Nexperia USA Inc. PESD3USB3S/CX

Overview

PESD3USB3S from Nexperia is a triple-channel ESD protection diode array for high-speed differential data lines, providing ±15 kV IEC 61000-4-2 contact discharge protection per line, 0.45 pF typical diode capacitance at 1 MHz, and 17 GHz f_-3dB differential insertion loss cutoff - deployed in USB 3.1/3.2, HDMI 2.0, and MIPI D-PHY interfaces on smartphones and tablets.

For engineers reviewing the PESD3USB3S datasheet, PESD3USB3S pinout, PESD3USB3S application, or PESD3USB3S equivalent, this device supports high-fidelity signal integrity in 10 Gbps SuperSpeed USB and 6 Gbps HDMI 2.0 links while maintaining footprint compatibility with PCMFxUSB3S common-mode filters.

Technical Context

The PESD3USB3S implements a TrEOS clamping architecture with snap-back behavior, delivering dynamic resistance of 0.16 Ω (TLP, 100 ns) and 0.25 Ω (IEC 61000-4-5, 8/20 μs), enabling ultra-low clamping voltage during ESD transients. Its three independent differential channels each feature matched input/output paths with dedicated ground terminals (B1–B3).

Designed for minimal signal distortion, it achieves <−7 dB differential insertion loss up to 10 GHz and maintains differential impedance near 90 Ω (typical TDR), with cross-talk suppression >−60 dB between adjacent channel pairs - critical for simultaneous USB3 + HDMI + DSI routing on compact mobile PCBs.

Key Specifications

Pinout & Package

Package: WLCSP15 wafer-level chip-scale package (2.42 mm × 1.22 mm, 0.38 mm height), 15-bump layout (6-3-6), solder land size 0.25 mm × 0.25 mm, stencil aperture 0.325 mm × 0.325 mm, recommended stencil thickness 0.1 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar differential ESD protection applications.

Compared with TPD4S012RGER and ESD321DPYR, PESD3USB3S uniquely combines per-channel ground isolation, 17 GHz bandwidth, and WLCSP15 footprint - making it optimal for space-constrained, multi-gigabit consumer electronics where signal fidelity and ESD robustness must coexist.

Availability

PESD3USB3S is available at Aetrix Electronics and suitable for smartphone, tablet, and USB-C docking station designs requiring stable component supply, consistent WLCSP15 sourcing, and long-term lifecycle support for high-volume production.

Supply support for PESD3USB3S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, reliable essential semiconductors for automotive, industrial, and mobile markets, with leadership in ESD protection and logic solutions.

The PESDxUSB3S series belongs to Nexperia's TrEOS ESD protection product line, engineered specifically for high-speed differential interfaces like USB3.x, HDMI, and MIPI - prioritizing ultra-low capacitance, multi-channel isolation, and system-level robustness.

FAQ

What is the maximum data rate supported by PESD3USB3S without signal degradation?

PESD3USB3S supports 10 Gbps USB 3.2 Gen 2 and 6 Gbps HDMI 2.0 without measurable eye closure, validated by manufacturer test data (Fig. 4 and Fig. 6). Its 17 GHz f_-3dB cutoff and 0.45 pF capacitance ensure <0.1 UI jitter addition and >30% eye margin at full speed.

Can PESD3USB3S be used for single-ended signals like USB2.0 D+/D−?

No - PESD3USB3S is designed exclusively for differential signaling. Its pinout and internal structure require matched +/− pairs (e.g., CH1_IN+/IN−) and dedicated ground bumps per channel. For USB2.0, use PESD5V0S1BA or similar single-ended ESD arrays.

How does the TrEOS snap-back mechanism improve protection compared to standard TVS diodes?

TrEOS delivers dynamic resistance as low as 0.16 Ω during ESD pulses, reducing clamping voltage by >40% versus conventional TVS. This prevents overvoltage stress on 1.2 V/1.8 V PHY receivers and eliminates latch-up risk - confirmed by TLP characterization (Fig. 8–9) and 10,000-strike reliability testing.

Is PCB layout guidance available for minimizing impedance discontinuity with WLCSP15?

Yes - Nexperia provides exact solder land (0.25 mm × 0.25 mm), stencil aperture (0.325 mm × 0.325 mm), and keep-out dimensions in Fig. 17 and Fig. 20. Critical practices include symmetric trace routing, avoiding vias under the package, and placing ground stitching vias within 0.5 mm of each B1/B2/B3 bump to maintain return path integrity.