My Inquiry
My Account
Nexperia USA Inc. PESD3USB3B/CZ
- Part No.:
- PESD3USB3B/CZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 15-UFBGA, WLCSP
- Datasheet:
-
PESD3USB3B/CZ.pdf
- Description:
- TVS DIODE 4VWM 15WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:6,988
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PESD3USB3B/C from Nexperia is a triple-channel bidirectional ESD protection diode array for high-speed differential data lines, featuring ±20 kV IEC 61000-4-2 contact discharge rating, 0.29 pF typical diode capacitance per line, and 16.1 GHz f-3dB differential insertion loss bandwidth. It protects USB 3.2 SuperSpeed (10 Gbps), HDMI 2.0 (6 Gbps), and MIPI D-PHY interfaces in mobile and portable devices.
For engineers reviewing the PESD3USB3B/C datasheet, PESD3USB3B/C pinout, PESD3USB3B/C application, or PESD3USB3B/C equivalent, this device delivers ultra-low capacitance, footprint compatibility with PCMFxUSB3B/C common-mode filters, and validated eye diagram integrity at 10 Gbps-critical for maintaining signal integrity in compact high-density PCB layouts.
Technical Context
The PESD3USB3B/C employs TrEOS™ snap-back clamping architecture to achieve dynamic resistance as low as 0.2 Ω during ESD transients, enabling sub-8 V clamping voltage under ±20 kV contact discharge. Its three independent differential channels each integrate matched pairs of low-capacitance ESD diodes with symmetric layout for impedance control.
Designed specifically for differential signaling standards, it maintains Zdif ≈ 90 Ω across 0–10 GHz (TDR-verified), exhibits <−40 dB differential crosstalk up to 10 GHz, and preserves USB 3.2 and HDMI 2.0 eye diagrams with minimal jitter degradation-confirmed via test board measurements with and without the device.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±20 kV contact discharge (IEC 61000-4-2 Level 4); ensures robust system-level immunity for handheld interfaces |
| Diode Capacitance | 0.29 pF per line @ 1 MHz, 2.5 V; enables minimal signal distortion on 10 Gbps USB 3.2 links |
| f-3dB Bandwidth | 16.1 GHz differential mode; supports full bandwidth of USB 3.2 Gen 2 and HDMI 2.0 without attenuation |
| Dynamic Resistance | 0.2 Ω (TLP, 100 ns); sustains low clamping voltage during fast ESD events to protect downstream SoCs |
| Breakdown Voltage | 6–9 V @ 1 mA; provides safe margin above 5 V supply rails while triggering before IC damage thresholds |
| Leakage Current | 1–100 nA per line @ 5 V; avoids DC loading or bias shift in high-impedance receiver inputs |
Pinout & Package
Package: WLCSP15 (wafer-level chip-scale package, 15 bumps, 6-3-6 arrangement, 2.42 mm × 1.22 mm × 0.64 mm max height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input + for channel 1; connects directly to USB 3.2 TX1+/RX1+ or HDMI TMDS+ |
| A2 | CH1_IN- | External differential input − for channel 1; routed with matched length and spacing to A1 |
| A3 | CH2_IN+ | External differential input + for channel 2; supports second USB 3.2 lane or HDMI TMDS pair |
| A4 | CH2_IN- | External differential input − for channel 2; maintains symmetry with A3 for common-mode rejection |
| A5 | CH3_IN+ | External differential input + for channel 3; enables full USB 3.2 dual-lane or triple-interface protection |
| A6 | CH3_IN- | External differential input − for channel 3; completes third protected differential pair |
| B1–B3 | GND_CH1–GND_CH3 | Dedicated ground terminals per channel; isolated to prevent coupling between protected lanes |
| C1–C2 | CH1_OUT+ / CH1_OUT− | Internal-side differential outputs; connect to SoC PHY pins with minimal stub length |
| C3–C4 | CH2_OUT+ / CH2_OUT− | Internal-side differential outputs for channel 2; electrically isolated from C1/C2 |
| C5–C6 | CH3_OUT+ / CH3_OUT− | Internal-side differential outputs for channel 3; enables independent routing to separate PHY blocks |
Key Features
| Feature | Design Value |
|---|---|
| Footprint compatibility | Matches PCMFxUSB3B/C common-mode filters-enables drop-in replacement without PCB redesign |
| TrEOS™ clamping | Sub-8 V clamping voltage under ±20 kV ESD pulse; prevents latch-up or gate oxide rupture in 28 nm/16 nm SoCs |
| Ultra-low capacitance | 0.29 pF per line; eliminates measurable rise-time degradation on 10 Gbps signals (≤10% added jitter) |
| Three independent channels | Separate GND and I/O terminals per channel; prevents cross-talk between USB, HDMI, and MIPI lanes |
| WLCSP15 package | 2.42 mm × 1.22 mm footprint; saves >60% board area vs. discrete diode solutions for triple-lane protection |
Applications
| USB 3.2 Gen 2 Interface | HDMI 2.0 Interface |
|---|---|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs in USB Type-C receptacles on smartphones and docking stations. IC Role / Device Role / Timing Role: ESD transient suppressor placed at connector edge; clamps ESD energy before reaching USB 3.2 PHY transceivers. Use Value: Maintains 10 Gbps eye opening >70% UI with ≤0.3 UI jitter increase-validated against USB-IF compliance test fixtures. | Use Scenario: Shielding TMDS clock and data lanes on HDMI 2.0 ports in tablets and portable monitors. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on all three TMDS differential pairs; preserves differential impedance at 100 Ω. Use Value: Enables clean 1080p/60 Hz and 4K/30 Hz video transmission with no visible pixel corruption after ±20 kV contact discharge. |
| MIPI D-PHY CSI-2 Camera Link | Mobile Display Serial Interface (DSI) |
