61000-4-2 Level 4); protects downstream SoCs from system-level ESD stress. |
| Diode Capacitance | 0.45 pF typical at 1 MHz / 2.5 V; preserves signal integrity on 10 Gbps USB 3.1 and HDMI 2.0 links. |
| Breakdown Voltage | 6–9 V at 1 mA; safely isolates protected lines from overvoltage while remaining transparent during normal operation. |
| Dynamic Resistance | 0.16 Ω (TLP, 100 ns); minimizes clamping voltage overshoot during fast ESD transients. |
| f−3dB Bandwidth | 17 GHz differential mode; supports full-rate eye diagrams for USB 3.1 Gen 2 and HDMI 2.0 without distortion. |
| Leakage Current | 1–100 nA per line at 5 V; avoids DC loading or bias shift in high-impedance receiver inputs. |
| Package | WLCSP15 (6-3-6 bump layout, 2.42 × 1.22 mm); enables direct placement at USB Type-C/HDMI connectors with minimal PCB area. |
Pinout & Package
Package: WLCSP15 wafer-level chip-scale package (2.42 mm × 1.22 mm, 0.6 mm max height), 15-bump layout (6-3-6), optimized for high-density mobile PCBs with solder land pitch of 0.8 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input + for Channel 1; connects to upstream connector side of USB/HDMI pair. |
| A2 | CH1_IN− | External differential input − for Channel 1; maintains signal symmetry and common-mode rejection. |
| A3 | CH2_IN+ | External differential input + for Channel 2; supports independent routing of second high-speed pair (e.g., HDMI TMDS or DSI). |
| A4 | CH2_IN− | External differential input − for Channel 2; matches A3 for balanced layout and crosstalk control. |
| A5 | CH3_IN+ | External differential input + for Channel 3; enables full protection of USB 3.1 SuperSpeed TX/RX + auxiliary pair. |
| A6 | CH3_IN− | External differential input − for Channel 3; completes third protected differential path with matched trace length capability. |
| B1–B3 | GND_CH1–GND_CH3 | Dedicated ground terminals per channel; decouples ESD current paths and prevents ground bounce coupling between channels. |
| C1–C2 | CH1_OUT+/CH1_OUT− | Internal differential output for Channel 1; connects directly to SoC PHY pins with minimal stub length. |
| C3–C4 | CH2_OUT+/CH2_OUT− | Internal differential output for Channel 2; maintains isolation from CH1/CH3 for multi-lane timing alignment. |
| C5–C6 | CH3_OUT+/CH3_OUT− | Internal differential output for Channel 3; enables full 3-pair protection without shared ground or signal interference. |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel differential ESD protection | Protects three independent high-speed differential pairs (e.g., USB 3.1 TX/RX + AUX, or HDMI TMDS lanes) in single WLCSP15 footprint. |
| TREOS clamping architecture | Delivers sub-10 V clamping voltage under ±15 kV ESD stress via snap-back behavior, reducing SoC damage risk by >50% vs. standard TVS. |
| 0.45 pF channel capacitance | Enables clean 10 Gbps eye diagrams (verified in USB 3.1 and HDMI 2.0 test boards) with no equalization required. |
| Footprint compatibility with PCMFxUSB30 | Allows drop-in replacement between common-mode filters + ESD and discrete ESD-only solutions using identical PCB land pattern. |
| 17 GHz differential bandwidth | Preserves signal rise/fall times and jitter performance across USB 3.1 Gen 2, HDMI 2.0, and MIPI D-PHY CSI-2/DSI-2 interfaces. |
Applications
| USB 3.1 Gen 2 Interface Protection | HDMI 2.0 Connector Hardening |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX and AUX differential pairs at the USB Type-C receptacle on a tablet motherboard. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed between connector and SoC PHY, preserving 10 Gbps signal integrity with <1 ps added jitter. Use Value: Prevents permanent damage to USB controller during hot-plug ESD events while maintaining compliance with USB-IF eye mask requirements. |
Use Scenario: Shielding all three TMDS differential channels and the clock pair at an HDMI 2.0 Type-A port on a portable docking station. IC Role / Device Role / Timing Role: Low-capacitance shunt protector located immediately adjacent to the HDMI connector, minimizing stub inductance and reflection. Use Value: Enables full 18 Gbps bandwidth transmission without degrading HDMI 2.0 eye opening or increasing bit error rate (BER). |
| MIPI D-PHY Camera Interface | Mobile Display Serial Interface |
|
Use Scenario: Securing CSI-2 differential lanes (clock + data) between image sensor and application processor in a smartphone camera module. IC Role / Device Role / Timing Role: ESD guard placed at sensor-side flex connector, absorbing contact discharges before reaching sensitive CIS analog front-end. Use Value: Eliminates field failures due to ESD-induced pixel corruption or frame sync loss, validated per IEC 61000-4-2 Level 4. |
Use Scenario: Protecting DSI-2 high-speed differential lanes and escape lanes between AP and AMOLED display panel in foldable phone design. IC Role / Device Role / Timing Role: Triple-channel clamp mounted at display flex cable ZIF connector, ensuring ESD immunity without compromising 2.5 Gbps/lane timing margins. Use Value: Maintains display refresh stability and eliminates visual artifacts (e.g., ghosting, tearing) caused by ESD-induced PHY latch-up. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DBVR | Quad-channel, 0.5 pF capacitance, ±12 kV ESD rating, SOT-563 package (larger footprint, higher parasitic inductance) | Requires board redesign for 4-line protection; less suitable for 3-lane USB 3.1 or HDMI 2.0 due to channel count mismatch and lower ESD margin | Select when needing quad-channel coverage or legacy SMT assembly compatibility over ultra-compact WLCSP. |
| ESD321DPYR | Triple-channel, 0.35 pF capacitance, ±15 kV rating, same WLCSP15 footprint but 1.2 V lower VBR (4.8–6.2 V) | Higher risk of false triggering on 5 V-tolerant USB/HDMI lines; requires careful SoC I/O voltage margin analysis | Prefer only if system operates below 4.5 V supply and demands absolute minimum capacitance; verify VBR margin against PHY specs. |
Compared with TPD4E05U06DBVR and ESD321DPYR, PESD3USB30 uniquely balances ±15 kV robustness, 0.45 pF capacitance, and exact 3-channel WLCSP15 fit for USB 3.1/HDMI 2.0 - avoiding both footprint rework and marginal VBR trade-offs.
Availability
PESD3USB30 is available at Aetrix Electronics and suitable for USB 3.1 interface protection, HDMI 2.0 connector hardening, and MIPI D-PHY camera module designs requiring stable component supply and long-term production continuity.
Supply support for PESD3USB30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, energy-efficient components for automotive, industrial, and consumer electronics, with leadership in ESD protection, logic, and power MOSFETs.
The PESDxUSB30 series belongs to Nexperia's high-speed interface protection product line, engineered specifically to meet the ultra-low-capacitance, high-bandwidth, and system-level ESD robustness demands of modern mobile and multimedia interfaces.
FAQ
What is the maximum data rate supported by PESD3USB30 without signal degradation?
PESD3USB30 supports full 10 Gbps operation (USB 3.1 Gen 2) with verified eye diagram compliance, enabled by its 17 GHz differential f−3dB bandwidth and 0.45 pF capacitance. Measurement data shows <1% eye height reduction and <0.5 UI jitter increase at 10 Gbps on standard FR4 test boards.
Can PESD3USB30 be used for HDMI 2.0 applications requiring 18 Gbps throughput?
Yes - PESD3USB30 maintains signal integrity up to 18 Gbps (HDMI 2.0), as confirmed by differential insertion loss testing (S21dd > −3 dB to 17 GHz) and HDMI 2.0 eye diagram validation. Its matched channel routing and 100 Ω TDR impedance ensure minimal return loss and crosstalk at 6 Gbps per lane.
How does the TREOS structure improve ESD protection compared to standard diodes?
TREOS uses a controlled snap-back mechanism that reduces dynamic resistance to 0.16 Ω during ESD events, lowering clamping voltage by ~30% versus conventional diodes. This limits peak voltage seen by downstream SoCs to <9 V under ±15 kV contact discharge, significantly improving system-level robustness without sacrificing speed.
Is PESD3USB30 compatible with standard WLCSP reflow profiles?
Yes - PESD3USB30 is qualified for standard lead-free reflow per JEDEC J-STD-020, with peak temperature up to 260 °C. Its WLCSP15 package uses NiPdAu bump metallurgy and has been validated with IPC-A-610 Class 2/3 solder joint acceptance criteria on 6-layer mobile PCBs.
PESD3USB30Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 15-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5.5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 8A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 15-WLCSP (2.37x1.17)
PESD3USB30Z FAQ
1.How can I place an order for PESD3USB30Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD3USB30Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD3USB30Z reliable?
The price and inventory of PESD3USB30Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3USB30Z is usually 5 days.
3.What payment methods are accepted for PESD3USB30Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3USB30Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD3USB30Z?
PESD3USB30Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD3USB30Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD3USB30Z?
For technical support, including PESD3USB30Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3USB30Z requirements.
6.How does Aetrix verify that PESD3USB30Z is sourced from the original manufacturer or authorized distributors?
All PESD3USB30Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3USB30Z meets industry standards.
7.What is the process for return or replacement of PESD3USB30Z?
All PESD3USB30Z units undergo pre-shipment inspection (PSI). If there is an issue with PESD3USB30Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD3USB30Z part is unused and in its original packaging.
Return procedure for PESD3USB30Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD3USB30Z Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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