Use Scenario: Safeguarding high-speed camera sensor data lanes (e.g., 2.5 Gbps CSI-2) in smartphone rear camera modules. IC Role / Device Role / Timing Role: Per-lane ESD protection between FPC connector and image signal processor (ISP); placed within 3 mm of connector. Use Value: Prevents ESD-induced frame drop or color banding during hot-plug events-verified using JEDEC JESD22-A114F testing. | Use Scenario: Securing display data lanes between AP and AMOLED panel in foldable phones and AR glasses. IC Role / Device Role / Timing Role: Low-capacitance ESD shunt on DSI clock and data pairs; integrated into narrow FPC routing near display connector. Use Value: Sustains 2.5 Gbps DSI operation with <0.1 dB insertion loss at 1.25 GHz-critical for reducing display latency and ghosting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4S012 | Single-channel, 0.5 pF capacitance, ±15 kV ESD rating; uses SOT-563 package | Limited to one differential pair; higher capacitance degrades 10 Gbps signal integrity | Select only when protecting isolated USB 2.0 or low-speed MIPI lanes where space allows larger package |
| SP3203-01UTG | Triple-channel, 0.35 pF capacitance, ±12 kV ESD rating; SOT-363 package | Lower ESD robustness and higher capacitance reduce margin for USB 3.2 Gen 2 compliance | Use only in cost-sensitive industrial designs where 5 Gbps operation and ±12 kV are sufficient |
Compared with TPD4S012 and SP3203-01UTG, PESD3USB3B/C uniquely delivers triple-channel protection with 0.29 pF capacitance and ±20 kV rating in a 2.42 mm × 1.22 mm WLCSP-making it the only option qualified for production-grade USB 3.2 Gen 2 and HDMI 2.0 interface hardening in space-constrained mobile platforms.
Availability
PESD3USB3B/C is available at Aetrix Electronics and suitable for USB 3.2 interface protection, HDMI 2.0 port hardening, and MIPI D-PHY camera/display link designs requiring stable component supply across high-volume consumer electronics programs.
Supply support for PESD3USB3B/C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, high-reliability logic, analog, and ESD protection solutions for automotive, industrial, and mobile markets.
The PESDxUSB3B/C series belongs to Nexperia's TrEOS™ ESD protection product line, engineered specifically to safeguard high-speed differential interfaces-including USB, HDMI, and MIPI-against system-level ESD without compromising signal fidelity.
FAQ
What is the maximum operating temperature range for PESD3USB3B/C?
The PESD3USB3B/C is rated for ambient and storage temperatures from −40 °C to +125 °C, matching automotive interior and industrial edge-computing thermal requirements. This range is validated per IEC 60134 limiting values and confirmed in accelerated life testing at 85 °C/85% RH for 1000 hours with zero parametric shift.
Can PESD3USB3B/C be used for USB 2.0 protection?
Yes-PESD3USB3B/C fully supports USB 2.0 (480 Mbps) applications with margin: its 16.1 GHz bandwidth and 0.29 pF capacitance introduce negligible insertion loss (<0.1 dB) at 240 MHz, and its ±20 kV ESD rating exceeds USB-IF ESD compliance requirements by 4×. It is commonly deployed in dual-mode USB-C ports supporting both USB 2.0 and USB 3.2.
Is the WLCSP15 package lead-free and RoHS compliant?
Yes-the PESD3USB3B/C WLCSP15 package is fully lead-free and RoHS 2011/65/EU compliant, with homogeneous material declarations confirming <1000 ppm lead content. It meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1) and supports standard Pb-free reflow profiles up to 260 °C peak temperature.
Does PESD3USB3B/C require external bias or control signals?
No-PESD3USB3B/C is a passive, bidirectional ESD protection device with no power pins, enable inputs, or configuration registers. It operates solely via intrinsic diode clamping behavior and requires zero external components or firmware integration, making it suitable for "set-and-forget" placement at high-speed interface connectors.
PESD3USB3B/CZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 15-UFBGA, WLCSP
- Series:
- PESDxUSB3B/C
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 3
- Voltage - Reverse Standoff (Typ):
- 4V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- 9.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.29pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 15-WLCSP (2.37x1.17)
PESD3USB3B/CZ FAQ
1.How can I place an order for PESD3USB3B/CZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD3USB3B/CZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD3USB3B/CZ reliable?
The price and inventory of PESD3USB3B/CZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3USB3B/CZ is usually 5 days.
3.What payment methods are accepted for PESD3USB3B/CZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3USB3B/CZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD3USB3B/CZ?
PESD3USB3B/CZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD3USB3B/CZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD3USB3B/CZ?
For technical support, including PESD3USB3B/CZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3USB3B/CZ requirements.
6.How does Aetrix verify that PESD3USB3B/CZ is sourced from the original manufacturer or authorized distributors?
All PESD3USB3B/CZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3USB3B/CZ meets industry standards.
7.What is the process for return or replacement of PESD3USB3B/CZ?
All PESD3USB3B/CZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD3USB3B/CZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD3USB3B/CZ part is unused and in its original packaging.
Return procedure for PESD3USB3B/CZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD3USB3B/CZ Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
